JPS5849674A - 半導体素子搭載用基板の製造法 - Google Patents

半導体素子搭載用基板の製造法

Info

Publication number
JPS5849674A
JPS5849674A JP56146133A JP14613381A JPS5849674A JP S5849674 A JPS5849674 A JP S5849674A JP 56146133 A JP56146133 A JP 56146133A JP 14613381 A JP14613381 A JP 14613381A JP S5849674 A JPS5849674 A JP S5849674A
Authority
JP
Japan
Prior art keywords
metal
integrated
ceramics
plate
nickel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56146133A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62781B2 (enrdf_load_stackoverflow
Inventor
保敏 栗原
鈴木　芳博
大上　三千男
八野　耕明
柳　光雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP56146133A priority Critical patent/JPS5849674A/ja
Publication of JPS5849674A publication Critical patent/JPS5849674A/ja
Publication of JPS62781B2 publication Critical patent/JPS62781B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Laminated Bodies (AREA)
  • Ceramic Products (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP56146133A 1981-09-18 1981-09-18 半導体素子搭載用基板の製造法 Granted JPS5849674A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56146133A JPS5849674A (ja) 1981-09-18 1981-09-18 半導体素子搭載用基板の製造法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56146133A JPS5849674A (ja) 1981-09-18 1981-09-18 半導体素子搭載用基板の製造法

Publications (2)

Publication Number Publication Date
JPS5849674A true JPS5849674A (ja) 1983-03-23
JPS62781B2 JPS62781B2 (enrdf_load_stackoverflow) 1987-01-09

Family

ID=15400882

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56146133A Granted JPS5849674A (ja) 1981-09-18 1981-09-18 半導体素子搭載用基板の製造法

Country Status (1)

Country Link
JP (1) JPS5849674A (enrdf_load_stackoverflow)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4601103A (en) * 1984-06-26 1986-07-22 Kai Cutlery Center Co., Ltd. Cutter having circular rotary blade
JPS6398688A (ja) * 1986-10-16 1988-04-30 Sony Magnescale Inc ホログラム基板
JPH01286348A (ja) * 1988-05-12 1989-11-17 Mitsubishi Electric Corp 半導体装置
JP2016006015A (ja) * 2015-09-28 2016-01-14 日立化成株式会社 はんだ接着体

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4959965A (enrdf_load_stackoverflow) * 1972-10-13 1974-06-11

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4959965A (enrdf_load_stackoverflow) * 1972-10-13 1974-06-11

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4601103A (en) * 1984-06-26 1986-07-22 Kai Cutlery Center Co., Ltd. Cutter having circular rotary blade
JPS6398688A (ja) * 1986-10-16 1988-04-30 Sony Magnescale Inc ホログラム基板
JPH01286348A (ja) * 1988-05-12 1989-11-17 Mitsubishi Electric Corp 半導体装置
JP2016006015A (ja) * 2015-09-28 2016-01-14 日立化成株式会社 はんだ接着体

Also Published As

Publication number Publication date
JPS62781B2 (enrdf_load_stackoverflow) 1987-01-09

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