JPS5844787A - Semiconductor laser - Google Patents

Semiconductor laser

Info

Publication number
JPS5844787A
JPS5844787A JP14428281A JP14428281A JPS5844787A JP S5844787 A JPS5844787 A JP S5844787A JP 14428281 A JP14428281 A JP 14428281A JP 14428281 A JP14428281 A JP 14428281A JP S5844787 A JPS5844787 A JP S5844787A
Authority
JP
Japan
Prior art keywords
substrate
layer
gaas
gaalas
grooves
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14428281A
Other languages
Japanese (ja)
Inventor
Takao Yamaguchi
山口 隆夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Sanyo Denki Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Sanyo Denki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd, Sanyo Denki Co Ltd filed Critical Sanyo Electric Co Ltd
Priority to JP14428281A priority Critical patent/JPS5844787A/en
Publication of JPS5844787A publication Critical patent/JPS5844787A/en
Pending legal-status Critical Current

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  • Semiconductor Lasers (AREA)

Abstract

PURPOSE:To obtain a semiconductor laser having no heat distortion or the like generated from the oxidation of a mirror face and a difference in thermal character of a protective film and a laser substrate by a method wherein a high- resistance GaAs single crystal is deposited on the surface becoming the mirror face in a semiconductor laser consisting of a GaAlAs-group material. CONSTITUTION:An N type GaAlAs clad layer 2, a GaAs active layer 3, a P type GaAlAs clad layer 4, and a P type GaAs cap layer 5 are deposited on an N type GaAs substrate 1 by epitaxial growth and a double hetero junction laser substrate 10 is formed. Next, photo etching is applied by using a mixed solution composed of phosphoric acid, hydrogen peroxide and methanol at a ratio of 3:1:1 and a plurality of grooves 11 entering into the substrate 1 from the layer 5 are perforated, then the grooves 11 are used as cleavage faces. After that, high-resistance GaAs is epitaxially grown in the grooves 11 to form protective films 7. The protective films 7 are cleaved from the center lines to split into individual semiconductor lasers. This prevents Aloxidation in GaAlAs by the protective films 7 and also checks heat distortion generated in the substrate 10.

Description

【発明の詳細な説明】 本発明は半導体レー11”KMTる。[Detailed description of the invention] The present invention includes a semiconductor relay 11''KMT.

半導体レーダはレーダ発振を組子ための!III向とし
てへき關によるミラー画を有してiる。こCK上εレー
ダが(laAjム−(#ヲクムアルミ砒嵩]系材14か
Feる一場合、所る@aAjム1中に存在するムl(ア
ktニクム)がミツ−―において、大気と触れて酸化し
、断る酸化によ珈劣化が生じるという間層がigえ。
Semiconductor radar is for radar oscillation! I have a mirror picture by Sekikan for the third direction. If this CK ε radar is made of (laAjmu-(#wokumaluminum) system material 14 or Fe, the mul (aktnikum) present in a certain @aAjmu1 is different from the atmosphere in Mitsu--. There is an interlayer that oxidizes when touched, and oxidation causes deterioration.

そこで従車虐1@m (二酸化V5コン)、Iim(量
化Vjコン)、ム11口(酸、化アktニクム)等から
なる酸化譲、窒化膜もしくはこれらの多層膜な保−鋼と
して上ti!、lラーi上に形成して酸化な防いで%f
&え。
Therefore, oxidized materials, nitride films, or multilayer films of these materials are used as protective steel. Ti! , to prevent oxidation from forming on the surface of the %f
&picture.

しかし乍ら、1ira、81鵬、ム1m08  等は@
aA/ムー系材料からなる単結晶と島膨張係歇等の1鈎
特性が^なるためレーダ中に熱歪な生じ中丁(充分な劣
化防止にはならなV%ことがTo9え。
However, 1ira, 81peng, mu1m08, etc. @
Due to the single crystal made of aA/Mu-based material and the single hook characteristics such as island expansion intermittent, thermal distortion occurs in the radar (V% cannot be sufficiently prevented from deterioration).

tえ、ミラー―がGaAIA−で構成畜れてiる場合、
へき關後保11!膜形成までのわずかな−に酸化を生じ
晶(、かつ亀ツー1jlKは光による島が発生し易いえ
め上記酸化部分を中心に結晶の盃が生じ荀−と−う間層
があ2え・ 本発明は上記の緒間層に鑑みてなされえもので。
Well, if the mirror is composed of GaAIA,
Hekikangoho 11! Until the film is formed, a slight oxidation occurs in the crystals (and in Kametsu 1JlK, islands are likely to be generated due to light. Therefore, a crystal cup is formed around the oxidized part, and the layer between the crystals is 2. - The present invention was made in view of the above-mentioned Oma layer.

以下実施例につき説明する。Examples will be explained below.

第1園は本発明の一実施例を示し、(1)は−主−が(
100Jiilである履m@aムー轟板1(23−4)
は、該1板(1)上に順次エビタIIfV成員されえ第
1タツツr層、活性層、第2クツツr層及び中ヤツ1層
であ珈、該第1クラッド層(2)、 II性層(7)、
第2タツツF層(43及びキャップ層(5)は犬々Il
l@畠ムI^−16mAs (jlリクム[jl) *
 P 型GaAIA−及びpg    ′@11からな
る。(7Jは上ε成長層(1〜(5)のミラー−(6)
上に形成された保1膜でhに、該保−膜(73は@r(
クロム・)を10”sr”Ii度金含有丸高抵抗のQa
A・単輪晶からなる。*新る保鏝11(7)を高抵抗層
としているためリーク電fILが斃生することは@VS
The first garden shows an embodiment of the present invention, and in (1), -main- is (
100 Jiil m@a Mu Todo Board 1 (23-4)
The first cladding layer (2), the first cladding layer (2), and the first cladding layer (2) are made up of Evita IIfV members on the one plate (1) in order. layer (7),
The second tatsutu F layer (43 and cap layer (5)
l@Hatakemu I^-16mAs (jlrikum [jl) *
It consists of P-type GaAIA- and pg'@11. (7J is the upper ε growth layer (mirror of 1 to (5) - (6)
The protective film (73 is @r(
Chromium) with 10"sr"Ii degree gold-containing round high resistance Qa
A. Consists of monocyclic crystals. *Since the new safety iron 11 (7) is a high resistance layer, leakage current fIL will occur @VS
.

次に上ε半導体レーダの製造方法の一実施例を集2図ム
□〜Cにつき説IJITる。崗第1図と同一箇所には同
一番号を6丁。
Next, an embodiment of the method for manufacturing the upper ε semiconductor radar will be explained with reference to Figures 2-C. There are 6 same numbers in the same places as in Figure 1.

第2EAは第1工程な示しI l1lGaA−1板(1
)上に第1クラッド層(2)、活性層(3)、第2クツ
ツr層(4)及び中ヤツプ層(5)&順次積層′してな
る周知の二腫へf″w!l!合レーfA板しlを準備す
る・第!図1は第21株な示し、上記レーず基板−に紙
−罷直方向に延在し、かつキャップ層jll[lかbQ
IIAII j&歇口)に違するsinを例えばリン酸
、過鹸化本素本、ツタノーkをillで混合し、なる液
を用いて本トエツテングにより形成する。肯新る溝1麺
は上記レーず基板−の待米へき關を行なう位[K形成さ
れて−る。
The second EA indicates the first step.Il1lGaA-1 plate (1
), the first cladding layer (2), the active layer (3), the second shoe layer (4), and the middle layer (5) are laminated in sequence to form the well-known double layer f''w!l! 1. Prepare the ladle fA board. Figure 1 shows the 21st stock, and the lathe board extends in the perpendicular direction of the paper, and the cap layer jll [l or bQ
For example, by mixing phosphoric acid, supersaponified sulfuric acid, and tsutanoh k in an ill, and using a solution obtained by mixing phosphoric acid, phosphoric acid, phosphoric acid, and phosphoric acid, which are different from IIAII J & 歇口), are used. The new groove 1 noodle is formed to the extent that it connects to the waiting rice of the above-mentioned lathe substrate.

第2図Cは最終工Iilを示し、上記#4儀υ中に高抵
抗g)g&ムslzビタキvarsp成長させて保1i
1111(7)な形成Tると共に断る溝i1の中心りま
〉1図中鎖線ムに沿フてへき開を行うことによ〕第1E
の半導体レニダな得ることができる。
Figure 2C shows the final process, in which high resistance g) g&mus slz Vitaki varsp is grown during the above #4 procedure.
1111 (7) Forming T and cutting at the center of the groove i1〉By performing cleavage along the chain line in Figure 1〉1E
You can get the best semiconductors.

新る半導体レーずでは、保gill(7バ7Jが従来の
!1ids、 !111@ムl m Os 等にQ保W
llak8aKglaAjAsからなるill、第2ク
ラッド層(2ハ4)の端1IiI#を被りてiるのでG
aAlAs中のムlが酸化、する危惧は准−0ま丸鋸1
!1li(?)とレーfjk板−とは熱的特性が全く同
一であるので保11i!1i(7J杉威によ)レーダ基
板−内に熱歪を生じることはな−。更に上記半導体レー
ダにおいてlラー劇は保*1I(71(7Jのm−(1
)(7)となるため、エツチング工程後#l1111−
が酸化したとしても、断る部分は従来とは@*てミラー
自とはならず、従りて従来と較べて結晶の歪が生しるこ
ともなくなる。
In the new semiconductor lasers, Qhogill (7ba 7J is the conventional !1ids, !111@mulmOs etc.)
llak8aKglaAjAs ill covers the edge 1IiI# of the second cladding layer (2ha4), so G
There is a risk that the mulch in the AlAs will oxidize and the circular saw 1
! 1li(?) and Ray fjk board have exactly the same thermal characteristics, so 11i! 1i (7J by Takeshi Sugi) No thermal distortion will occur inside the radar board. Furthermore, in the semiconductor radar mentioned above, the l-ra play is
)(7), so after the etching process #l1111-
Even if the crystal is oxidized, the part to be rejected will not become a mirror as in the conventional case, and therefore, compared to the conventional case, distortion of the crystal will not occur.

以上の如く1本発明によればミツ−画の鹸化中保−膜と
レーfj&板との熱的性質の違いから生じる熱歪等のな
い半導体レーfな得るξとができる。
As described above, according to the present invention, it is possible to obtain a semiconductor laser f that is free from thermal distortion caused by the difference in thermal properties between the saponification film and the laser board.

【図面の簡単な説明】[Brief explanation of the drawing]

凶ム〜G繻gs1図の手辱体し−f製シー実施例を示す
断面図である。 (61・−噛面(tラー面となる面) ÷ (COCJ 図 q
It is a cross-sectional view showing an embodiment of the hand-fashioning body of the G-G S1 figure. (61・-biting surface (surface that becomes t-ra surface) ÷ (COCJ Fig. q)

Claims (1)

【特許請求の範囲】[Claims] (1)  ・aA/ム1系材料かb′1にる半導体レー
9において、tツー自となる−に高抵抗@aAs単結晶
を堆積しえことを特徴とする半導体レーダ。
(1) - A semiconductor radar characterized in that a high resistance @aAs single crystal can be deposited between t and - in a semiconductor laser 9 made of an aA/mu1-based material or b'1.
JP14428281A 1981-09-11 1981-09-11 Semiconductor laser Pending JPS5844787A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14428281A JPS5844787A (en) 1981-09-11 1981-09-11 Semiconductor laser

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14428281A JPS5844787A (en) 1981-09-11 1981-09-11 Semiconductor laser

Publications (1)

Publication Number Publication Date
JPS5844787A true JPS5844787A (en) 1983-03-15

Family

ID=15358448

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14428281A Pending JPS5844787A (en) 1981-09-11 1981-09-11 Semiconductor laser

Country Status (1)

Country Link
JP (1) JPS5844787A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63124486A (en) * 1986-11-13 1988-05-27 Mitsubishi Electric Corp Manufacture of semiconductor laser
US5180685A (en) * 1990-04-02 1993-01-19 Sharp Kabushiki Kaisha Method for the production of a semiconductor laser device
US7267871B2 (en) 1999-06-14 2007-09-11 E. I. Du Pont De Nemours And Company Stretch break method and product

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5197390A (en) * 1975-02-21 1976-08-26 HANDOTAIREEZASOSHI
JPS5224480A (en) * 1975-08-20 1977-02-23 Matsushita Electric Ind Co Ltd Semiconductor laser

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5197390A (en) * 1975-02-21 1976-08-26 HANDOTAIREEZASOSHI
JPS5224480A (en) * 1975-08-20 1977-02-23 Matsushita Electric Ind Co Ltd Semiconductor laser

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63124486A (en) * 1986-11-13 1988-05-27 Mitsubishi Electric Corp Manufacture of semiconductor laser
US5180685A (en) * 1990-04-02 1993-01-19 Sharp Kabushiki Kaisha Method for the production of a semiconductor laser device
US7267871B2 (en) 1999-06-14 2007-09-11 E. I. Du Pont De Nemours And Company Stretch break method and product
US7559121B2 (en) 1999-06-14 2009-07-14 E.I. Du Pont De Nemours And Company Stretch break method and product

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