JPS5858938A - Manufacture of case for high frequency circuit - Google Patents

Manufacture of case for high frequency circuit

Info

Publication number
JPS5858938A
JPS5858938A JP56157603A JP15760381A JPS5858938A JP S5858938 A JPS5858938 A JP S5858938A JP 56157603 A JP56157603 A JP 56157603A JP 15760381 A JP15760381 A JP 15760381A JP S5858938 A JPS5858938 A JP S5858938A
Authority
JP
Japan
Prior art keywords
case
high frequency
frequency circuit
layer
plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP56157603A
Other languages
Japanese (ja)
Inventor
Osamu Yamato
修 大和
Masashi Tayama
田山 政志
Kazuhiro Tagawa
田川 和弘
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oki Electric Industry Co Ltd
Original Assignee
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Industry Co Ltd filed Critical Oki Electric Industry Co Ltd
Priority to JP56157603A priority Critical patent/JPS5858938A/en
Publication of JPS5858938A publication Critical patent/JPS5858938A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B21MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21DWORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D51/00Making hollow objects
    • B21D51/16Making hollow objects characterised by the use of the objects

Abstract

PURPOSE:To manufacture a case for high frequency circuit inexpensively by thick covering the surface of a material uniformly, by plating and press working the material and thereby forming a uniform thick metallic layer. CONSTITUTION:A thick copper layer 4 is formed by wet electroplating i.e. copper sulfate plating on a material 5. Then, press working such as punching, bending etc. is performed and seams 6 are joined by, for instance, soldering to assemble a case. Next, as final processing, a thin silver layer 8 excellent in high frequency conductivity is formed on the case assembly by wet electroplating. Since a metallic layer is formed prior to press working, a uniform metallic layer is formed.

Description

【発明の詳細な説明】 本発明は、均一な厚付は金属層の形成を必要とする高周
波回路用ケースの製造方法に関するものである。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of manufacturing a case for a high frequency circuit, which requires the formation of a metal layer to achieve uniform thickness.

従来、高周波回路用ケースにおいては、周知のようにケ
ース内部に流れる高周波電流によシ、電気的特性が変化
することによって生じる高周波回路の伝達損失を最少限
に防ぐことが不可欠である。
Conventionally, in cases for high-frequency circuits, it is essential to minimize transmission loss of the high-frequency circuit caused by changes in electrical characteristics caused by high-frequency current flowing inside the case.

したがって、高周波回路用ケースには、周波数と流れる
電流に応じた電気的抵抗値の低い金属層を均一な厚さに
形成することが必要である。
Therefore, in a case for a high frequency circuit, it is necessary to form a metal layer having a uniform thickness and having a low electrical resistance value depending on the frequency and the flowing current.

これにしたがい、この種のケース、例えば第1図のよう
なケース組立体1の表面全体に均一な厚付は金属層を形
成する方法とし1、従来は、鋼板(SPC)などの素材
をあちかじめプレス加工を行なった後、第2図のような
一般的な湿式の電気鍍金槽2による方法および、これに
第3図のような補助電極3を゛利用した方法、または無
電解鍍金(図示せず)による方法プ;採られていた。こ
のような従来の方法では、 1)広く知られている湿式の電気鍍金の場合、素材の形
状が凹凸表時、表面全体に対しての均一電着性が悪く、
ケース組立体1に対して第4図に示すような均一でない
銅層4が形成されてしまう。
According to this, the method of forming a metal layer uniformly over the entire surface of this type of case, for example, the case assembly 1 as shown in FIG. After pre-pressing, a method using a general wet electroplating tank 2 as shown in Fig. 2, a method using an auxiliary electrode 3 as shown in Fig. 3, or electroless plating is applied. (not shown) was adopted. In such conventional methods, 1) In the case of widely known wet electroplating, when the shape of the material is uneven, uniform electrodeposition over the entire surface is poor;
A non-uniform copper layer 4 is formed on the case assembly 1 as shown in FIG.

2)補助電極を使用した場合、補助電極の形状・材質・
電極間距離などの条件出しが困難であり、また、鍍金時
におゆる装置の準備時間が必要であリ、かつ材料の消耗
などによりコスト高となる。
2) When using an auxiliary electrode, the shape, material,
It is difficult to determine conditions such as the distance between electrodes, and it requires time to prepare all equipment during plating, and costs are high due to consumption of materials.

3)無電解鍍金による場合、一般的に析出速度が遅く、
メッキ液の寿命が短かい、このため高価なものになる。
3) When using electroless plating, the deposition rate is generally slow;
The life of the plating solution is short, which makes it expensive.

また、メッキ液の管理が湿式の電気鍍金に比べて難かし
い等の欠点があった。
Additionally, there were drawbacks such as the difficulty in managing the plating solution compared to wet electroplating.

本発明は、それらの欠点を解消するために表されたもの
で、ケース表面全体に、均一に厚付は金属層を形成する
場合、あらかじめ素材表面に鍍金処理による例えば銅を
均一に厚付けし、ておき、この素材をプレス加工するこ
とにより、均一な厚付は金属層の形成ができ、かつ安価
に製造し得る高周波回路用ケースの製造方法を提供する
ものである。
The present invention was developed to eliminate these drawbacks, and when forming a uniformly thick metal layer over the entire case surface, the material surface must be plated with a uniformly thick layer of copper, for example. By pressing this material, it is possible to form a metal layer with a uniform thickness, and to provide a method of manufacturing a case for a high frequency circuit, which can be manufactured at low cost.

以下、本発明の実施例を第5図〜第9図によって詳細に
説明する。
Hereinafter, embodiments of the present invention will be described in detail with reference to FIGS. 5 to 9.

まず、第5図の鍍金処理およびプレス加工前の鋼板(S
PC)などの素材5に対して、第6図のように湿式の電
気鍍金処理である硫酸銅メッキによシ銅層4を厚付は形
成する。しかる後に、第7図のように抜き、曲げなどの
プレス加工を行ない、ケースを組立てる。次に、組立ら
れたケース組立体2に対し、さらに第8図のように最終
処理として湿式の電気鍍金による薄膜の、高周波導電性
に優れている銀層8を形成することにより、半田付は性
がよシ良くなシ、防錆にも効果的である。
First, the steel plate (S
As shown in FIG. 6, a thick copper layer 4 is formed on a material 5 such as PC by copper sulfate plating, which is a wet electroplating process. After that, as shown in Fig. 7, press working such as punching and bending is performed to assemble the case. Next, as shown in FIG. 8, a thin silver layer 8 having excellent high frequency conductivity is formed by wet electroplating on the assembled case assembly 2 as a final treatment. It has good properties and is also effective in preventing rust.

この様に、本発明の実施例では、従来の方法であるプレ
ス加工後に鍍金処理を行なう場合に比べて、プレス加工
前に金属層を形成するため、均一な金属層を形成するこ
とが出来る。したがって、ケース7の深さがいくら深く
とも問題なく、高周波回路の電気的特性条件を満たすケ
ースを製造することが出来る。また、ケース7の接合部
6の接合は、下地金属層が形成されているため接合作業
が容易である。これによシ、補助電極を使用する必要が
なくなシ、また、無電解鍍金を行なわないから析出速度
が早くなるため、作業性が極めて良い湿式の電気鍍金法
を使用することが出来るので、 。
As described above, in the embodiment of the present invention, a uniform metal layer can be formed because the metal layer is formed before pressing, compared to the conventional method in which plating is performed after pressing. Therefore, no matter how deep the case 7 is, it is possible to manufacture a case that satisfies the electrical characteristic conditions of the high frequency circuit without any problem. Further, the joining of the joint portion 6 of the case 7 is easy because the base metal layer is formed. This eliminates the need to use an auxiliary electrode, and since electroless plating is not performed, the deposition rate is faster, making it possible to use a wet electroplating method with extremely high workability. .

コスト的にも有利となる。It is also advantageous in terms of cost.

前述した実施例では、抜き、曲・げを利用して、単にプ
レス加工法として説明したが、第9図に示すように素材
5に対してあらかじめ例えば銅層4を形成した後、絞シ
加工法を利用してケース組立を行々うことも出来る。こ
の場合、接合部分がなく一体化され、ケース組立のコス
トが安価となり、また、接合部がないため気密を要する
場合に有利なケース組立体を得ることが出来る。
In the above-mentioned embodiment, the explanation was simply made as a press working method using punching, bending, and bending, but as shown in FIG. 9, after forming a copper layer 4 on the material 5 in advance, drawing You can also use the method to assemble the case. In this case, there is no joining part and the case assembly is integrated, which reduces the cost of assembling the case, and since there is no joining part, it is possible to obtain a case assembly that is advantageous when airtightness is required.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図、第2図、第3図および第4図は従来のケースの
製造方法を説明するための図であって、第1図は鍍金処
理前のケース組立体図、第2図は湿式の電気鍍金処理、
第3図は補助電極による鍍金性図、第4図は湿式の電気
鍍金後の断面図、第5図、第6図、第7図および第8図
は本発明の詳細な説明するための図であって、第5図は
加工前の板材斜視図、第6図は鍍金後の断面図、第7図
はケース組立体図、第8図は完成品の断面図、第9図は
他の実施例を説明するための絞シ加工法図゛である。 イ、7・・・ケース組立体、2・・・湿式電気鍍金槽、
3・・・補助電極、4・・・銅層、5・・・素材、6・
・・接合部、8・・・銀層、9・・・絞り型。
Figures 1, 2, 3, and 4 are diagrams for explaining the conventional case manufacturing method. Figure 1 is a diagram of the case assembly before plating treatment, and Figure 2 is a wet method. electroplating process,
Fig. 3 is a plating process diagram using an auxiliary electrode, Fig. 4 is a sectional view after wet electroplating, and Figs. 5, 6, 7, and 8 are diagrams for explaining the present invention in detail. Fig. 5 is a perspective view of the plate material before processing, Fig. 6 is a cross-sectional view after plating, Fig. 7 is a case assembly view, Fig. 8 is a cross-sectional view of the finished product, and Fig. 9 is a cross-sectional view of the plate material before processing. FIG. 3 is a diagram of a drawing process for explaining an example. A, 7... Case assembly, 2... Wet electroplating tank,
3... Auxiliary electrode, 4... Copper layer, 5... Material, 6...
...Joint part, 8...Silver layer, 9...Drawing die.

Claims (2)

【特許請求の範囲】[Claims] (1)均一な厚付は金属層の形成を必要とする高周波回
路用ケースの製造方法において、あらかじめ素材表面に
湿式の電気鍍金処理による金属層を厚付けしておき、こ
の素材をプレス加工すると吉を特徴とする高周波回路用
ケースの製造方法。
(1) Uniform thickness can be achieved by applying a thick metal layer to the surface of the material in advance by wet electroplating, and then pressing this material in the manufacturing method for high-frequency circuit cases that requires the formation of a metal layer. A method for manufacturing a case for high frequency circuits featuring good luck.
(2)  前記プレス加工として、絞り加工することを
特徴とする特許請求の範囲第a)項記載の高周波回路用
ケースの製造方法。
(2) The method for manufacturing a case for a high frequency circuit according to claim (a), wherein the pressing process is a drawing process.
JP56157603A 1981-10-05 1981-10-05 Manufacture of case for high frequency circuit Pending JPS5858938A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56157603A JPS5858938A (en) 1981-10-05 1981-10-05 Manufacture of case for high frequency circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56157603A JPS5858938A (en) 1981-10-05 1981-10-05 Manufacture of case for high frequency circuit

Publications (1)

Publication Number Publication Date
JPS5858938A true JPS5858938A (en) 1983-04-07

Family

ID=15653326

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56157603A Pending JPS5858938A (en) 1981-10-05 1981-10-05 Manufacture of case for high frequency circuit

Country Status (1)

Country Link
JP (1) JPS5858938A (en)

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