JPS5850164B2 - Surface protection method - Google Patents

Surface protection method

Info

Publication number
JPS5850164B2
JPS5850164B2 JP52037817A JP3781777A JPS5850164B2 JP S5850164 B2 JPS5850164 B2 JP S5850164B2 JP 52037817 A JP52037817 A JP 52037817A JP 3781777 A JP3781777 A JP 3781777A JP S5850164 B2 JPS5850164 B2 JP S5850164B2
Authority
JP
Japan
Prior art keywords
adhesive
film
surface protection
peeling
ultraviolet rays
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP52037817A
Other languages
Japanese (ja)
Other versions
JPS53121832A (en
Inventor
共久 太田
忠光 中山
紀代史 中尾
功 塚越
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP52037817A priority Critical patent/JPS5850164B2/en
Publication of JPS53121832A publication Critical patent/JPS53121832A/en
Publication of JPS5850164B2 publication Critical patent/JPS5850164B2/en
Expired legal-status Critical Current

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  • Laminated Bodies (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Description

【発明の詳細な説明】 本発明はステンレス板、アルミニウム板などの金属板お
よび塗装金属板あるいは化粧板、ガラス板などの運搬、
加工時の傷防止のための一時的な表面保護力法に関する
もので、光硬化性を有する粘着剤を塗布してなる表面保
護用粘着フィルムを保護すべき被着体上に貼付け、該被
着体の運搬、加工などを完了した後、無用となった表面
保護フィルムを剥離する前に紫外線を照射し粘着剤を硬
化させることを特徴とする表面保護力法に関するもので
ある。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to transportation of metal plates such as stainless steel plates and aluminum plates, painted metal plates, decorative plates, glass plates, etc.
This method relates to a temporary surface protection method to prevent scratches during processing, and involves applying a surface protection adhesive film coated with a photocurable adhesive onto the adherend to be protected. The present invention relates to a surface protection method characterized by irradiating ultraviolet rays to harden the adhesive before peeling off the useless surface protection film after the body has been transported, processed, etc.

従来、一時的な表面保護材料として、紙、布、プラスチ
ックフィルムなどの基材に天然ゴム、合成ゴムなどを主
成分とする粘着剤を塗布した構成からなる粘着フィルム
が用いられてきた。
Conventionally, adhesive films have been used as temporary surface protection materials, which are made by coating a base material such as paper, cloth, or plastic film with an adhesive containing natural rubber, synthetic rubber, or the like as a main component.

この粘着フィルムは貼合わせの簡便さから広く使用され
ているが、粘着剤が極めて不安定で塑性変形しやすい材
料であるため、次のような欠点を有していた。
Although this adhesive film is widely used because of its ease of lamination, it has the following drawbacks because the adhesive is extremely unstable and is a material that easily undergoes plastic deformation.

1)被着体に貼付けたのち、被着体表面上の微細なりレ
バスに粘着体が良く流入し、接触面積を増すため、接着
力は短時間に大きくなり過ぎ、剥離し難くなる。
1) After being attached to an adherend, the adhesive material flows well into the fine grooves on the surface of the adherend and increases the contact area, so the adhesive force becomes too large in a short period of time, making it difficult to peel off.

2)凝集力が小さいために剥離するとき、粘着剤層間の
破壊が生じ被着体上に転着しやすい。
2) Since the cohesive force is small, when the adhesive layer is peeled off, the adhesive layer is likely to break and be transferred onto the adherend.

3)曲げ、絞りなどの加工を行うと圧力ないしはセン断
応力の集中する場所で特に転着しやすくなる。
3) When processing such as bending or drawing is performed, adhesion is particularly likely to occur in areas where pressure or shear stress is concentrated.

これらの粘着フィルムの欠点に対して、粘着剤を架橋す
ること、高分子量のゴムを使用することにより粘着剤の
塑性変形をある程度抑制したり、凝集力を増すなどの提
案がなされているが、前記欠点は常温で被着体に容易に
貼り付けられることの条件下では基本的には解決されて
いない。
To address these drawbacks of adhesive films, proposals have been made to suppress the plastic deformation of the adhesive to some extent or increase its cohesive strength by crosslinking the adhesive or using high molecular weight rubber. The above-mentioned drawbacks have basically not been solved under the condition that the adhesive can be easily attached to an adherend at room temperature.

一般に粘着フィルムが工業的に被着体上に貼付けられた
時に必要な接着力は180°方向、300mw1分の速
度で剥離したとき、単純な運搬時の保護のみの場合でも
50 g / 25 mm以上、曲げ、絞りなどの加工
を行う場合には200g/25mm以上、好ましくは、
300g/25mm以上を必要とする。
In general, when an adhesive film is applied industrially to an adherend, the adhesive force required is 50 g / 25 mm or more when peeled in a 180° direction at a speed of 300 mw for 1 minute, even for simple protection during transportation. , 200g/25mm or more, preferably when performing processing such as bending or drawing.
300g/25mm or more is required.

一方、剥離作業性の点からは低ければ低い方が好ましく
、200 g / 25 mrIL以上になれば、剥離
作業が困難になってくる。
On the other hand, from the point of view of peeling workability, a lower value is preferable, and if it exceeds 200 g/25 mrIL, peeling work becomes difficult.

粘着フィルムの接着力の設定は、貼付時に必要な最低の
接着力を設定して行われるが、加工から剥離までの時間
は種々の行程ルートを経るため、長期間を要し、剥離す
る際の接着力は加工時より一段と高くなっているのが普
通であり、剥離作業が更に困難になるとともに、粘着剤
が被着体上に転着しやすくなる。
The adhesive strength of the adhesive film is set by setting the minimum adhesive strength required at the time of application, but since the time from processing to peeling goes through various process routes, it takes a long time, and the time required for peeling is The adhesive strength is usually much higher than during processing, making the peeling process more difficult and making it easier for the adhesive to transfer onto the adherend.

本発明はこれらの従来の表面保護粘着フィルムの欠点を
考慮してなされたもので、その目的は被着体への貼付が
容易で貯蔵、運搬、加工時においては強い接着力を保持
させる一力、用に供したのち剥離する場合には接着力を
低下させて剥離作業を容易にするとともに粘着剤の被着
物への転着を防止可能とした表面保護力法を提供するこ
とにある。
The present invention was developed in consideration of these drawbacks of conventional surface protection adhesive films, and its purpose is to provide a film that is easy to apply to adherends and maintains strong adhesion during storage, transportation, and processing. Another object of the present invention is to provide a surface protection method that reduces the adhesive strength to facilitate the peeling operation when the adhesive is to be peeled off after use, and also prevents the adhesive from transferring to the adherend.

か\る目的は本発明によれば透明なプラスチック基材に
光硬化性を有する粘着剤を塗布してなる粘着フィルムを
被着体に貼付け、用に供した後前記フィルム基材表面に
紫外線を照射することにより粘着剤を架橋硬化させるこ
とによって実施することができる。
According to the present invention, an adhesive film made of a transparent plastic substrate coated with a photocurable adhesive is attached to an adherend, and after use, the surface of the film substrate is exposed to ultraviolet rays. This can be carried out by crosslinking and curing the adhesive by irradiation.

本発明に用いる粘着フィルムの基材フィルムとしては紫
外線が透過し得るポリ塩化ビニル、ポリエチレン、ポリ
プロピレン、ポリエステルなどの透明なプラスチックフ
ィルムが使用される。
As the base film of the adhesive film used in the present invention, a transparent plastic film such as polyvinyl chloride, polyethylene, polypropylene, polyester, etc., through which ultraviolet rays can pass, is used.

光硬化性粘着剤は増感剤と (1)粘着剤主成分のポリマー中に光反応性を有する不
飽和結合を1分子あたり2個以上もたせる。
The photocurable adhesive has two or more photoreactive unsaturated bonds per molecule in the sensitizer and (1) the polymer that is the main component of the adhesive.

あるいは (2)通常の粘着剤中に感光性のあるモノマーなどの低
分子化合物を混合することによって達成し得る。
Alternatively, (2) it can be achieved by mixing a low-molecular compound such as a photosensitive monomer into an ordinary adhesive.

(1)に関してはアクリル酸エステルあるいはメタクリ
ル酸エステル共重合体中に共存させたアクリル酸あるい
はメタクリル酸をグリシジル(メタ)アクリレートを反
応させたり、同じく共重合体中に水酸基を有するβ−ヒ
ドロキシエチル(メタ)アクリレートなどのモノマーを
共存させて、ポリイソシアネートと水酸基を有するモノ
マーとの化合物であるハーフウレタンとを反応させるな
どの方法によって二重結合をポリマー中に導入するこむ
ができる。
Regarding (1), acrylic acid or methacrylic acid coexisting in an acrylic ester or methacrylic ester copolymer may be reacted with glycidyl (meth)acrylate, or β-hydroxyethyl (β-hydroxyethyl) having a hydroxyl group in the copolymer may be used. Double bonds can be introduced into the polymer by a method such as reacting polyisocyanate with half-urethane, which is a compound of a monomer having a hydroxyl group, in the presence of a monomer such as meth)acrylate.

(2)の方法は、通常のゴム系あるいはアクリル系粘着
剤がそのまま利用出来る点で効率的な方法である。
Method (2) is an efficient method in that ordinary rubber-based or acrylic-based adhesives can be used as they are.

すなわち、従来の粘着剤中に感光性モノマーなどの低分
子化合物を1係から50饅混合したものを用いる。
That is, a mixture of 1 part to 50 parts of a low-molecular compound such as a photosensitive monomer in a conventional adhesive is used.

上記感光性モノマーとしてはアクリル酸エステルあるい
はメタクリル酸エステルで分子中に重合せしめうる二重
結合を1〜4個含有したもので、好ましくは2個以上の
多官能性のものであり例えば 1.4−ブチレングリコールジアクリレート、1.6−
ヘキサングリコールジアクリレート、ネオペンチルグリ
コールジアクリレート、(ポリ)エチレングリコールジ
アクリレート、トリメチロールプロパントリ(メタ)ア
クリレート、テトラメチロールメタンテトラアクリレー
ト、が挙げられる。
The photosensitive monomer is an acrylic ester or methacrylic ester containing 1 to 4 polymerizable double bonds in the molecule, preferably a polyfunctional monomer with 2 or more double bonds, for example 1.4. -Butylene glycol diacrylate, 1.6-
Examples include hexane glycol diacrylate, neopentyl glycol diacrylate, (poly)ethylene glycol diacrylate, trimethylolpropane tri(meth)acrylate, and tetramethylolmethanetetraacrylate.

これらの配合に更に反応性向上のために増感剤を例えば
ジアセチル、ベンジル、ベンゾフェノン、ベンゾイン、
ω−ブロモアセトフェノン、クロロアセトン、ベンゾキ
ノン、アントラキノン、2−エテルアントラキノン、ベ
ンゾインイソプロピルエーテル、ベンゾインエテルエー
テルなどの有機カルポール化合物を0.1〜10%程度
混合して粘着剤とする。
In order to improve reactivity, sensitizers such as diacetyl, benzyl, benzophenone, benzoin, etc. are added to these formulations.
An adhesive is prepared by mixing about 0.1 to 10% of organic carpol compounds such as ω-bromoacetophenone, chloroacetone, benzoquinone, anthraquinone, 2-ether anthraquinone, benzoin isopropyl ether, and benzoin ether ether.

これらの構成からなる粘着剤を通常の方法で基材フィル
ムに塗工して粘着フィルムを得る。
A pressure-sensitive adhesive film is obtained by applying the pressure-sensitive adhesive having these structures onto a base film using a conventional method.

この粘着フィルムを表面保護しようとする物体に貼付け
、運搬、加工後の剥離前に市販の超高圧、高圧水銀灯等
によって2000〜4000人の波長を有する紫外線を
5sec以上、好ましくは3Qsec以上照射すれば感
光性基が反応し、重合、架橋などの高分子化反応を起し
、粘着剤が固化し、接着力を低下させるとともに転着が
極めて生じ難くなる。
After applying this adhesive film to the object whose surface is to be protected, transporting it, and before peeling it off after processing, it is irradiated with ultraviolet rays having a wavelength of 2,000 to 4,000 people for 5 seconds or more, preferably 3Q seconds or more using a commercially available ultra-high pressure, high-pressure mercury lamp, etc. The photosensitive groups react, causing polymerization reactions such as polymerization and crosslinking, and the adhesive solidifies, reducing adhesive strength and making it extremely difficult for transfer to occur.

粘着剤の固化によって接着力が低下する理由は粘着フィ
ルムの接着力は「接着J(1968年3月号、高分子刊
行会)で解明されている如く、剥離時の粘着剤の塑性流
動の仕事にその大部分が費やされるものであるから、粘
着剤の固化によって塑性流動による仕事量が小さくなる
ために接着力が低下するものと思われる。
The reason why the adhesive strength decreases as the adhesive hardens is that the adhesive strength of an adhesive film is due to the work of the plastic flow of the adhesive during peeling, as explained in "Adhesive J" (March 1968 issue, Kobunshi Publishing Association). Since the majority of the adhesive is spent on the adhesive, it is thought that the adhesive force decreases because the amount of work due to plastic flow becomes smaller as the adhesive solidifies.

粘着剤を固化することは転着の防止には顕著に効果的で
あり、接着力が低下するとともに微細なりレバスに浸入
した粘着剤がちぎれることなく引き出されるためと思わ
れる。
Solidifying the adhesive is significantly effective in preventing transfer, and this is thought to be because the adhesive force decreases and fine particles of the adhesive that have penetrated into the rebus are pulled out without tearing.

この場合、紫外線照射は基材フィルムを通して行われる
もので空気中の酸素はおのずと遮断されているため、硬
化反応は速かに進行する。
In this case, since the ultraviolet rays are irradiated through the base film and oxygen in the air is naturally blocked, the curing reaction proceeds quickly.

ここで硬化の程度は粘着剤中の光反応基の量、種類によ
って如何ようにも調節できるが、接着力が50g725
mm以下になれば剥離作業性に支障をきたさないし、転
着も殆んどなくなるので、この程度の接着力にすること
を目標とすればよい。
Here, the degree of curing can be adjusted in any way depending on the amount and type of photoreactive groups in the adhesive, but the adhesive strength is 50g725
If the adhesive strength is less than mm, the peeling workability will not be affected and there will be almost no transfer, so it is sufficient to aim for an adhesive strength of this level.

以下実施例をもって説明する。This will be explained below using examples.

実施例 1 アクリル系粘着剤(東亜合成化学製商品名アロンS
1511x)100部、多官能ポリイソシアネート(日
本ポリウレタン製商品名コロネートL)1部にトリメチ
ロールプロパントリアクリレート5部、ベンゾフェノン
0.1部を添加し、60μのポリエチレンフィルムに乾
燥後塗布量が10μになるように塗工し、100605
分乾燥し、粘着フィルムを製造した。
Example 1 Acrylic adhesive (trade name: Aron S manufactured by Toagosei Chemical Co., Ltd.
100 parts of 1511 Coat it so that it becomes 100605
The mixture was dried for several minutes to produce an adhesive film.

この粘着フィルムを厚さ0、6 mrnのステンレス板
(430BA板)に常温で貼付けた後、1ケ月間放置し
た。
This adhesive film was attached to a stainless steel plate (430BA plate) with a thickness of 0.6 mrn at room temperature, and then left for one month.

このステンレス板のフィルム表面上から2kWの高圧水
銀灯で20礪の距離より、紫外線を15sec照射し1
0分後剥離した。
Ultraviolet rays were irradiated for 15 seconds on the film surface of this stainless steel plate from a distance of 20 cm using a 2 kW high-pressure mercury lamp.
It was peeled off after 0 minutes.

各段階での接着力、転着の有無を表−1に示す。Table 1 shows the adhesive strength and presence or absence of adhesion at each stage.

注)、 接着力の測定法 JIS C−2107準拠。note), How to measure adhesive strength Compliant with JIS C-2107.

5US−430BAに対する粘着力を 20℃1800剥離、引張速度 300mm/分の条件下で測定。Adhesive strength to 5US-430BA 20℃1800 peeling, tensile speed Measured under the condition of 300mm/min.

紫外線を照射しない場合は接着力が増大し転着を生じた
が、本発明の場合は接着力も小さく剥離が容易で転着は
起こらなかった。
When no ultraviolet rays were irradiated, the adhesive force increased and adhesion occurred, but in the case of the present invention, the adhesive force was small and peeling was easy, and no adhesion occurred.

比較例 1 実施例1のトリメチロールプロパントリアクリレート、
ベンゾフェノンを除いた粘着剤を塗布した粘着フィルム
を製造し、同様にステンレス板に貼付けたときの結果を
表−2に示す。
Comparative Example 1 Trimethylolpropane triacrylate of Example 1,
Table 2 shows the results when an adhesive film coated with an adhesive excluding benzophenone was produced and similarly attached to a stainless steel plate.

紫外線を照射しないものも、照射したものも転着を生じ
た。
Transfer occurred in both the samples that were not irradiated with ultraviolet rays and those that were irradiated with ultraviolet rays.

実施例 2 実施例1、比較例1で得た粘着フィルムを厚さ1.5m
m大きさ50mm大50mmのステンレス板の両面に貼
付けて直ちにスパン間20間のヤゲン型で90°、先端
3Rの曲げ加工を行うとともに曲げ加工品の平面に対し
て夫々垂直に紫外線を実施例−1と同様に照射した。
Example 2 The adhesive film obtained in Example 1 and Comparative Example 1 was made to a thickness of 1.5 m.
Example of applying ultraviolet rays perpendicularly to the plane of the bent product. Irradiation was carried out in the same manner as in 1.

このときの転着の状態を表−3に示す。Table 3 shows the state of the transfer at this time.

以上のように光硬化性を有する粘着剤を塗布してなる表
面保護用粘着フィルムを被着体に貼り付は運搬、加工後
の剥離前に紫外線を照射し、粘着剤を硬化せしめること
によって、従来の粘着フィルムの欠点であった剥離性が
著しく改善され、粘着剤の転着も殆んど皆無になった。
As described above, a surface protection adhesive film coated with a photocurable adhesive is applied to an adherend by irradiating it with ultraviolet rays to harden the adhesive before being peeled off after transportation and processing. The peelability, which was a drawback of conventional adhesive films, has been significantly improved, and there is almost no adhesive transfer.

Claims (1)

【特許請求の範囲】[Claims] 1 透明なプラスチックフィルム基材に光硬化性を有す
る粘着剤を塗布してなる粘着フィルムを被着体に貼付け
、用に供した後前記フィルム基材表面に紫外線を照射す
ることにより粘着剤を架橋硬化させ剥離することを特徴
とする表面保護力法。
1. An adhesive film made by applying a photocurable adhesive to a transparent plastic film base material is attached to an adherend, and after use, the adhesive is cross-linked by irradiating the surface of the film base material with ultraviolet rays. A surface protection method characterized by curing and peeling.
JP52037817A 1977-04-01 1977-04-01 Surface protection method Expired JPS5850164B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP52037817A JPS5850164B2 (en) 1977-04-01 1977-04-01 Surface protection method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP52037817A JPS5850164B2 (en) 1977-04-01 1977-04-01 Surface protection method

Publications (2)

Publication Number Publication Date
JPS53121832A JPS53121832A (en) 1978-10-24
JPS5850164B2 true JPS5850164B2 (en) 1983-11-09

Family

ID=12508067

Family Applications (1)

Application Number Title Priority Date Filing Date
JP52037817A Expired JPS5850164B2 (en) 1977-04-01 1977-04-01 Surface protection method

Country Status (1)

Country Link
JP (1) JPS5850164B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
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WO2006094177A1 (en) 2005-03-02 2006-09-08 3M Innovative Properties Company (meth)acrylic film, and marking film and receptor sheet using the same

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61187248A (en) * 1985-02-14 1986-08-20 Bando Chem Ind Ltd Dicing method for semiconductor wafer
JPS6254937A (en) * 1985-09-04 1987-03-10 Bando Chem Ind Ltd Dicing method of semiconductor wafer
JPH0739565B2 (en) * 1985-09-04 1995-05-01 バンドー化学株式会社 Pressure sensitive adhesive sheet
JPH0751697B2 (en) * 1985-09-04 1995-06-05 バンドー化学株式会社 Pressure sensitive adhesive sheet
EP0191534B1 (en) * 1985-02-14 1990-05-23 Bando Chemical Industries, Ltd. A method for dicing a semiconductor wafer
JPH0635569B2 (en) * 1985-09-04 1994-05-11 バンドー化学株式会社 Pressure sensitive adhesive sheet
JPH0655929B2 (en) * 1985-09-04 1994-07-27 バンドー化学株式会社 Pressure sensitive adhesive sheet
JPH0823001B2 (en) * 1985-09-10 1996-03-06 日東電工株式会社 Adhesive film
JPH0643143Y2 (en) * 1985-12-12 1994-11-09 リンテック株式会社 Adhesive force control device for adhesive to bond semiconductor wafer and thin plate
JP2510416B2 (en) * 1986-08-08 1996-06-26 バンドー化学株式会社 Semiconductor wafer dicing method
JPH03278444A (en) * 1990-09-07 1991-12-10 Bando Chem Ind Ltd Dicing of semiconductor wafer
JPH0689303B2 (en) * 1990-09-28 1994-11-09 バンドー化学株式会社 Pressure sensitive adhesive sheet
US5827394A (en) * 1996-07-15 1998-10-27 Vanguard International Semiconductor Corporation Step and repeat exposure method for loosening integrated circuit dice from a radiation sensitive adhesive tape backing
JP7124279B2 (en) * 2017-09-11 2022-08-24 大日本印刷株式会社 Method for manufacturing transfer sheet and decorative board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006094177A1 (en) 2005-03-02 2006-09-08 3M Innovative Properties Company (meth)acrylic film, and marking film and receptor sheet using the same

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Publication number Publication date
JPS53121832A (en) 1978-10-24

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