JPS5858938A - Manufacture of case for high frequency circuit - Google Patents

Abstract

PURPOSE:To manufacture a case for high frequency circuit inexpensively by thick covering the surface of a material uniformly, by plating and press working the material and thereby forming a uniform thick metallic layer. CONSTITUTION:A thick copper layer 4 is formed by wet electroplating i.e. copper sulfate plating on a material 5. Then, press working such as punching, bending etc. is performed and seams 6 are joined by, for instance, soldering to assemble a case. Next, as final processing, a thin silver layer 8 excellent in high frequency conductivity is formed on the case assembly by wet electroplating. Since a metallic layer is formed prior to press working, a uniform metallic layer is formed.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of manufacturing a case for a high frequency circuit, which requires the formation of a metal layer to achieve uniform thickness.

Conventionally, in cases for high-frequency circuits, it is essential to minimize transmission loss of the high-frequency circuit caused by changes in electrical characteristics caused by high-frequency current flowing inside the case.

Therefore, in a case for a high frequency circuit, it is necessary to form a metal layer having a uniform thickness and having a low electrical resistance value depending on the frequency and the flowing current.

According to this, the method of forming a metal layer uniformly over the entire surface of this type of case, for example, the case assembly 1 as shown in FIG. After pre-pressing, a method using a general wet electroplating tank 2 as shown in Fig. 2, a method using an auxiliary electrode 3 as shown in Fig. 3, or electroless plating is applied. (not shown) was adopted. In such conventional methods, 1) In the case of widely known wet electroplating, when the shape of the material is uneven, uniform electrodeposition over the entire surface is poor;
A non-uniform copper layer 4 is formed on the case assembly 1 as shown in FIG.

2) When using an auxiliary electrode, the shape, material,
It is difficult to determine conditions such as the distance between electrodes, and it requires time to prepare all equipment during plating, and costs are high due to consumption of materials.

3) When using electroless plating, the deposition rate is generally slow;
The life of the plating solution is short, which makes it expensive.

Additionally, there were drawbacks such as the difficulty in managing the plating solution compared to wet electroplating.

The present invention was developed to eliminate these drawbacks, and when forming a uniformly thick metal layer over the entire case surface, the material surface must be plated with a uniformly thick layer of copper, for example. By pressing this material, it is possible to form a metal layer with a uniform thickness, and to provide a method of manufacturing a case for a high frequency circuit, which can be manufactured at low cost.

Hereinafter, embodiments of the present invention will be described in detail with reference to FIGS. 5 to 9.

First, the steel plate (S
As shown in FIG. 6, a thick copper layer 4 is formed on a material 5 such as PC by copper sulfate plating, which is a wet electroplating process. After that, as shown in Fig. 7, press working such as punching and bending is performed to assemble the case. Next, as shown in FIG. 8, a thin silver layer 8 having excellent high frequency conductivity is formed by wet electroplating on the assembled case assembly 2 as a final treatment. It has good properties and is also effective in preventing rust.

As described above, in the embodiment of the present invention, a uniform metal layer can be formed because the metal layer is formed before pressing, compared to the conventional method in which plating is performed after pressing. Therefore, no matter how deep the case 7 is, it is possible to manufacture a case that satisfies the electrical characteristic conditions of the high frequency circuit without any problem. Further, the joining of the joint portion 6 of the case 7 is easy because the base metal layer is formed. This eliminates the need to use an auxiliary electrode, and since electroless plating is not performed, the deposition rate is faster, making it possible to use a wet electroplating method with extremely high workability. .

It is also advantageous in terms of cost.

In the above-mentioned embodiment, the explanation was simply made as a press working method using punching, bending, and bending, but as shown in FIG. 9, after forming a copper layer 4 on the material 5 in advance, drawing You can also use the method to assemble the case. In this case, there is no joining part and the case assembly is integrated, which reduces the cost of assembling the case, and since there is no joining part, it is possible to obtain a case assembly that is advantageous when airtightness is required.

[Brief explanation of the drawing]

Figures 1, 2, 3, and 4 are diagrams for explaining the conventional case manufacturing method. Figure 1 is a diagram of the case assembly before plating treatment, and Figure 2 is a wet method. electroplating process,
Fig. 3 is a plating process diagram using an auxiliary electrode, Fig. 4 is a sectional view after wet electroplating, and Figs. 5, 6, 7, and 8 are diagrams for explaining the present invention in detail. Fig. 5 is a perspective view of the plate material before processing, Fig. 6 is a cross-sectional view after plating, Fig. 7 is a case assembly view, Fig. 8 is a cross-sectional view of the finished product, and Fig. 9 is a cross-sectional view of the plate material before processing. FIG. 3 is a diagram of a drawing process for explaining an example. A, 7... Case assembly, 2... Wet electroplating tank,
3... Auxiliary electrode, 4... Copper layer, 5... Material, 6...
...Joint part, 8...Silver layer, 9...Drawing die.

Claims (2)

[Claims] (1) Uniform thickness can be achieved by applying a thick metal layer to the surface of the material in advance by wet electroplating, and then pressing this material in the manufacturing method for high-frequency circuit cases that requires the formation of a metal layer. A method for manufacturing a case for high frequency circuits featuring good luck. (2) The method for manufacturing a case for a high frequency circuit according to claim (a), wherein the pressing process is a drawing process.