JPS5855069A - Gas wiping device for liquid coated on steel strip - Google Patents

Gas wiping device for liquid coated on steel strip

Info

Publication number
JPS5855069A
JPS5855069A JP15388481A JP15388481A JPS5855069A JP S5855069 A JPS5855069 A JP S5855069A JP 15388481 A JP15388481 A JP 15388481A JP 15388481 A JP15388481 A JP 15388481A JP S5855069 A JPS5855069 A JP S5855069A
Authority
JP
Japan
Prior art keywords
nozzle
gas
air
steel strip
gas wiping
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15388481A
Other languages
Japanese (ja)
Other versions
JPS6216140B2 (en
Inventor
Tomihiro Hara
原 富啓
Masahiro Ogawa
小川 正浩
Yasuhisa Tajiri
田尻 泰久
Tadashi Jinguji
神宮路 正
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
IHI Corp
JFE Engineering Corp
Original Assignee
IHI Corp
NKK Corp
Nippon Kokan Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by IHI Corp, NKK Corp, Nippon Kokan Ltd filed Critical IHI Corp
Priority to JP15388481A priority Critical patent/JPS5855069A/en
Publication of JPS5855069A publication Critical patent/JPS5855069A/en
Publication of JPS6216140B2 publication Critical patent/JPS6216140B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Coating Apparatus (AREA)
  • Chemical Treatment Of Metals (AREA)
  • Coating With Molten Metal (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)

Abstract

PURPOSE:To prevent contamination of nozzles by providing enclosures having no relations with the traveling of a steel strip to be wiped of the liquid coated thereon by gases in the positions of the line where said steel strip travels and further providing gas wiping nozzles in the upper parts of the enclosures. CONSTITUTION:Side walls 4 and ceiling walls 5 which are enclosures having no relations with the traveling of a steel strip to be wiped of the liquid coated thereon by gases are provided in the positions of the line where said steel strip travels, and gas wiping nozzles 7, 7' which are sharp in tip angles are provided in the upper parts of said enclosures. Baffles 15, 15' for taking in of secondary air 14, 14' are provided below the nozzles 7, 7'. The tips of the baffles 15, 15' are rounded downward in the positions near the tips of the nozzles 7, 7'. Partition plates 16, 16' are mounted in the lower parts of the baffles 15, 15' and semicircular baffles 17, 17' for separating air and mist-like splashers are mounted in the lower part of the plates 16, 16'.

Description

【発明の詳細な説明】 本発明は、鋼帯表−を連続的に処理するために塗布塵化
或処理液又は塗料(以下塗布液と言う)の塗装時に、そ
の余剰分をガスワイピングすることによ砂皮膜付着量を
クント田−ルする装置−の改良に関する40であって、
高粘度、低密度、低界面張力等、様々1物性を有する速
乾性の塗布液に対し、二次空気取入れ用バッフル及びガ
スワイピングノズルから噴出する空気を吸引する空気吸
引機構を設ける仁とkよ製、200 w/II以上の高
速ラインでもスブラツシエ発生によるノズル汚染を無<
L1操業率を向上官量ると共に製品品質をも向上させる
ことを目的とするものであゐ。
DETAILED DESCRIPTION OF THE INVENTION The present invention provides a method for continuously treating the surface of a steel strip by gas wiping the excess amount when dusting or coating a treatment liquid or paint (hereinafter referred to as coating liquid). No. 40 relating to the improvement of a device for measuring the amount of sand film adhesion,
For fast-drying coating liquids that have various physical properties such as high viscosity, low density, and low interfacial tension, it is recommended that an air suction mechanism be installed to suck the air ejected from the secondary air intake baffle and gas wiping nozzle. Nozzle contamination caused by scrubbing even on high-speed lines of 200 w/II or higher.
The purpose is to improve the L1 operation rate as well as improve product quality.

従来、銅帯の表面を塗布婁化威処理又は塗装する場合の
皮腓付着量フン)a−西方法としては、リール絞り法が
採用されていたが、近都のラインスピード高速化技術の
確立に伴−、ロール絞り法を採用することは技術的に@
illとなってきた。つtに、このロール絞り法によっ
て高速ラインの塗布液の付着量コン)W−ルをすると、
次の問題がある。
Conventionally, the amount of skin deposited when coating or painting the surface of copper strips) a) The reel drawing method was adopted as the west method, but with the establishment of line speed increase technology in nearby cities. Therefore, it is technically difficult to adopt the roll drawing method.
It has become ill. Secondly, when controlling the amount of coating liquid applied on a high-speed line using this roll squeezing method,
I have the following problem.

げ)巾方向e、i@−性が低下する。(G) Width direction e and i@- properties are reduced.

(ロ)銅帯の板厚変更時及び大田−ダウン時の付着量コ
ン)胃−ル1IXiI難と1にゐ。
(b) When changing the plate thickness of the copper strip and when downing the copper strip, the amount of adhesion was determined.

(ハ)ロールの摩耗が激しく、メインテナンスに費用が
かかる。
(c) Rolls are heavily worn and maintenance is expensive.

に)ライン停止時K11−1kpK@布液が固着し、絞
り性を低下させる。
2) When the line is stopped, K11-1kpK@fabric liquid sticks and reduces the drawing property.

そこで、これらの問題を解決する方法として、銅帯に非
接触で併も付着量コントレールが容易に行えることから
、いわゆるガスワイピング(気体絞り)法が開発された
。この方法は溶融金属めっきの分野では従来から盛んに
行われていた技術であり、その典型的な例を第1図に示
す、このv!Jにおける(1)は銅帯であり、溶融金属
めっ自浴(2)から引出され、その表面に付着した過剰
の溶融金属が、ガスワイピングノズル(3) (3’)
から噴射されるガスによ抄吹拭されて、所定の皮膜付着
量コントリールされる如自ものであった。しかしながら
、このような方法を直ちに塗布型化成処理液又は楡科等
OIk布液塗装に用−た場゛合は、スプラッシュ発生に
よるノズル汚染中、ノズル・スリットの目詰り、製品汚
染による品質低下などの問題が生じ、高速ラインでの実
用托−困難であった。
Therefore, as a method to solve these problems, a so-called gas wiping (gas throttling) method was developed because it can easily control the adhesion amount without contacting the copper strip. This method has been widely used in the field of hot-dip metal plating, and a typical example is shown in Figure 1. (1) in J is a copper strip, which is drawn out from the molten metal bath (2), and the excess molten metal adhering to its surface is passed through the gas wiping nozzle (3) (3')
It was as if the amount of film deposited was controlled by blowing off the film with gas injected from the film. However, if such a method is immediately applied to coating type chemical conversion treatment liquids or OIk cloth liquid coatings such as elms, there may be problems such as nozzle contamination due to splash generation, nozzle slit clogging, and quality deterioration due to product contamination. Problems arose, making it difficult to put it into practical use on high-speed lines.

その理由として、次のことが挙げられる。The reasons for this are as follows.

(a)上述0Ill布液は溶融金属に比べて高粘度(1
〜数百ap) 、低密度(1F/−程度)であり、粘度
は同程度から約100倍、密度において数分の−である
。その結果、鋼11によって持上げられる塗布液量はラ
インスピード一定とした場合、塗布液の方が溶融金属よ
りも格段に多くなるため、液膜のだぶつきによってもた
らされるスプラッシュの発生が激しい・この銅帯持上げ
によゐ塗布液量は、理論的には粘度とラインスピードの
積の平方根に比例し、密度の平方根に反比例することが
知られている。
(a) The above-mentioned 0Ill cloth liquid has a higher viscosity (1
~several hundred ap), low density (about 1F/-), viscosity is about the same to about 100 times, and density is several minutes lower. As a result, when the line speed is constant, the amount of coating liquid lifted by the steel 11 is much larger than that of the molten metal, so the splash caused by the bulging of the liquid film is intense. It is known that the amount of coating liquid required to lift the band is theoretically proportional to the square root of the product of viscosity and line speed, and inversely proportional to the square root of density.

このことから考えて、塗布液の場合は溶融金属めっきに
比べて、かなり低ラインスピードでなければスプラッシ
ュの発生なしに操業できな−ことが判る(経験的には3
0WL/−以下)。
Considering this, it can be seen that in the case of coating liquid, compared to hot-dip metal plating, it is necessary to operate at a considerably lower line speed without generating splash (empirically, 3
0WL/- or less).

■一般に、塗布液社表面張力が小さく、そのため鋼帯に
よって持上げられる塗布液の量の@にはスプラッシュが
発生LJ&<、かつ低密度であること一手伝ってノズル
先端での二次空気の巻込み及びその乱れの影響を受けて
、ノズル汚染やノズルスリツシの台詰抄、製品汚染によ
る品質低下の問題があ抄、この現象は速乾性OIk布液
の場合は重大な問題である・ @塗布液は人体に有害な重金属(例えば六価夕田ム)中
有機溶剤を含んでいるため、それを扱う塗布型化成処理
槽又は塗装ゾーンは安全上閉塞系になって−るのが鋼殻
的である。その結果、発生したスプラツシsL#i上記
処理槽又社塗装ゾーン内に充満して、二次的にガスワイ
ピングノズルを汚染する。
■Generally, the surface tension of the coating liquid is small, and as a result, the amount of coating liquid lifted by the steel strip causes splash LJ&<, and its low density helps to entrain secondary air at the nozzle tip. Due to the effects of this turbulence, there are problems of nozzle contamination, nozzle slitting, and product contamination resulting in quality deterioration.This phenomenon is a serious problem in the case of quick-drying OIk fabric liquids. Since it contains heavy metals (such as hexavalent metals) and organic solvents that are harmful to the human body, the coating type chemical conversion treatment tank or coating zone that handles them is a steel-shelled system that is closed for safety reasons. As a result, the generated splash sL#i fills the processing tank or coating zone, and secondarily contaminates the gas wiping nozzle.

以上のII由から明らかなように、高速ラインにおける
銅帯への塗布@e皮膜付着量コント―−ルをガスワイピ
ングで行なおうとする場合社、スプラッシュ発生は避け
られず、従ってノズル汚染を無くする)めO対策が必要
である。このスプラッシュの発生によるノズル汚染は、
スプラッシュの発生と同時に起る一次的汚染と、発生し
たスプラッシュが処理槽や塗装ゾーン内に充満すること
Kよって起る二次的汚染とに大別される。−次的汚染の
原因として社ノズル先端部での二次空気の巻込み及びそ
の乱れKよると考えられ、二次的汚染の原因としては発
生したスプラッシュの処理槽や塗装ゾーン内への充満及
びノズル先端部での二次空気の巻込みによると考えられ
る。
As is clear from the above reasons, when using gas wiping to control the amount of coating on copper strips on high-speed lines, splash generation is unavoidable, and nozzle contamination is therefore avoided. Measures against this problem are necessary. Nozzle contamination due to this splash is caused by
There are two main types of contamination: primary contamination, which occurs simultaneously with the generation of splash, and secondary contamination, which occurs when the generated splash fills the treatment tank or coating zone. - The cause of secondary contamination is thought to be due to the entrainment of secondary air at the tip of the nozzle and its turbulence. This is thought to be due to the entrainment of secondary air at the nozzle tip.

ところで、この−次的汚染は、既に説明した通り溶融金
属めつ會とこζで対象として−る塗布液とにおいて共通
ell1題であ艶、これを解決する方法としてノズル構
造の改曽が先に発明者らにより特顯昭56−10879
1号で提案されて−る。
By the way, as already explained, this secondary contamination is a common problem in both molten metal fittings and the coating liquid targeted here, and the first method to solve this problem is to modify the nozzle structure. Specially designated by the inventors 1987-10879
It was proposed in No. 1.

しかし、二次的汚染の聞I11については、未だ解決策
か無−のが実情である。
However, the reality is that there is still no solution to the problem of secondary contamination.

本発明は、塗布型処理X線塗装Km−てガスマイピング
により連続的に皮膜付着量コント四−ルする場合に発生
するスプラッシュ(よるノズル汚染あるいはノズルスリ
ツシの目詰り、さらに製品品質の低下と−う閤■を解決
するために’&されたものであって、その要旨とすると
ころは、銅帯の表面に連続的に塗布される塗布型化成処
理液又は塗料等0@布液O余剰分をガスワイピングする
装置において、塗布液をガスワイピングすべ素鋼帯の走
行ライン個所に鋼帯O走行とは無関係1kl!I/−を
設け、1m!Ivh内O上部にガスワイピングノズルを
設け、該ガス9イビンダノズルの下部に間隔を置−で二
次空気通路WII!IcOためOバッフルを設け、験バ
ッフ111110下部に前記ll!−の外部へ通じる空
気吸引機構(エアーナタシ曹ン)を設けたことを特1m
lする鋼帯塗布液のガスワイピング装置である。
The present invention is designed to prevent splashes (nozzle contamination or nozzle slit clogging, as well as deterioration of product quality) that occur when continuously controlling the amount of film deposited by gas miping in coating type X-ray coating. It was developed in order to solve the problem ``■'', and its gist is that the coating type chemical conversion treatment liquid or paint etc. 0 @ fabric liquid O surplus applied continuously to the surface of the copper strip. In a device for gas wiping the coating liquid, a 1kl! An O baffle was provided for the secondary air passage WII!IcO at an interval at the bottom of the gas nozzle 9, and an air suction mechanism (air suction mechanism) leading to the outside of the 111110 was provided at the bottom of the test buffer 111110. Special 1m
This is a gas wiping device for coating liquid on steel strips.

以下、図[jKよ抄本発明Oガスツイビンダ装置O実施
例を、前述の発明者らが本発明の出願に先立って提案し
た従来のガスワイピング装置と比較しつつ詳Ilに説明
する。第2mは上記O従来のガスワイピング装置であ抄
、塗布型化成処理液塗布の例を示している。第3図(1
)(2)及び館411は共に本発明のガスワイピング装
置であり、第3図(→−)社塗布鳳化虞J1611液塗
布の例を示し、第4図は同じくその応用例を示して−る
。各[K来週0(1)は鋼帯である。(2)鯰鍮理漬を
収容しに処理槽の側壁であり、@鯰該皓理槽O天井壁で
ある。(&は処理槽内に収容されて−ゐ塗布置化成鋤理
浴であ塾、の(7り鐘処■榴内上部に設けられたガス9
イビンダノズルである。しかして4112m1に示す従
来装が鋭角のガス9イビンダノズルの(7’)Kよって
過剰の処理液を吹拭し、皮膜付着量フン)―−ルポなさ
れる。この場合、ガスワイピング装置A/(7)(7つ
から噴出される空気社矢印で示される流11に従って槽
内を流れ、天井壁■に設けられた瞭rfIi■を通り、
ダクト(10)(10’)へ導かれる。尚、ダタ) (
10)(10つの延長端Kfi空気洗浄設備が設けられ
ているものとする。又、化成婚瑠槽O上IIKa熱嵐乾
燥装置(11)−!11設けてあシ、そこから噴出され
る熱風が瞭間(12)からダクト(io) (10り内
へ流れ込む。このように、ガス9イビンダノズルのC7
′)を有する従来O装置で鯰、発生Letスト状のスプ
ラッシユが処理槽内に充濃り、ガス9イビンダノズルの
(7’)0先端部への二次空気(15)(15’)の4
1!き込みによってスプラッシユが同伴され、その結果
二次的に該ノズルを汚染する。そこで発明者らは、ガス
ワイピングノズルのC7りを有する従来の化或処理榴I
Ichける上述の欠点を除くことを目的として検討し″
に輪呆−ミス)状のスプラッシユを同伴してvh′lk
%Ihすれ−な二次空気を亀す入れるためのバッフルと
必要に応じて発生したミスト状のスプラッシユと空気と
を分離するためのバッフ#を殴けると共に、前記ガス9
イビンダノズルの(アー)から噴出する空気を吸引する
ための空気吸引機構(エアーナタシ嘗ン)を取り付ける
ことにより、スプラツシJLKよるノズルの(7I)の
二次的汚染を奥書のな一程度重で軽械″S破るかあゐ−
は全(無くすゐことを線間したものである。
Hereinafter, an embodiment of the gas wiping device according to the present invention will be described in detail in comparison with the conventional gas wiping device proposed by the above-mentioned inventors prior to the filing of the present invention. The 2nd m shows an example of the conventional gas wiping device mentioned above, which performs paper cutting and application of a coating type chemical conversion treatment liquid. Figure 3 (1
) (2) and 411 are both gas wiping devices of the present invention, and Fig. 3 shows an example of coating the (→-) Co., Ltd. Co., Ltd. Co., Ltd.'s J1611 liquid, and Fig. 4 also shows an example of its application. Ru. Each [K next week 0 (1) is a steel strip. (2) This is the side wall of the processing tank for storing the catfish and the ceiling wall of the processing tank. (& is housed in the treatment tank - ゐcoating chemical treatment bath) (7 bell room■ gas 9
It is an Ibinda nozzle. However, the conventional equipment shown in 4112ml was used to blow off the excess processing liquid with the (7')K of the acute-angled gas nozzle, and report the amount of film deposited. In this case, the gas wiping device A/(7) (7) flows in the tank according to the flow 11 shown by the air arrow, passes through the air rfIi installed on the ceiling wall ■,
It is led to the duct (10) (10'). In addition, data) (
10) (10 extended end Kfi air cleaning equipment shall be installed. Also, a IIKa thermal storm drying equipment (11)-!11 shall be provided on the chemical marriage tank O, and hot air blown out from there. flows from the gap (12) into the duct (io) (10).In this way, C7 of the gas 9 Ibinda nozzle
In the case of conventional O equipment with a catfish, a stream-like splash is generated in the treatment tank, and secondary air (15) (15') to the tip of the gas nozzle (7') is generated.
1! The entrainment entrains the splash, which secondarily contaminates the nozzle. Therefore, the inventors proposed a conventional chemical treatment method having a C7 gas wiping nozzle.
This study was conducted with the aim of eliminating the above-mentioned drawbacks.
vh'lk accompanied by a splash like a mistake)
%Ih-A baffle for letting in the secondary air and a baffle # for separating the generated mist-like splash and air as necessary, and the above-mentioned gas 9
By installing an air suction mechanism (air suction mechanism) to suck the air ejected from the (A) of the Ibinda nozzle, secondary contamination of the nozzle (7I) caused by Splash JLK can be reduced to just one degree. I'll break the machine.
is a line between the word ``to eliminate''.

、#1311(a)(ロ)はこのよう1本発明のガスワ
イピング装置の実施例を示すもので、塗布液をガスワイ
ピングすべ自銅帯の走行ライン個所に銅帯の走行とマイ
ビンダノズ#の(7I)を設け、こOノズルの(7I)
の下には禽れいな二次空気(14)(14勺を取抄入れ
るためのパラy # (15)(15つが設けられて−
る。こOバッフル(15)(15すO先端線ノズルの(
7’) fD先端に近−個所で下方に丸められて−るが
、これは二次空気(14) (14りをスムーズに下方
へ送るためである。バッフル(15)(15り鯰ノズル
の(7I)より下方に20〜200amO範■で水平に
位置するのが適当である。亀お、バッフ#(15)(1
5つの先端の間隔は、それらとノズルの(7I)との位
置関係により決定するOがl[tL<、後者の位置関係
が離れて−れば−る程前者et*siを広ける必要があ
る・又、バッフル(15)(15りの下部に轄湾曲した
仕切板(116)(16りが取り付けてあ抄、t O仕
切#1(16)(16つのTWsKは=r′とミス)状
のスプラッシユを分離する丸めの半円状バッフル(17
)(17りが取付けである―仕切板(16)(141社
ノズルの(7′)から噴H5L走空気の流れを整えるこ
とを目的として−る。tた半円状バッフル(17)(1
7つは識スト状のスプラッシユと空気とを遠心力により
分離することを目的としてお勤、それらの最下部に社分
離されたスプラッシユを化成処理浴(6)K戻す通路(
18)(18つが設けである。 (19)(19り社S
−の外部へ通じゐ空気出口であり、この先IIc#i図
示は省略しであるが空気吸引機構が設けである。この空
気吸引機構の吸引fIkIIi、通常)ズルの(7つか
ら噴出される空気量の1.1〜5.0恰である仁とが好
tL<、従って化成処理槽の天井a!@に設けられて−
ゐ*iimからは外気が常に流れ込んで−るため、処理
槽自体は閉鎖系になっている。tた、空気の流れ韓矢印
で示した流線(20)k沿ってスムーズに流れる・第4
図は本発明Oガスワイビンダ装置の応用例を示す%Oで
、ζス)状のスプラッシユと空気とを分離するため0バ
ツフルを外方へ向けて湾曲するバッフル(21)(21
#)のようIk藩とし、空気出口(19)(19’)を
化成処理槽の下方に位鷺させた亀のである。空気出口(
19)(19す69f、に韓図示は省略しであるが空気
吸引機構及び空気洗浄装置が設けられる。
, #1311(a) and (b) show examples of the gas wiping device of the present invention, in which the coating liquid is gas-wiped, the copper strip runs on the running line of the self-copper strip, and the my binder nozzle #( 7I) of this O nozzle.
Underneath, there are 15 parallels for introducing clean secondary air (14) (14).
Ru. This O baffle (15) (15 O tip line nozzle (
7') It is rounded downward near the tip of fD, but this is to send the secondary air (14) smoothly downward.Baffle (15) (15) It is appropriate to position it horizontally in the range of 20 to 200 amO below (7I).
The distance between the five tips is determined by the positional relationship between them and (7I) of the nozzle. Yes, there is also a baffle (15) (the curved partition plate (116) is attached to the bottom of 15). A round semicircular baffle (17
) (17 is the installation - Partition plate (16) (141 company The purpose is to adjust the flow of the jet H5L running air from (7') of the nozzle.
7 is used for the purpose of separating the crystalline splash and air by centrifugal force, and at the bottom of these passages the separated splash is returned to the chemical conversion treatment bath (6).
18) (18 are established. (19) (19 Risha S
- It is an air outlet leading to the outside of IIc#i, and although not shown in the drawings, an air suction mechanism is provided. The suction fIkIIi of this air suction mechanism is preferably 1.1 to 5.0 times the amount of air blown out from the seven (usually) Zuru (7), so it is installed on the ceiling a!@ of the chemical conversion tank. Being beaten-
Since outside air is constantly flowing in from the i*iim, the treatment tank itself is a closed system. The air flows smoothly along the streamline (20)k shown by the arrow.
The figure shows an application example of the O gas wi binder device of the present invention.The baffle (21) (21
#), and the air outlet (19) (19') is placed below the chemical conversion tank. Air outlet (
19) (19th 69f) Although not shown in the figure, an air suction mechanism and an air cleaning device are provided.

次に、本発明のガスツイビンダ装置を適用した実施例と
比較のため従来のガスマイビンダ装置を用−た比較例を
示す。
Next, an example in which the gas twin binder device of the present invention is applied and a comparative example in which a conventional gas twin binder device is used for comparison will be shown.

実施@ 1       ′ 板厚a27−1板巾1’219−のス)リップ状溶融亜
鉛めっき鋼′板上に、粘度409s密度t041−1表
面張力36 dyn/aa O有機系塗布源化成嶋理液
を縦型ラインにより浸漬塗布し1第3図(1)(ロ)k
示される本発明のガスヮイビンダ装置を用いて皮膜付着
量コン)胃−ルを行った。この時の条件線状の通知であ
った・ z2.+(7)*(7’)とハt y * (15) 
e (15’)Oflag :50■ s y y # (15)e(15りの先端間隔:  
 100m5バツフル(15)、(15’)とバッフル
(17)(17つ最底部間隔=           
  700■(空気吸引量)÷(ノス#からの空気噴出
量)81.2 ガスワイビンダ条件客 ノズルとストリップ0閤隔  
   15w ノスルスリッシ巾 t5鵠 空気圧    α8gl1 その結果、6001v4aIのライン速度でもスプラッ
シユ発生によるノズル〇−次的及び二次的−染轄全く無
く、連続操業を行うことがで自た。
Implementation @ 1' On a lip-shaped galvanized steel plate with a plate thickness of 27-1 and a width of 1'219-1, a viscosity of 409s, a density of t041-1, a surface tension of 36 dyn/aa, and an organic coating source Kaseijima liquid were applied. Dip coating using a vertical line 1 Figure 3 (1) (b) k
Film adhesion measurement was carried out using the gas evibinder device of the present invention as shown. At this time, the condition was a linear notification・z2. + (7) * (7') and hat y * (15)
e (15') Oflag: 50 ■ s y y # (15) e (15 tip spacing:
100m5 baffles (15), (15') and baffles (17) (17 bottom spacing =
700 ■ (Amount of air suction) ÷ (Amount of air ejected from Nozzle #) 81.2 Gas Wy Binda condition customer Nozzle and strip 0 spacing
15w Nozzle width t5 Air pressure α8gl1 As a result, even at a line speed of 6001v4aI, there was no secondary or secondary damage to the nozzle due to splash generation, and continuous operation could be performed.

実施例 2 板厚α27−1板巾121?−のストリップ吠溶融金属
亜鉛めつ金鋼板上に、粘度12001)、密度2.19
/j、表面張力52 dye、AO論料を縦型ラインに
より浸漬塗布し、第3図も)(ロ)に示される本発明の
ガスライビング装fを用−て皮膜付着量コント田−ルを
行った。ζ0時の条件社次の通りであった。
Example 2 Plate thickness α27-1 Plate width 121? - strip of molten metal on galvanized steel sheet, viscosity 12001), density 2.19
/j, surface tension 52 dye, AO coating was applied by dip coating using a vertical line, and the amount of film deposited was controlled using the gas riving equipment f of the present invention shown in Fig. 3) (b). Ta. The conditions at ζ0 were as follows.

ノズル(7) 、 (7つとバッフル(15)、(15
りの間隔:30鴎 バッフル(15)、(15’)e先端間隔=   60
■バツフ# (15)、(15’)とバッフル(17)
 、 (17つ最低部の間隔:           
  7ooss(空気吸引量)÷(ノズルからの空気噴
出量)!   5.0ガスライビング条件雪 ノズルと
XナリツプoflN1M15mノズルスリット巾   
  1.2− 空気圧       1.01 その結果、200m/−のツイン速度でもスプラッシユ
発生によるノズルの一次的及び二次的汚染は全く無く、
連続操業を行うことがで愈た。
Nozzles (7), (7 and baffles (15), (15)
ri spacing: 30 Baffle (15), (15') e tip spacing = 60
■Bass# (15), (15') and baffle (17)
, (17 lowest interval:
7ooss (amount of air suction) ÷ (amount of air ejected from the nozzle)! 5.0 Gas living conditions Snow Nozzle and X-nip oflN1M15m Nozzle slit width
1.2- Air pressure 1.01 As a result, there is no primary or secondary contamination of the nozzle due to splash generation even at twin speeds of 200 m/-.
It was a relief to be able to carry out continuous operation.

比較例 板厚α27−1板巾121?5m0スジリップ状溶融亜
鉛めっき鋼板上に、実施例1で用いた化成処理液を縦型
ラインによ秒浸漬塗布し、第2図に示される従来のガス
ツィビンダ装置を用いて皮膜付着量コン)−一ルを行っ
た。この時の条件は次の通りであった・ ガスワイビンダ条件t ノズルとストリップの間II 
 15■ノズルスリツシ巾     1.5− 空気圧          a8驚 その結果、 200 II/4110ライン速度ではス
プラッシユ発生によるノズルの一次的汚染は全く無かっ
たもoe、二次的汚染により約2時間の連続操業でノス
ルスリッ)の目詰りを生じ、操業が不可能となった・ 本発明の銅帯塗布波のガス!イビンダ装置を用−れ−1
200シ一以上の高速ラインでも高粘度低密度、そして
低表im*力の物性を有する塗布型化成処瑞液ある一社
塗料に対して、スプラッシユ発生によるノズルの二次的
汚染を招くことが無く、銅帯上に塗布された塗布液の皮
膜付着量コント田−ルが可能である。t″に1本発明に
よるガス9イビンダ装置は、将来出現するであろう超高
速溶融金属めつ1ラインにも適用可能となるものと考え
られる。
Comparative Example The chemical conversion treatment solution used in Example 1 was applied by dipping in a second on a vertical line onto a hot-dip galvanized steel sheet with a plate thickness of α27-1 and a plate width of 121 to 5 m0. A film adhesion amount control was conducted using the apparatus. The conditions at this time were as follows: Gas wi binder condition t Between nozzle and strip II
15 ■ Nozzle slit width 1.5 - Air pressure A8 As a result, there was no primary contamination of the nozzle due to splash generation at the 200 II/4110 line speed, but due to secondary contamination, the nozzle slit after about 2 hours of continuous operation) The gas in the copper band coating wave of the present invention caused clogging, making it impossible to operate! Use the Ibinda device-1
Even on a high-speed line of 200 sheets or more, it is possible to use paints from one manufacturer that have high viscosity, low density, and low surface resistance, which may cause secondary contamination of the nozzle due to splash generation. Therefore, it is possible to control the amount of film deposited on the copper strip. It is believed that the gas 9 ibinda device according to the present invention will be applicable to ultra-high-speed metal melting lines that will appear in the future.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図及び第2図韓共に従来のガスワイピング装置の断
面図である。第3図(a)は本発明のガスワイピング装
置の一実施例の断面図であり、同(b)はその一部切欠
自斜視図である・第4図は本発明の装スライビング−置
の更に一つの実施例の断面図である。 (4)側壁、(9天井壁、(勾化威処理浴、の、(7’
)ガスワイピングノズル、(14)、(14つ二次空気
、 (15)。 (15り二次空気取入れ用バッフル、 (116)、(
16/)仕切板、(17)、(17り空気とスプラツシ
エ分離用バッフル、(1B)、(18つ液戻し通路、(
19)、(19つ空気出口、(21)、(21り空気と
スプラッシユを分離するバッフル、(22)ガスワイピ
ングノズル用空気入口。 代理^ 弁理士  佐 藤 正 年
Both FIG. 1 and FIG. 2 are cross-sectional views of a conventional gas wiping device. FIG. 3(a) is a sectional view of one embodiment of the gas wiping device of the present invention, and FIG. 3(b) is a partially cutaway self-perspective view thereof. FIG. 4 is a sectional view of an embodiment of the gas wiping device of the present invention. FIG. 6 is a cross-sectional view of yet another embodiment. (4) Side wall, (9 ceiling wall, (gradation treatment bath, (7'
) Gas wiping nozzle, (14), (14 secondary air, (15). (15 secondary air intake baffle, (116), (
16/) Partition plate, (17), (17 Baffle for air and splash separation, (1B), (18) Liquid return passage, (
19), (19 air outlets, (21), (21) baffle to separate air and splash, (22) air inlet for gas wiping nozzle. Attorney: Masatoshi Sato

Claims (1)

【特許請求の範囲】[Claims] 鋼帯o*wec連続的に塗布される塗布■化成処理筐又
韓楡料IIsの塗布液の余剰分をガスワイピングする装
置Kお−て、塗布液をガスツイビンダナペ自−帯の走行
ライン個所に銅帯の走行とは無関係″&II−を設け、
該画−内O上部にガスワイピンダノズルを設け、該ガス
ワイビンダlズルO下部に間隔を置−で二次空気通路l
l或のためのバッフルを設け、該バッフルの下部に前記
IPI−の外部へ通じる空気吸引機構を設けた仁とを特
徴とする銅帯塗布液のガスワイピンダ装置。
Steel strip O*WEC Coating that is applied continuously - A device for gas wiping the excess of the coating liquid of the chemical conversion treatment box or Korean material IIs. ``&II-'' is installed at the line location, unrelated to the running of the copper strip,
A gas wiper nozzle is provided in the upper part of the pipe, and a secondary air passage is provided at a spaced interval in the lower part of the gas wiper nozzle.
1. A gas wiper device for a copper strip coating liquid, characterized in that a baffle is provided for the IPI, and an air suction mechanism communicating with the outside of the IPI is provided below the baffle.
JP15388481A 1981-09-30 1981-09-30 Gas wiping device for liquid coated on steel strip Granted JPS5855069A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15388481A JPS5855069A (en) 1981-09-30 1981-09-30 Gas wiping device for liquid coated on steel strip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15388481A JPS5855069A (en) 1981-09-30 1981-09-30 Gas wiping device for liquid coated on steel strip

Publications (2)

Publication Number Publication Date
JPS5855069A true JPS5855069A (en) 1983-04-01
JPS6216140B2 JPS6216140B2 (en) 1987-04-10

Family

ID=15572212

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15388481A Granted JPS5855069A (en) 1981-09-30 1981-09-30 Gas wiping device for liquid coated on steel strip

Country Status (1)

Country Link
JP (1) JPS5855069A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0217267U (en) * 1988-07-11 1990-02-05
JP2015078405A (en) * 2013-10-16 2015-04-23 Jfeスチール株式会社 Molten metal plating device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0217267U (en) * 1988-07-11 1990-02-05
JP2015078405A (en) * 2013-10-16 2015-04-23 Jfeスチール株式会社 Molten metal plating device

Also Published As

Publication number Publication date
JPS6216140B2 (en) 1987-04-10

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