JPS5852153B2 - Cooling system - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an apparatus for cooling an object to be cooled using an evaporative cooling method, and in particular to a cooling apparatus that is divided into a container for storing an object to be cooled and a cooler for cooling this container. related.

In this type of cooling device, a boiling cooling liquid (e.g. Freon liquid) can be hermetically sealed in the container, and the object to be cooled (
For example, semiconductor devices) are immersed in the container, and the cooler is in surface contact with the container to remove heat from the container through the contact surface.

In this way, in a cooling system that is divided into a container and a cooler, when replacing the object to be cooled, the container can be removed from the cooler, the cooling liquid can be drained, and the object to be cooled can be replaced. In comparison, the container for storing objects to be cooled can be made smaller, and the work of replacing objects to be cooled can be simplified, and even if the cooler is of the boiling type, there is no need to replace the coolant in the cooler. It has the following advantages.

In such a cooling device, it is desirable that the connection between the container and the cooler has high heat conduction efficiency at the contact surface.

For this reason, conventional equipment consists of thick plates with sufficient rigidity and flatness on the contact surfaces of both the container and the cooler, and uses strong connecting means such as bolts to maintain sufficient contact pressure between the container and the cooler. The thermal conductivity was increased by tightening the steel.

In such a configuration, a good contact condition can be obtained when the contact area between the container and the cooling liquid is relatively small, but in the case of a large capacity cooling device that requires a large contact area, the contact surface Due to the flatness relationship, even when the contact pressure was increased, a good contact condition could not be obtained, the thermal resistance at the contact surface was large, and the cooling efficiency was lower than that of a case that is not divided into a container and a cooler.

An object of the present invention is to provide a cooling device that can improve the thermal conductivity of the contact surface between a container and a cooler.

Hereinafter, one embodiment of the present invention will be described in detail.

In FIG. 1, a container 1 for storing objects to be cooled includes a boiling cooling liquid 2 (for example, a fluorocarbon liquid) and a position immersed in the liquid 2.

(semiconductor device) is hermetically sealed.

The cooler 4 is placed on the container 1, and its lower bottom plate 5 is in surface contact with the upper lid 1A of the container 1 to cool the lid 1A of the connected tag container 1, thereby condensing the vapor of the liquid in the container 1. It is designed to take away that heat energy.

The figure shows a boiling cooling type cooler 4, but even if a tilting type cooler such as a liquid circulation type or air cooling type is used, it is configured to make surface contact with the container 1. be.

Here, as shown in an enlarged view of the connecting part between the container 1 and the cooler 4 in FIG. ,Silver)
The lid is configured to easily swell toward the bottom plate 5 when the internal pressure increases due to boiling of the liquid 2 sealed in the container 1.

Note that 6 is a tightening bolt for connecting the container 1 and the cooler 4.

However, when the object to be cooled 3 and the liquid 2 are sealed in the container 1, the container 1 is sealed at room temperature and at approximately atmospheric pressure.

Then, the container 1 is connected to the cooler 4, and when the coolant 2 boils due to heat generated by the operation of the object to be cooled and its internal pressure becomes high, the lid IA of the container 1 made into a thin plate is attached to the bottom plate of the cooler 4. Since the container 1 and the cooler 4 are fixed with the tightening bolts 6, the contact pressure between the lid IA and the bottom plate 5 is increased.

Therefore, even if the flatness of the cooler 4 is poor, and even if the tightening bolts 6 that connect the container 1 and the cooler 4 are not tightened strongly, the boiling of the liquid 2 will cause the lid 1 to touch the bottom plate 5I. It is possible to achieve close contact over all contact surfaces and increase thermal conductivity between them.

In addition, the contact pressure between the bottom plate 5 and the lid 1A increases as the amount of heat generated by the object 3 to be cooled increases, and the thermal conductivity improves, making it preferable as a cooling device.

The bottom plate 5 of the cooler 4 is made of a material with high thermal conductivity like the lid 1A of the container 1, but the thickness of the bottom plate is preferably such that it can withstand the pressing force of one person on the lid.

Further, C is preferable, in which a compound with high thermal conductivity is interposed on the contact surface between the bottom plate 5 and one lid to compensate for the smoothness of the bottom plate 5 and one lid.

Furthermore, in the above embodiment, the container 1 and the cooler 4 are not limited to one-to-one connection, but can also be applied to the case where a plurality of containers for storing objects to be cooled are connected to one cooler. It is.

Furthermore, in the above embodiment, the entire surface of each lid of the container 1 is not limited to a thin plate, and a portion of the lid may be formed into a thin plate, such as only the center portion of the lid is made of a thin plate.

As explained above, the cooling device according to the present invention cannot obtain good heat conduction even if the contact surface between the cooler and the container has poor flatness, and even if the connection between the two is not strong. There is an effect that can be done.

Furthermore, since the lid of the container is made of a thin plate, its weight can also be reduced.

[Brief explanation of drawings]

FIG. 1 is a side view showing an embodiment of a cooling device according to the present invention, and FIG. 2 is a side sectional view of a main part in FIG. 1. 1... Container, 1 person... Lid, 2...
...Liquid, 3...Object to be cooled, 4...Cooler, F...Bottom plate, 6...Tighten with bolts.

Claims (1)

[Claims] 1. A cooling device comprising a container for storing objects to be cooled in which objects to be cooled are immersed in boiling cooling liquid sealed in an airtight state, and a cooler connected to the container in surface contact to cool the container, A cooling device characterized in that the container is provided with a thin plate on a surface in contact with the cooler that swells toward the cooler when internal pressure increases due to boiling of the liquid.