JPS5844792A - Ｘ―ｙテーブルの構造 - Google Patents

Ｘ―ｙテーブルの構造

Info

Publication number
JPS5844792A
JPS5844792A JP56144396A JP14439681A JPS5844792A JP S5844792 A JPS5844792 A JP S5844792A JP 56144396 A JP56144396 A JP 56144396A JP 14439681 A JP14439681 A JP 14439681A JP S5844792 A JPS5844792 A JP S5844792A
Authority
JP
Japan
Prior art keywords
tape
feed screw
feed
wire bonder
guide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56144396A
Other languages
English (en)
Japanese (ja)
Other versions
JPS643360B2 (enrdf_load_stackoverflow
Inventor
健 中村
荻野　新平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP56144396A priority Critical patent/JPS5844792A/ja
Publication of JPS5844792A publication Critical patent/JPS5844792A/ja
Publication of JPS643360B2 publication Critical patent/JPS643360B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector

Landscapes

  • Supply And Installment Of Electrical Components (AREA)
  • Wire Bonding (AREA)
JP56144396A 1981-09-11 1981-09-11 Ｘ―ｙテーブルの構造 Granted JPS5844792A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56144396A JPS5844792A (ja) 1981-09-11 1981-09-11 Ｘ―ｙテーブルの構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56144396A JPS5844792A (ja) 1981-09-11 1981-09-11 Ｘ―ｙテーブルの構造

Publications (2)

Publication Number Publication Date
JPS5844792A true JPS5844792A (ja) 1983-03-15
JPS643360B2 JPS643360B2 (enrdf_load_stackoverflow) 1989-01-20

Family

ID=15361177

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56144396A Granted JPS5844792A (ja) 1981-09-11 1981-09-11 Ｘ―ｙテーブルの構造

Country Status (1)

Country Link
JP (1) JPS5844792A (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH044462U (enrdf_load_stackoverflow) * 1990-04-24 1992-01-16

Also Published As

Publication number Publication date
JPS643360B2 (enrdf_load_stackoverflow) 1989-01-20

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