JPS5916242A - Manufacturing method of anode plate for magnetron - Google Patents

Manufacturing method of anode plate for magnetron

Info

Publication number
JPS5916242A
JPS5916242A JP12469982A JP12469982A JPS5916242A JP S5916242 A JPS5916242 A JP S5916242A JP 12469982 A JP12469982 A JP 12469982A JP 12469982 A JP12469982 A JP 12469982A JP S5916242 A JPS5916242 A JP S5916242A
Authority
JP
Japan
Prior art keywords
silver
anode
silver soldering
plates
plating treatment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12469982A
Other languages
Japanese (ja)
Inventor
Jinzo Nakagawa
中川 仁蔵
Masahiko Murata
雅彦 村田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electronics Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electronics Corp, Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electronics Corp
Priority to JP12469982A priority Critical patent/JPS5916242A/en
Publication of JPS5916242A publication Critical patent/JPS5916242A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J23/00Details of transit-time tubes of the types covered by group H01J25/00

Abstract

PURPOSE:To efficiently manufacture a number of anode plates with a silver solder layer in the preset silver soldering area of a laminated body and obtain an accurate silver soldering effect and the reduction of manufacturing cost by watertightly covering the exposed surface other than at least the preset silver soldering area of the laminated body with a corrosion resisting coating material and applying silver plating treatment. CONSTITUTION:Corrosion resisting plates 20 and 21 are pressed watertightly on each of the outer surfaces of two metal flat plates 12a and 12z located at the outermost end of a laminated body. Then, a silver layer of about 10mum thick is formed on the exposed surface of the laminated body by inserting such a body structure in a plating treatment container and applying high speed plating treatment. When the plates 20 and 21 and a coating member 16 are removed after plating treatment, since a silver soldering material layer 22 is provided at least in the preset silver soldering area of each metal flat plate, it is arranged in an anode cylindrical body as an anode plate. In addition, when a required mean pressure ring and a conductor for inducing an electromagnetic wave are built in at the preset position and the silver soldering material layer 22 is melted in a furnace, an anode body structure is obtained without using a ring-type silver soldering material.

Description

【発明の詳細な説明】 産業上の利用分野 本発明は、マグネトロンの陽極筒体内に配設されて共振
空洞を形成する陽極板の製造方法に関する。
DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a method for manufacturing an anode plate disposed within an anode cylinder of a magnetron to form a resonant cavity.

従来例の構成とその問題点 マグネトロンの陽極構体は、通常、第1図に示すように
円筒状の陽極筒体1と、陽極筒体1の内周面から中心軸
部へ向って突出する多数の矩形状陽極板22L、2b・
・・・・・と、上部内側均圧環3と、上部外側均圧環4
と、下部内側均圧環6と、下部外側均圧環6と、陽極板
2iLから図外の電磁波放出端イヘ向って突出するアン
テナ状の電磁波導出用導体7とからなる。そして、上部
内側均圧環3および下部外側均圧環6は、一つおきの陽
極板に鑞着され、上部外側均圧環4および下部内側均圧
環6は、残余の陽極板に鑞着される。なお、陽極板21
&、2b・・・・・・は、上部長辺の一端近傍に均圧環
挿入用溝sa、sb・・・・・・を、そして、下部長辺
の一端近傍に均圧環挿入用溝9 a 、 9b’jzそ
れぞれ有している。
Conventional Structure and Problems The anode structure of a magnetron usually includes a cylindrical anode tube 1 and a plurality of tubes protruding from the inner peripheral surface of the anode tube 1 toward the central axis, as shown in FIG. rectangular anode plates 22L, 2b.
..., upper inner pressure equalizing ring 3, and upper outer pressure equalizing ring 4
, a lower inner pressure equalizing ring 6, a lower outer pressure equalizing ring 6, and an antenna-shaped electromagnetic wave deriving conductor 7 protruding from the anode plate 2iL toward an electromagnetic wave emission end (not shown). Then, the upper inner pressure equalizing ring 3 and the lower outer pressure equalizing ring 6 are soldered to every other anode plate, and the upper outer pressure equalizing ring 4 and the lower inner pressure equalizing ring 6 are brazed to the remaining anode plates. In addition, the anode plate 21
&, 2b...... have pressure equalizing ring insertion grooves sa, sb... near one end of the upper long side, and a pressure equalizing ring insertion groove 9a near one end of the lower long side. , 9b'jz respectively.

ところで、前述のような陽極部拐は、通常、銅からなり
、それぞれは銀鑞材を用いて一体に組立てられる。すな
わち、陽極筒体1と陽極板2a。
By the way, the above-mentioned anode parts are usually made of copper, and each part is assembled integrally using silver solder. That is, the anode cylinder 1 and the anode plate 2a.

2b・・・・・・とはリング状の銀鑞材1oによって鑞
着され、陽極板2aと電磁波導出用導体7とはリング状
の銀鑞材11によって鑞着され、陽極板2a。
2b... are soldered together with a ring-shaped silver brazing material 1o, and the anode plate 2a and the electromagnetic wave deriving conductor 7 are soldered together with a ring-shaped silver brazing material 11, forming the anode plate 2a.

2b・・・・・・と均圧環3.4.5.6とは均圧環に
予めめっきされた銀鑞材によって鑞着される。
2b... and the pressure equalizing ring 3.4.5.6 are soldered together with silver solder material which has been pre-plated on the pressure equalizing ring.

したがって、リング状の銀鑞材10は、陽極板2a、2
b・・・・・・を陽極筒体1内に組み込む時点から鑞着
が完了するまでの間、所定の位置に正しく保持されなけ
ればならないが、工程間移動中の振動等によりしばしば
位置ずれを起し、これが陽極板外れや鑞材の局部集中な
どの好ましくない結果をもたらすことがある。また、部
品点数が多いため、部品の管理が繁雑となり、製造コス
トの低減が望めない欠点があった。
Therefore, the ring-shaped silver brazing material 10 is
b... must be correctly held in the specified position from the time it is assembled into the anode cylinder 1 until the soldering is completed, but the position may often shift due to vibrations etc. during movement between processes. This can lead to undesirable results such as anode plate dislodgement and localized concentration of solder metal. Furthermore, since there are a large number of parts, management of the parts becomes complicated, and there is a drawback that a reduction in manufacturing costs cannot be expected.

発明の目的 本発明は、前述の諸点に留意してなされたもので、陽極
構体を構成する部材の鑞着個所が陽極板を中心に散在し
ていることに鑑み、組立て前陽極板の少なくとも鑞着予
定区域に銀鑞材層を有せしめることを目的とする。
OBJECTS OF THE INVENTION The present invention has been made with the above-mentioned points in mind. The purpose is to have a layer of silver brazing material in the area where it will be deposited.

発明の構成 本発明のマグネトロン用陽極板の製造方法によると、長
辺の一端近傍に均圧環挿入用溝を有する多数の矩形状金
属平板を、板面同士が向き合うに水密に重ね合わせ、か
かる積層体の少なくとも鑞着予定区域を避けた露出表面
を耐食性被覆部材で水密に覆い、銀めっき処理を施して
少なくとも鑞着予定区域に銀鑞材層を形成する。
According to the method of manufacturing an anode plate for a magnetron of the present invention, a large number of rectangular flat metal plates each having a groove for inserting a pressure equalizing ring near one end of the long side are superimposed watertightly with their plate surfaces facing each other, and such lamination is performed. The exposed surface of the body, excluding at least the area to be soldered, is watertightly covered with a corrosion-resistant covering member, and a silver plating treatment is performed to form a layer of silver brazing material at least in the area to be soldered.

実施例の説明 本発明の製造方法を図面に示した実施例とともに説明す
ると、第2図および第3図において、板面同士が向き合
うように水密に重ね合わされた多数の矩形状金属平板1
2a、12b・・・・・・は、上記長辺の一端近傍に均
圧環挿入用溝13!L、13b・・・・・を、また、下
部長辺の一端近傍に均圧環挿入用溝14a、14b・・
・・・・を、そして、上部長辺の中程に電磁波導出用導
体用凹溝15a、15b・・・・・・をそれぞれ有して
いる。
DESCRIPTION OF EMBODIMENTS To explain the manufacturing method of the present invention together with the embodiment shown in the drawings, in FIGS. 2 and 3, a large number of rectangular metal flat plates 1 are stacked watertightly so that the plate surfaces face each other.
2a, 12b... are grooves 13 for inserting pressure equalizing rings near one end of the long side! L, 13b..., and pressure equalizing ring insertion grooves 14a, 14b... near one end of the lower long side.
..., and grooves 15a, 15b for electromagnetic wave deriving conductors are provided in the middle of the upper long side, respectively.

一方、かかる積層体に装着された合成樹脂製またはその
他の耐食性材料からなる断面C字状の細長いマガジンた
る被覆部材16は、その中間部の平坦な内面で金属平板
12a、12t)・・・・・・の各陰極側端面17を水
密に覆っており、−側縁の鉤状部内面で均圧環挿入用溝
131L、13b・・・・・・の各陰極側内面18を水
密に覆っており、さらに他側縁の鉤状部外面で均圧環挿
入用溝141L、14b・・・・・・の各陽極筒側内面
19を水密に覆っている。
On the other hand, the cover member 16, which is an elongated magazine with a C-shaped cross section and is made of synthetic resin or other corrosion-resistant material and is attached to the laminate, has a flat metal plate 12a, 12t)... Watertightly covers the cathode side end faces 17 of the - side edges, and watertightly covers the cathode side inner faces 18 of the pressure equalizing ring insertion grooves 131L, 13b, etc. on the inner surface of the hook-shaped portion of the - side edge. , and the outer surface of the hook-shaped portion on the other side edge watertightly covers the inner surface 19 of each anode cylinder side of the pressure equalizing ring insertion grooves 141L, 14b, . . . .

また、第4図に示すように前記積層体の最外端に位置す
る2枚の金属平板、2・2.2ψδ各外面に対して耐食
性の当て板20.21が水密に押し当てられる。そして
、かかる構体をめっき処理槽内に挿入して高速めつき処
理を施し、前記積層体の露出表面に厚さ10μm程度の
銀層を形成する。
Further, as shown in FIG. 4, corrosion-resistant backing plates 20 and 21 are pressed against the outer surfaces of the two metal flat plates located at the outermost ends of the laminate, 2 and 2.2 ψδ, in a watertight manner. The structure is then inserted into a plating bath and subjected to high-speed plating to form a silver layer with a thickness of about 10 μm on the exposed surface of the laminate.

めっき処理後に当て板20.21および被覆部材16を
とり外すと、第6図に示すように各金属平板の少なくと
も銀鑞着予定区域に銀鑞材層22が付設されているから
、これを陽極板として陽極筒体内に配列する。そして、
必要な均圧環および電磁波導出用導体を所定位置に組み
込み、炉内で銀鑞材層22を溶融するのであって、これ
によりリング状銀鑞材を用いることなく陽極構体が得ら
れる。
When the backing plates 20 and 21 and the covering member 16 are removed after the plating process, as shown in FIG. Arranged as a plate inside the anode cylinder. and,
The necessary pressure equalizing ring and conductor for deriving electromagnetic waves are assembled in predetermined positions, and the silver brazing material layer 22 is melted in a furnace, thereby obtaining an anode structure without using a ring-shaped silver brazing material.

なお、すべての陽極板に凹溝151L、15b・・・・
・・を設ける必要はないので、かかる凹溝を有している
ものと有していないものとを準備すればよい。
In addition, all the anode plates have grooves 151L, 15b...
Since it is not necessary to provide such grooves, it is sufficient to prepare one having such grooves and one without.

また、一つおきの陽極板は上下を反転させてイ史用すれ
ばよい。
Also, every other anode plate can be used upside down.

発明の効果 以上のように本発明の製造方法によると、銀鑞着予定区
域に銀鑞材層を有する多数の陽極板を倉比率よく製造で
きるのみならず、陽極構体製造工数を削減でき、しかも
、銀鑞材の過不足を防止できて、確実な鑞着効果および
製造コストの低減を得ることができる。
Effects of the Invention As described above, according to the manufacturing method of the present invention, it is possible not only to manufacture a large number of anode plates having a silver solder material layer in the area where silver soldering is planned, but also to reduce the number of man-hours for manufacturing the anode structure. , it is possible to prevent excess or deficiency of silver brazing material, and it is possible to obtain a reliable soldering effect and a reduction in manufacturing costs.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は従来のマグネトロン用陽極構体の製造方法を説
明するだめの要部斜視図、第2図は本発明の陽極板の製
造方法の一実施例を説明するだめの要部斜視図、第3図
は同要部側断面図、第4図は同要部平面図、第6図は同
実施例により製造された陽極板の側面図である。 12& 、 12b・・・・・・金属平板、16・・・
・・・被覆音μ材、22・・・・・・銀鑞材層。
FIG. 1 is a perspective view of the main parts of a tank illustrating a conventional method for manufacturing an anode assembly for a magnetron, and FIG. 3 is a side sectional view of the same essential part, FIG. 4 is a plan view of the essential part, and FIG. 6 is a side view of the anode plate manufactured according to the same embodiment. 12&, 12b...metal flat plate, 16...
. . . Covering acoustic μ material, 22 . . . Silver brazing material layer.

Claims (1)

【特許請求の範囲】[Claims] 長辺の一端近傍に均圧環挿入用溝を有する多数の矩形状
金属平板を、板面同士が向き合うように水密に重ね合わ
せ、かかる積層体の少なくとも鑞着予定区域を避けた露
出表面を耐食性被覆部材で水密に覆い、銀めっき処理を
施して少なくとも鑞着予定区域に銀鑞材層を形成するこ
とを特徴とするマグネトロン用陽極板の製造方法。
A large number of rectangular metal flat plates each having a groove for inserting a pressure equalizing ring near one end of the long side are stacked watertightly so that the plate surfaces face each other, and at least the exposed surface of the laminate, avoiding the area to be soldered, is coated with corrosion resistance. A method for producing an anode plate for a magnetron, which comprises covering the anode plate in a watertight manner with a member and performing silver plating treatment to form a layer of silver solder material at least in the area to be soldered.
JP12469982A 1982-07-16 1982-07-16 Manufacturing method of anode plate for magnetron Pending JPS5916242A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12469982A JPS5916242A (en) 1982-07-16 1982-07-16 Manufacturing method of anode plate for magnetron

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12469982A JPS5916242A (en) 1982-07-16 1982-07-16 Manufacturing method of anode plate for magnetron

Publications (1)

Publication Number Publication Date
JPS5916242A true JPS5916242A (en) 1984-01-27

Family

ID=14891899

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12469982A Pending JPS5916242A (en) 1982-07-16 1982-07-16 Manufacturing method of anode plate for magnetron

Country Status (1)

Country Link
JP (1) JPS5916242A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6225819B1 (en) 1998-03-17 2001-05-01 Cypress Semiconductor Corp. Transmission line impedance matching output buffer
EP1515353A2 (en) * 2003-09-09 2005-03-16 Samsung Electronics Co., Ltd. Magnetron for microwave ovens and method of forming same

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6225819B1 (en) 1998-03-17 2001-05-01 Cypress Semiconductor Corp. Transmission line impedance matching output buffer
EP1515353A2 (en) * 2003-09-09 2005-03-16 Samsung Electronics Co., Ltd. Magnetron for microwave ovens and method of forming same
EP1515353A3 (en) * 2003-09-09 2008-03-05 Samsung Electronics Co., Ltd. Magnetron for microwave ovens and method of forming same

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