JPH048638Y2 - - Google Patents
Info
- Publication number
- JPH048638Y2 JPH048638Y2 JP1987020683U JP2068387U JPH048638Y2 JP H048638 Y2 JPH048638 Y2 JP H048638Y2 JP 1987020683 U JP1987020683 U JP 1987020683U JP 2068387 U JP2068387 U JP 2068387U JP H048638 Y2 JPH048638 Y2 JP H048638Y2
- Authority
- JP
- Japan
- Prior art keywords
- gas
- box
- hollow body
- heater
- heated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000002184 metal Substances 0.000 claims description 26
- 229910052751 metal Inorganic materials 0.000 claims description 26
- 239000000919 ceramic Substances 0.000 claims description 21
- 238000010438 heat treatment Methods 0.000 claims description 16
- 239000007789 gas Substances 0.000 description 14
- 229910000679 solder Inorganic materials 0.000 description 11
- 239000000853 adhesive Substances 0.000 description 10
- 230000001070 adhesive effect Effects 0.000 description 10
- 239000006071 cream Substances 0.000 description 10
- 238000005323 electroforming Methods 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 230000002195 synergetic effect Effects 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 230000035699 permeability Effects 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 238000007751 thermal spraying Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000008151 electrolyte solution Substances 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
Landscapes
- Resistance Heating (AREA)
- Direct Air Heating By Heater Or Combustion Gas (AREA)
- Porous Artificial Stone Or Porous Ceramic Products (AREA)
Description
【考案の詳細な説明】
（産業上の利用分野）
本考案は、はんだのリフロー、樹脂のキユアー
等に使用される赤外線ヒータ、特に、波長領域が
４〜25μmの遠赤外線を放射する赤外線ヒータに
関する。[Detailed description of the invention] (Industrial application field) The present invention relates to an infrared heater used for solder reflow, resin curing, etc., and particularly relates to an infrared heater that emits far infrared rays in a wavelength range of 4 to 25 μm. .
（従来の技術）
近時の電子機器では軽量・小型化の傾向から小
さな面積に多数の電子部品を搭載したプリント基
板（以下「高密度実装基板」という）が用いられ
るようになつてきた。従つて高密度実装基板にお
いて電子部品をクリームはんだで接合したり、或
いはこれらを接着材で接合する時に、電子部品の
間隙にクリームはんだを溶解させ、また接着材を
硬化させるための熱を十分に侵入させなければな
らないものである。このときの加熱装置としては
トンネル内の上下に赤外線ヒータを設置したリフ
ロー炉が用いられる。リフロー炉の赤外線ヒータ
はシースヒータだけを設置したり、或いは鉄板に
ヒータを取付けたもので、その放射波長は3μm以
下のものであつた。(Prior Art) In recent years, electronic devices have come to use printed circuit boards (hereinafter referred to as "high-density mounting boards") on which a large number of electronic components are mounted on a small area due to the trend towards lighter weight and smaller size. Therefore, when bonding electronic components with cream solder or adhesive on a high-density mounting board, it is necessary to provide sufficient heat to melt the cream solder and harden the adhesive in the gaps between the electronic components. It is something that must be penetrated. As a heating device at this time, a reflow oven with infrared heaters installed above and below inside the tunnel is used. Infrared heaters in reflow ovens have been installed with only a sheathed heater or with a heater attached to an iron plate, and the radiation wavelength has been 3 μm or less.
（考案が解決しようとする問題点）
ところで赤外線は直進するため、高密度実装基
板では電子部品が邪魔となつて、クリームはんだ
や接着剤が塗布された箇所にまで十分に赤外線が
到達しないことがあつた。それ故、クリームはん
だでのはんだ付けでは、はんだ付け不良を起こし
たり、また接着剤での接合では接着剤が完全に硬
化せず剥離してしまうということがあつた。(Problem that the invention aims to solve) By the way, infrared rays travel in a straight line, so on high-density mounting boards, electronic components may get in the way and the infrared rays may not fully reach the areas where cream solder or adhesive is applied. It was hot. Therefore, when soldering with cream solder, soldering defects may occur, and when joining with adhesive, the adhesive does not completely harden and may peel off.
また、従来の赤外線ヒータは波長領域が3μm以
下であるが、該波長域の赤外線は白色のものへの
吸収、特にはんだのような金属への吸収があまり
良くなく、従つてリフロー炉でクリームはんだを
完全に溶解させるためには、シースヒータへの電
流を多く流して発熱量を多くしなければならなか
つた。しかるに3μm以下の波長の赤外線は黒色の
ものによく吸収されるため、黒色をした電子部品
ばかりが加熱されることになる。しかも、クリー
ムはんだや接着剤への加熱を目的として温度を上
げると電子部品はさらに加熱され、ついには熱損
傷により機能劣化を起こしたり、全く使用不可能
な状態になつてしまうものがあつた。 In addition, conventional infrared heaters have a wavelength range of 3 μm or less, but infrared rays in this wavelength range are not well absorbed by white objects, especially metals such as solder. In order to completely melt the liquid, it was necessary to increase the amount of heat generated by passing a large amount of current to the sheath heater. However, infrared rays with a wavelength of 3 μm or less are well absorbed by black objects, so only black electronic components are heated. Moreover, when the temperature is raised to heat the cream solder or adhesive, the electronic components are heated even more, and some of them end up suffering functional deterioration due to heat damage, or become completely unusable.
よつて、本考案の目的は、高密度実装基板にお
いて搭載部品の間隙をも十分に加熱するばかりで
なく、クリームはんだや接着剤への熱吸収のよい
赤外線を放射する赤外線ヒータを提供することに
ある。 Therefore, the purpose of the present invention is to provide an infrared heater that not only sufficiently heats the gaps between mounted components on a high-density mounting board, but also emits infrared rays that have good heat absorption into cream solder and adhesive. be.
（問題点を解決するための手段）
上記目的を達成すべく、本考案が種々検討を重
ねたところ、赤外線ヒータの熱源自体を熱源とし
た熱風を吹き出させること、赤外線照射源として
セラミツクス層を用いることにより効率的に加熱
が可能となること、および通気性セラミツクス層
を利用することにより両者を機能的に結合でき、
その相乗的作用効果が効果的に発揮されることを
知り、本考案を完成した。(Means for Solving the Problems) In order to achieve the above object, the present invention has been studied variously, and it was found that the heat source of the infrared heater itself is used as the heat source to blow out hot air, and that a ceramic layer is used as the infrared irradiation source. This enables efficient heating, and the use of a breathable ceramic layer allows for a functional combination of the two.
After learning that the synergistic effect can be effectively exhibited, the present invention was completed.
本考案の要旨とするところは、箱状空胴体内に
電熱ヒータを設置するとともに、さらに加熱され
て赤外線を放射する通気性セラミツクス層を備え
た三次元網状金属体または多孔質金属焼結体から
成る通気性加熱面を前記電熱ヒータ上に設置し、
また前記箱状空胴体内に気体供給する気体供給手
段を該箱状空胴体に外部から取り付け、該箱状空
胴体内に供給された気体を前記通気性加熱面を経
て吹き出させるべく構成したことを特徴とする赤
外線ヒータである。 The gist of the present invention is to install an electric heater inside a box-shaped hollow body, and to create a three-dimensional mesh metal body or porous metal sintered body with a breathable ceramic layer that emits infrared rays when heated. placing a breathable heating surface on the electric heater;
Further, a gas supply means for supplying gas into the box-like hollow body is attached to the box-like hollow body from the outside, and the gas supplied into the box-like hollow body is blown out through the air-permeable heating surface. This is an infrared heater featuring the following.
本考案に使用するセラミツクスとしては、Ａ
２03、Ti02、Cr203、Mg0、Zr02、Si02等であり、
これらは例えば電鋳により製造される三次元網状
構造を有する多孔質金属板、つまり三次元網状金
属体（商品名“セルメツト”住友電光製）または
通気性を有する焼結金属支持体に焼付けたり、溶
射することにより設置される。 The ceramics used in this invention are A
2 0 3 , Ti0 2 , Cr 2 0 3 , Mg0, Zr0 2 , Si0 2 etc.,
These can be baked, for example, on a porous metal plate having a three-dimensional network structure produced by electroforming, that is, a three-dimensional network metal body (trade name "Celmet" manufactured by Sumitomo Electric Co., Ltd.) or a sintered metal support with air permeability. Installed by thermal spraying.
かくして、本考案によれば、セラミツクス層の
支持体として金属支持体を使用していることか
ら、セラミツクス単独の場合と比較して強度的に
もはるかに優れ、しかも金属体の熱伝導がよいこ
とからヒータの加熱面の隅々まで均一に加熱さ
れ、したがつて赤外線放射率が全体的に均一化さ
れ全体として放射効率も改善される。 Thus, according to the present invention, since a metal support is used as a support for the ceramic layer, the strength is far superior to that of ceramics alone, and the metal body has good thermal conductivity. The heating surface of the heater is heated uniformly from the heating surface to every corner of the heating surface of the heater, so that the infrared emissivity is made uniform throughout, and the radiation efficiency is improved as a whole.
また、本考案によれば、通気性加熱面を構成す
るのは、セラミツクス層を備えた多孔質金属焼結
体または三次元網状金属体であつて、いわゆるパ
ンチ孔板と比較して、セラミツクス層の加熱が金
属伝導によるばかりでなく気体の対流により直接
的に行われるためかなり改善される。 Furthermore, according to the present invention, the air-permeable heating surface is composed of a porous metal sintered body or a three-dimensional mesh metal body having a ceramic layer. This is considerably improved since the heating is done not only by metal conduction but also directly by gas convection.
（作用）
箱状空胴体内および通気性加熱面を通過する時
に加熱された気体は上記通気性加熱面を通つて被
加熱体に吹き付けられ、赤外線が到達しないよう
な狭い間隙でも容易に侵入し、また通気性加熱面
を構成する加熱されたセラミツクス層からは金属
や白色物への吸収の良好な４〜25μmの赤外線が
放射される。このように熱風と赤外線を共用する
ことによりその相乗作用で高密度実装基板に対し
クリームはんだや接着剤の熱処理をさらに効率的
に行うことができる。(Function) The gas heated when passing through the box-shaped hollow body and the air-permeable heating surface is blown onto the object to be heated through the air-permeable heating surface, and can easily enter even narrow gaps where infrared rays cannot reach. Furthermore, the heated ceramic layer constituting the air-permeable heating surface emits infrared rays of 4 to 25 μm, which are well absorbed by metals and white objects. By using hot air and infrared rays in common in this way, the synergistic effect of the hot air and infrared rays makes it possible to more efficiently heat-treat cream solder and adhesive on high-density mounting boards.
（実施例）
本考案にかかる赤外線ヒータは、添付図面にも
示すように、箱状空胴体１、電熱ヒータ２、通気
性セラミツクス層３から構成されている。(Example) The infrared heater according to the present invention is composed of a box-shaped hollow body 1, an electric heater 2, and a breathable ceramic layer 3, as shown in the accompanying drawings.
第１図および第２図は本考案の第１実施例を示
すそれぞれ斜視図および断面図である。箱状空胴
体１内にはシースの電熱ヒータ２が蛇行状態で水
平内に設置されている。該電熱ヒータの上には通
気性のある金属支持体５を介して通気性セラミツ
クス層３が設置されている。通気性のある金属支
持体とは、金属粉を粗状に焼結した多孔質焼結金
属板、或いは金属を電解液で電鋳した三次元金属
網状体（商品名：セルメツト）、であり、セラミ
ツクス層３の支持体としての機能、要求される通
気性等を考慮すれば、電鋳により得られる三次元
金属網状体が好ましいものである。 1 and 2 are a perspective view and a sectional view, respectively, showing a first embodiment of the present invention. Inside the box-shaped hollow body 1, a sheathed electric heater 2 is installed horizontally in a meandering manner. A breathable ceramic layer 3 is placed on the electric heater with a breathable metal support 5 interposed therebetween. The breathable metal support is a porous sintered metal plate made by sintering metal powder into a coarse shape, or a three-dimensional metal network (product name: Celmet) made by electroforming metal with an electrolytic solution. Considering the function of the ceramic layer 3 as a support, the required air permeability, etc., a three-dimensional metal network obtained by electroforming is preferable.
また通気性セラミツクス層とはやはり気体を容
易に通過させるもので、通気性金属支持体上に設
置する場合はセラミツクス質を焼付けたり、溶射
することにより通気状態にすることができる。 Furthermore, the breathable ceramic layer allows gas to easily pass through it, and when it is installed on a breathable metal support, the ceramic layer can be made into a breathable state by baking or thermal spraying the ceramic material.
図示例にあつて、気体供給手段の１例である気
体流入口４は、箱状空胴体１の両面または底面に
取付け、図示しないコンプレツサー、或いは気体
を圧縮充填したボンベ等と接続されており、箱状
空胴体内に気体を矢印方向に導入するようになつ
ている。 In the illustrated example, the gas inlet 4, which is an example of the gas supply means, is attached to both sides or the bottom of the box-shaped hollow body 1, and is connected to a compressor (not shown) or a cylinder filled with compressed gas, etc. Gas is introduced into the box-shaped hollow body in the direction of the arrow.
本考案にかかる赤外線ヒータはリフロー炉のト
ンネル内に上下に設置して使用するのに特に適し
ているが、それにのみ制限されるものではない。 The infrared heater according to the present invention is particularly suitable for use by being installed vertically in the tunnel of a reflow oven, but is not limited thereto.
次に、本考案の赤外線ヒータの加熱状態につい
て説明する。 Next, the heating state of the infrared heater of the present invention will be explained.
先ず電熱ヒータ２に通電を行う。電熱ヒータ２
が加熱されると、その上に置かれた通気性加熱面
を構成する金属支持体５およびセラミツクス層３
が加熱され、さらに電熱ヒータ２の置かれた箱状
空胴体１内も加熱されることになる。斯様に全て
が十分加熱されたならば、気体流入口４から気体
（空気またはN2、C02、Ar、He等の不活性ガス）
を箱状空胴体１内に導入する。すると気体は熱い
箱状空胴体内で加熱され、さらに熱い通気性金属
支持体５、セラミツクス層３を通過する時に加熱
されて熱風となつて出てくる。つまり、本考案の
赤外線ヒータでは加熱されたセラミツクスからは
波長４〜25μmの遠赤外線が放射されるとともに
セラミツクス層の通気孔からは熱風が吹出してく
るものである。 First, the electric heater 2 is energized. electric heater 2
is heated, the metal support 5 and the ceramic layer 3 which constitute the air-permeable heating surface placed thereon
is heated, and the inside of the box-shaped hollow body 1 in which the electric heater 2 is placed is also heated. Once everything is sufficiently heated in this way, gas (air or inert gas such as N 2 , C0 2 , Ar, He, etc.) is introduced from the gas inlet 4.
is introduced into the box-shaped hollow body 1. Then, the gas is heated inside the hot box-shaped hollow body, and further heated as it passes through the hot air-permeable metal support 5 and the ceramic layer 3, and comes out as hot air. That is, in the infrared heater of the present invention, far infrared rays with a wavelength of 4 to 25 μm are emitted from the heated ceramics, and hot air is blown out from the vents in the ceramic layer.
（考案の効果）
本考案にかかる赤外線ヒータをリフロー炉に設
置してクリームはんだや接着剤を塗布した高密度
実装基板の加熱を行つた場合、セラミツクス層か
らは金属や樹脂によく吸収される４〜25μmの遠
赤外線が放射されるため、クリームはんだや接着
剤が効率よく加熱され、またセラミツクス層の通
気孔から吹き出る熱風は高密度実装基板の各部品
間に侵入して赤外線が届きにくい箇所を加熱す
る。従つて、本考案の赤外線ヒータは遠赤外線と
熱風の長所を十分に発揮するとともに、この相乗
作用でクリームはんだ付けや接着剤での接合を完
全なものにするという優れた効果を有している。(Effect of the invention) When the infrared heater according to the invention is installed in a reflow oven and heats a high-density mounting board coated with cream solder or adhesive, the ceramic layer is well absorbed by metals and resins. Far-infrared rays of ~25 μm are emitted, which efficiently heats cream solder and adhesives, and the hot air blown out from the vents in the ceramic layer penetrates between each component of the high-density mounting board, reaching areas that are difficult for infrared rays to reach. Heat. Therefore, the infrared heater of the present invention fully demonstrates the advantages of far infrared rays and hot air, and has the excellent effect of perfecting cream soldering and adhesive bonding through this synergistic effect. .
第１図は、本考案の第１実施例の一部破断斜視
図；および第２図は、同中央断面図である。
１……箱状空胴体、２……電熱ヒータ、３……
通気性セラミツクス層、４……気体流入口、５…
…通気性金属支持体。
FIG. 1 is a partially cutaway perspective view of a first embodiment of the present invention; and FIG. 2 is a central sectional view thereof. 1... Box-shaped empty body, 2... Electric heater, 3...
Breathable ceramic layer, 4... Gas inlet, 5...
...Breathable metal support.
Claims (1)
に、さらに加熱されて赤外線を放射する通気性
セラミツクス層を備えた三次元網状金属体また
は多孔質金属焼結体から成る通気性加熱面を前
記電熱ヒータ上に設置し、また前記箱状空胴体
内に気体を供給する気体供給手段を該箱状空胴
体に外部から取り付け、該箱状空胴体内に供給
された気体を前記通気性加熱面を経て吹き出さ
せるべく構成したことを特徴とする赤外線ヒー
タ。 (2) 前記気体供給手段が高圧気体供給源に連絡し
た気体流入口から構成される、実用新案登録請
求の範囲第１項に記載の赤外線ヒータ。[Claims for Utility Model Registration] (1) A three-dimensional mesh metal body or porous metal sintered body with an electric heater installed inside the box-shaped hollow body and a breathable ceramic layer that emits infrared rays when heated. A gas-permeable heating surface made of air is installed on the electric heater, and a gas supply means for supplying gas into the box-like hollow body is attached from the outside to the box-like hollow body to supply gas into the box-like hollow body. An infrared heater, characterized in that the infrared heater is configured to blow out the heated gas through the air-permeable heating surface. (2) The infrared heater according to claim 1, wherein the gas supply means comprises a gas inlet connected to a high-pressure gas supply source.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987020683U JPH048638Y2 (en) | 1987-02-17 | 1987-02-17 | |
| DE3804704A DE3804704A1 (en) | 1987-02-17 | 1988-02-15 | INFRARED HEATING DEVICE |
| GB8803597A GB2201320B (en) | 1987-02-17 | 1988-02-17 | Infrared heater |
| US07/352,227 US5058196A (en) | 1987-02-17 | 1989-05-15 | Electric infrared heater having a gas permeable electroformed porous metallic panel coated with a porous ceramic far-infrared radiating layer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987020683U JPH048638Y2 (en) | 1987-02-17 | 1987-02-17 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63128685U JPS63128685U (en) | 1988-08-23 |
| JPH048638Y2 true JPH048638Y2 (en) | 1992-03-04 |
Family
ID=30816421
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987020683U Expired JPH048638Y2 (en) | 1987-02-17 | 1987-02-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH048638Y2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2056037A1 (en) * | 2007-10-30 | 2009-05-06 | Büchi Labortechnik AG | Heating, method for heating and laminating, electrostatic separator, spray drier, separating device and method for separating particles |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60198079A (en) * | 1983-12-12 | 1985-10-07 | アシノフ | Electric infrared ray generator |
-
1987
- 1987-02-17 JP JP1987020683U patent/JPH048638Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60198079A (en) * | 1983-12-12 | 1985-10-07 | アシノフ | Electric infrared ray generator |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63128685U (en) | 1988-08-23 |
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