JPS5847841B2 - Method and device for printing ink-like resistor - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention involves baking an ink-like resistor applied to a substrate,
The present invention relates to a method and apparatus for removing a planar heating element, and aims to prevent a resistor from flowing out during baking.

Generally, a resistor having a positive temperature coefficient of resistance is manufactured by dissolving the ink in a solvent and applying it to a substrate and baking it.

Conventionally, an apparatus shown in FIG. 1 has been used to perform this baking.

That is, in this FIG. 1, 1 is a conveyor on which a substrate coated with an ink-like resistor is placed and transported;
is the furnace body.

3 is a heat source for baking provided within the furnace body 2.

As the heat source 3 for this baking, infrared heaters or far-infrared heaters, which are inexpensive and highly efficient, are often used.

Furthermore, since an infrared heater or a far-infrared heater heats a resistor using radiant heat, it is necessary to maintain a constant distance between the resistor and the heater in order to obtain a constant temperature.

For this reason, a slat-type conveyor is used as the conveyor 1 for mounting and transporting substrates coated with resistors.

However, when using this slat type conveyor, the heat capacity of the conveyor itself is larger than that of the resistor and the board, and in order to keep the temperature rise characteristics of the resistor during baking constant, the heating temperature rise characteristics of the conveyor itself must be the same. It is necessary to

In this case, a considerable amount of energy will be radiated from the infrared heat or far infrared heater, and the heat source 3 must be provided close to the conveyor.

However, if the distance between the heat source 3 and the conveyor 1 is short, the temperature rise on the surface of the resistor becomes extremely abnormal, causing the solvent that melts the resistor to boil and scatter, causing the resistor to flow out as shown in Figure 2. However, there was a drawback that the leaked material was burned and could no longer be put to practical use.

In addition, in FIG. 2, 4 is a substrate, 5 is an electrode, and 6 is a resistor.

Furthermore, by reducing the amount of heat radiated from the infrared heater or the far-infrared heater, it is possible to prevent the resistor 6 from flowing out, but the resistance temperature characteristics of the baked resistor depend on the temperature rise rate during baking. Therefore, there was a drawback that the required resistance-temperature characteristics could not be obtained.

The present invention solves the above-mentioned conventional drawbacks, and one embodiment of the present invention will be described below with reference to FIGS. 3 and 4.

In FIG. 3, 11 is a slat type conveyor, and 12 is a furnace body.

A slat type conveyor 11 passes through this furnace body 12.

The furnace body 12 is divided into a front chamber 14 and a rear chamber 15 by a partition wall 13.
It is divided into.

16 is an infrared heater or a far infrared heater provided at the lower part of the front chamber 14, and 17 is an infrared heater or far infrared heater provided at the upper part of the rear chamber 15.

In the above structure, a substrate 20 such as a ceramic substrate on which an electrode 18 as shown in FIG.
1 and drives the slat type conveyor 11, the substrate 20 is conveyed into the furnace body 12.

Furnace body! In the front chamber 14 of No. 2, the slat type conveyor 11 is heated by an infrared heater or far infrared heater 16 in the front chamber 14, and the temperature of the resistor 19 is increased at a constant rate by heat conduction.

In this case, since the resistor 19 is heated by heat conduction from the slat type conveyor 11, only the surface is not locally heated, and the solvent does not boil.

Therefore, the resistor 19 does not flow out and maintains the state in which it was applied.

Thereafter, when the substrate 20 is transported by the slat-type conveyor 11 and placed in the rear chamber 15, the resistor 19 is burned onto the substrate 20 by the far-infrared heater 17.

As is clear from the above description, according to the present invention, a substrate coated with an ink-like resistor is first heated from below by conduction heat, the temperature is raised at a constant rate, and then radiated heat from above is applied to the substrate. Since the body is baked onto the substrate, the desired resistance-temperature characteristics can be obtained, and leakage of low-level antibodies can be prevented, making it an ideal product for industrial use.

[Brief explanation of the drawing]

Figure 1 is a cross-sectional view of a conventional ink-like resistor printing device, Figure 2
The figure is an oblique view of a planar heating element obtained by the same device, FIG. 3 is a sectional view of an ink-like resistor baking device showing an embodiment of the present invention, and FIG. 4 is a planar view printed by the same device. It is a diagonal double view of a heating element. 11... Slat type conveyor, 12...
・Furnace body, 14... Front chamber, 15...
Rear chamber, 16, 17... Infrared heater or far infrared heater, 19... Resistor, 20...
··substrate.

Claims (1)

[Claims] 1. Heating a substrate coated with an ink-like low antibody from below using conduction heat, and then baking the resistor onto the substrate from above using radiant heat from an infrared heater or a far-infrared heater. A method for printing an ink-like resistor characterized by: 2. A slat-type conveyor that carries and carries a substrate coated with an ink-like resistor, and a slat-type conveyor installed at the front bottom of this conveyor, which heats this conveyor and heats the resistor by conductive heat transmitted through this conveyor. An apparatus for printing an ink-like resistor, comprising a heating means and an infrared or far-infrared heater provided above the rear side of the conveyor to burn the heated resistor.