JPS5930436A - Manufacture of boiling heat transmitting face - Google Patents

Abstract

PURPOSE:To manufacture easily a boiling heat transmitting face whose heat transmitting performance is excellent, by printing a nonconductor film whose evaporation temperature is lower than that of a mold material, in a parallel stripe shape, and thereafter, manufacturing an electroforming mold by use of a high energy density beam, and obtaining a wave plate by electroforming. CONSTITUTION:Plural nonconductor films 5 whose evaporation temperature is lower than that of a mold material 10 are printed in a parallel stripe shape by a printing machine, on the surface of an electroforming mold material 10 whose surface is smoothed. Subsequently, plural grooves 7 are pierced in the direction orthogonal to the film 5 by a high-energy density beam 6. In this case, the film 5 whose evaporation temperature is lower than that of the mold material 10 is more evaporated and removed than the mold material, and an electroforming mold 11 which becomes width B of wodth B of a ridge part between the grooves 7>length (b) of an islandlike nonconductor film 8 between the grooves 7 is manufactured. An electroforming metal 9 is electroformed by a mold 11 manufactured in his way, is stripped off from the mold 11, and a wave plate of the metal 9 on which an opening 13 is formed is obtained in a position corresponding to the film 8. Subsequently, a desired boiling heat transmitting face is manufactured by joining this wave plate to a heater block by soldering.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a boiling heat transfer surface, and in particular to a method for manufacturing a boiling heat transfer surface that can easily produce a boiling heat transfer surface with excellent heat transfer performance. be.

Conventionally, boiling heat transfer surfaces have been made of sintered bodies of fine powder of metals such as copper and aluminum, which are highly thermally conductive materials, or metal plates (the materials are the same copper and aluminum as above).
It is known that the surface of the material is mechanically roughened to form a nearly porous state.

However, recently, in response to the demand for improved heat transfer performance of boiling heat transfer surfaces, a shape as shown in FIG. 1 has been announced.

FIG. 1 is an enlarged perspective view of the entire heat transfer portion of the 1llt heat transfer surface to which the present invention is applied.

In this FIG.
The corrugated sheet 3, which is joined at point a and has a tunnel-like groove 4 formed therein, is an opening formed in the ridge portion 2b of the corrugated sheet 2.

The boiling heat transfer surface formed in this way has smaller variations in the accuracy of the shape 1 dimension of the aperture 3 than the apertures (not shown) in the sintered body, etc. described above, and Since the size is made smaller than the size of the internal groove 4, air bubbles (
(not shown) can be held inside the groove 4 for a suitable period of time, and its heat transfer performance is excellent.

To briefly describe the conventional manufacturing method of the boiling heat transfer surface shown in FIG. 1, first, a metal plate (thickness: 0.05+n+n), such as copper or aluminum, is etched.

Opening 3 is made by methods such as electron beam processing and laser processing.
(The diameter is, for example, 0.15 + rtmφ).

Next, the corrugated sheet 2 is formed by plastic working so that the openings 3 are located at the ridges 2b. Then, this corrugated plate 2 is soldered to the heater block 1 at its joint portion 2a.

However, in the conventional manufacturing method described above, when a metal plate is bent into the corrugated plate 2 by plastic working, the amount of plastic deformation that occurs during bending varies due to variations in the mechanical properties of the metal plate. If the hole 3 was displaced from the ridge 2b or if the material lacked ductility, breakage could occur from the edge of the hole 3. In this way, if the aperture 3 becomes detached from the ridge 2b or if the edge of the aperture 3 breaks, it will cause the heat transfer performance of the boiling heat transfer surface to deteriorate, so the cumulative characteristics should be strictly controlled. I had to.

Furthermore, the width t of the groove 4 and the pitch p of the waves of the corrugated plate 2.

The dimensions of the wave height h are t = 0.3-0.4, respectively
1) = 0.5~0.7mm, h = (1,0
~1.5), so the tool (not shown) used for the bending process needs to be narrow and tall; however, such a tool is not strong enough. The bending process was not easy because it was weak and there was a risk of breakage during the bending process.

Unfortunately, conventionally, it has been difficult to manufacture a boiling heat transfer surface with excellent heat transfer performance as shown in FIG.

An object of the present invention is to provide a method for manufacturing a boiling heat transfer surface, which eliminates the drawbacks of the above-mentioned prior art and can easily produce a boiling heat transfer surface with excellent heat transfer performance. It is something.

The method for manufacturing a boiling heat transfer surface according to the present invention has a structure in which a plurality of nonconductor films having a lower evaporation temperature than the electroforming material are printed in parallel stripes on the surface of an electroforming material, and then the nonconductor film is printed on the surface of an electroforming material. An electroforming mold in which the nonconductor film remains in the form of islands in the ridges between the grooves is manufactured by drilling a plurality of parallel grooves in a direction intersecting with the grooves using a high-energy dense metal beam. After electroforming the electroformed metal, the electroformed metal was peeled off from the electroforming mold to obtain a corrugated sheet with openings formed in the ridges, and this corrugated sheet was bonded onto the heater block. It is something.

More details are as follows.

After printing a nonconducting film in the form of parallel stripes on the surface of the electroformed material, grooves are bored in a direction orthogonal to the direction of the stripes using a high energy density beam processing method such as an electron beam or a laser beam. When this is done, an electroforming mold is produced in which the nonconductor film remains in the form of islands in the ridges formed between these grooves at the intervals of the stripes during printing of the nonconductor film. By performing electroforming using this electroforming mold, electroforming progresses with openings being formed at certain intervals in the ridges of the corrugated sheet of electroformed metal that is curved into a rectangular wave shape. A desired boiling heat transfer surface can be obtained by peeling off the corrugated plate from the electroforming mold and joining it to the heater block by soldering or diffusion joining.

The present invention will be explained below with reference to Examples.

2 to 6 are for explaining a method of manufacturing a boiling heat transfer surface according to an embodiment of the present invention, and FIG. 2 shows a plurality of parallel stripes formed on the surface of an electroformed mold material. FIG. 3 is a partial perspective view showing the state in which the nonconductor film of the book is printed. FIG. , FIG. 4 is a partial perspective view of the electroforming mold after the groove has been processed, and FIG.
FIG. 6 is a perspective view showing a state in which electroformed metal has been electroformed into the electroforming mold shown in FIG. 4, and FIG. FIG. 3 is a partial perspective view showing a corrugated metal plate.

First, an electroforming mold material 10 (for example, a metal material such as stainless steel) with a smooth surface is prepared.

The electroformed mold material 1 is printed on the surface of this electroformed mold material 10 by a printing machine.
A nonconductor film 5 having an evaporation temperature lower than 0 (for example, a thickness of 0
．． 0.07 mm epoxy resin film) in parallel stripes with a width of 0.07 mm.
Print multiple copies at 13mm and pitch 0.6mm (Figure 2)
. Next, in the direction perpendicular to the nonconductor film 5, a high energy density beam 6 is formed with a groove width of 0.3 ynm and a pitch of 0.6 m.
yr, and a plurality of grooves 7 with a depth of 0.4 mm are bored (Fig. 3). By this groove machining, an electroforming mold 11 in which island-shaped nonconductor films 8 remain in the ridges between the grooves 7 is manufactured (FIG. 4).

By the way, the processing using the high energy density beam 6 is as follows:
Since it is essentially heat processing, as mentioned above, the electroforming mold material 1
If the nonconductor film 5 has an evaporation temperature lower than 0, the electroformed mold material 10 will be additionally evaporated and removed. l].

Electroforming metal 9 (having good thermal conductivity, such as copper or aluminum UNO) is added to the electroforming mold 11 manufactured in this way at a rate of 0.0.
Electroform to a thickness of 5 mm (Figure 5).

When the electroformed metal 9 is peeled off from the electroforming mold 11, the sixth
As shown in the figure, an opening 13 (with a negative side of 0.13 mm
A corrugated plate 12 of electroformed metal 9 with square openings) formed therein.
(Wave pitch 0.6 rrtm, height 0.45m+n
) can be done. By soldering this corrugated plate 12 to a heater block (not shown), a desired boiling heat transfer surface can be obtained.

According to the embodiment described above, there are the following effects.

(1) If the evaporation temperature of the nonconductor film 5 is lower than the evaporation temperature of the electroforming material 1o, the nonconductor film 5. There is no need to strictly control the characteristics of the electroformed metal 9, and a general one may be used.

Further, since the groove 7 is bored by the high energy density beam 6, the strength of the tool is not a problem and the machining accuracy is excellent. Therefore, a boiling heat transfer surface with excellent heat transfer performance can be easily manufactured.

(2) During groove machining with the high energy density beam 6, the island-shaped nonconductor film 8 is evaporated and removed more than the groove part, so the length b of one side of the opening 13 of the finished corrugated plate 12 is narrower than the width of the ridge portion 12b, and the heat transfer performance is such that the gas envelope (not shown) can be held inside the groove for an appropriate period of time, similar to the boiling heat transfer surface according to FIG. Excellent boiling heat transfer surfaces can be easily manufactured.

(3) When forming the corrugated sheet 12, since the electroformed metal 9 is electroformed into the electroforming mold 11, the corrugated sheet 12 has a large area.
can be molded in one go, making it possible to efficiently manufacture boiling heat transfer surfaces.

In this embodiment, the grooves 7 are formed in a direction perpendicular to the nonconductor film 5. However, the method for manufacturing a boiling heat transfer surface of the present invention allows the grooves 7 to be formed in a direction perpendicular to the nonconductor film 5. The same applies to the case of drilling a plurality of parallel grooves.

As described in detail below, according to the present invention, a plurality of nonconductor films having a lower evaporation temperature than the electroforming material are printed in parallel stripes on the surface of the electroforming material, and then the nonconductor film is An electroforming mold in which the nonconductor film remains in the form of islands in the ridges between the grooves is manufactured by drilling a plurality of parallel grooves in a direction intersecting with the grooves using a high energy density beam. After electroforming the electroformed metal, the electroformed metal is peeled from the electroforming mold to obtain a corrugated plate with holes formed in its ridges, and this corrugated plate is bonded onto the heater block. Therefore, it is possible to provide a method for manufacturing a boiling heat transfer surface that can easily and efficiently produce a boiling heat transfer surface with excellent heat transfer performance.

[Brief explanation of drawings]

FIG. 1 is a partially enlarged perspective view showing a boiling heat transfer surface that is the object of the present invention, and FIGS. 2 to 6 are illustrations of a method for manufacturing a boiling heat transfer surface according to an embodiment of the present invention. Fig. 2 is a partial perspective view showing a state in which multiple nonconductor films are printed in parallel stripes on the surface of an electroformed mold material, and Fig. 3 is a partial perspective view showing the nonconductor films in Fig. 2 and FIG. 4 is a partial perspective view showing a state in which a groove is being processed by a high energy density beam in an orthogonal direction; FIG. 4 is a partial perspective view of the electroforming mold after the groove has been processed;
FIG. 5 is a perspective view showing a state in which electroformed metal is electroformed into the electroforming mold shown in FIG. 4, and FIG. 6 is a perspective view showing a state in which an electroformed metal is electroformed into the electroforming mold shown in FIG. FIG. 3 is a partial perspective view showing the corrugated electroformed metal plate. 5... Nonconductor film, 6... High energy density beam, 7
... Groove, 8... Island-shaped nonconductor film, 9... Electroformed metal, 10... Electroformed mold material, 11... Electroformed mold, 12... Corrugated plate, 12b... Ridge Part, 13...opening. 1st mouth 3 Figure 2 Figure 3 Figure 40

Claims (1)

[Claims] 1. On the surface of the electroformed mold material, a plurality of parallel stripes of a nonconductor film, which has a low evaporation temperature as that of the electroformed mold material, are printed, and then a plurality of parallel grooves are printed in the direction intersecting the nonconductor film. By drilling with a high energy density beam, an electroforming mold in which the nonconductor film remains in the form of islands in the ridges between the grooves is manufactured, and after electroforming the electroformed metal into this electroforming mold, the electroforming A method for manufacturing a boiling heat transfer surface, comprising: peeling metal from the electroforming mold to obtain a corrugated sheet with holes formed in its ridges, and joining this corrugated sheet onto a heater block.