JPS5844754A - Ｌｓｉパツケ−ジの冷却構造 - Google Patents

Ｌｓｉパツケ−ジの冷却構造

Info

Publication number
JPS5844754A
JPS5844754A JP56144121A JP14412181A JPS5844754A JP S5844754 A JPS5844754 A JP S5844754A JP 56144121 A JP56144121 A JP 56144121A JP 14412181 A JP14412181 A JP 14412181A JP S5844754 A JPS5844754 A JP S5844754A
Authority
JP
Japan
Prior art keywords
module
lsi
package
cooling
unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56144121A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6211510B2 (cg-RX-API-DMAC10.html
Inventor
Tsuneaki Tajima
田島　恒明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP56144121A priority Critical patent/JPS5844754A/ja
Publication of JPS5844754A publication Critical patent/JPS5844754A/ja
Publication of JPS6211510B2 publication Critical patent/JPS6211510B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W40/60—

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP56144121A 1981-09-11 1981-09-11 Ｌｓｉパツケ−ジの冷却構造 Granted JPS5844754A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56144121A JPS5844754A (ja) 1981-09-11 1981-09-11 Ｌｓｉパツケ−ジの冷却構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56144121A JPS5844754A (ja) 1981-09-11 1981-09-11 Ｌｓｉパツケ−ジの冷却構造

Publications (2)

Publication Number Publication Date
JPS5844754A true JPS5844754A (ja) 1983-03-15
JPS6211510B2 JPS6211510B2 (cg-RX-API-DMAC10.html) 1987-03-12

Family

ID=15354675

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56144121A Granted JPS5844754A (ja) 1981-09-11 1981-09-11 Ｌｓｉパツケ−ジの冷却構造

Country Status (1)

Country Link
JP (1) JPS5844754A (cg-RX-API-DMAC10.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4851856A (en) * 1988-02-16 1989-07-25 Westinghouse Electric Corp. Flexible diaphragm cooling device for microwave antennas

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4851856A (en) * 1988-02-16 1989-07-25 Westinghouse Electric Corp. Flexible diaphragm cooling device for microwave antennas

Also Published As

Publication number Publication date
JPS6211510B2 (cg-RX-API-DMAC10.html) 1987-03-12

Similar Documents

Publication Publication Date Title
US5696405A (en) Microelectronic package with device cooling
US10727160B2 (en) Thermal management component
US7002801B2 (en) Method of cooling semiconductor die using microchannel thermosyphon
KR900002213B1 (ko) 전자회로장치용 냉각시스템
TWI305064B (en) Thermoelectric module
US20130206367A1 (en) Heat dissipating module
JPH0673364B2 (ja) 集積回路チップ冷却装置
JPS5936827B2 (ja) 集積回路素子の冷却装置
JP2004295718A (ja) 情報処理装置の液例システム
US20060137860A1 (en) Heat flux based microchannel heat exchanger architecture for two phase and single phase flows
US7447025B2 (en) Heat dissipation device
US20050243515A1 (en) Apparatus for enhancing heat transfer efficiency of endothermic/exothermic article
JP2002353668A (ja) 電子部品冷却装置および電子部品冷却システム
JPS5844754A (ja) Ｌｓｉパツケ−ジの冷却構造
KR20030044771A (ko) 방열 모듈
JPH06252300A (ja) 冷却装置を備えた集積回路チップ及びその製造方法
JPS6046056A (ja) 冷却構造
US20050189089A1 (en) Fluidic apparatus and method for cooling a non-uniformly heated power device
JPS6158173A (ja) 液体燃料電池
JPH0442931Y2 (cg-RX-API-DMAC10.html)
JP2746938B2 (ja) 電源回路基板用冷却装置
JPS5857679B2 (ja) 電子熱交換ユニツト
JPH0617313Y2 (ja) 液冷形半導体パッケージ
JPS58197867A (ja) Ｌｓｉパツケ−ジの冷却構造
JPS63289847A (ja) Ｌｓｉパッケ−ジの放熱構造