JPS5846436U

JPS5846436U - Semiconductor wafer display card

Info

Publication number: JPS5846436U
Application number: JP14052981U
Authority: JP
Inventors: 六車　輝美; 京都　憲昭
Original assignee: 株式会社東芝
Priority date: 1981-09-24
Filing date: 1981-09-24
Publication date: 1983-03-29

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Brief explanation of drawings]

第１図は半導体ウェハの正面図、第２図はキャリヤの斜
視図、第３図は半導体ウェハに対する処理工程を示すブ
ロック図、第４図はキャリヤケースの斜視図、第５図以
降はこの考案に係り、第５図は半導体ウェハ、−カード
を内装したキャリヤの斜視図、第６図ないし第８図はい
ずれも夫々が１実施例のカードの正面図、第９図は半導
体ウェハに対する処理工程を示すブロック図、第１０図
はカード読取りのための発光部の正面図、第１１図はカ
ードの正面図である。１．１′・・・半導体ウェハ、２・・・キャリヤ、４ａ
。４ａ′・・・４ｂ・・・４Ｃ・・・半導体ウェハの処理
工程、７・・・カード、７ａ、　　７ａ’・・・７ｂ、
　　７ｃ・・・カードの穿孔、９・・・発光部。Fig. 1 is a front view of the semiconductor wafer, Fig. 2 is a perspective view of the carrier, Fig. 3 is a block diagram showing the processing steps for the semiconductor wafer, Fig. 4 is a perspective view of the carrier case, and Fig. 5 and subsequent figures show this invention. 5 is a perspective view of a carrier containing a semiconductor wafer and a card, FIGS. 6 to 8 are each a front view of a card of one embodiment, and FIG. 9 is a processing step for a semiconductor wafer. FIG. 10 is a front view of a light emitting unit for reading a card, and FIG. 11 is a front view of the card. 1.1'...Semiconductor wafer, 2...Carrier, 4a
. 4a'...4b...4C...Semiconductor wafer processing step, 7...Card, 7a, 7a'...7b,
7c...Card perforation, 9...Light emitting part.

Claims

[Scope of utility model registration request]

A large number of semiconductor wafers are stored in carriers in lofts divided into manufacturing units and are attached to semiconductor wafer lofts for transportation between processing equipment. 1. A semiconductor wafer display card, which is inserted into a carrier as one wafer and is provided with a punch hole and a record for displaying a loft.