JPS5843803Y2 - Printed wiring board support device - Google Patents

Description

[Detailed Description of the Invention] The present invention relates to a support device for a printed wiring board, and in particular, the invention relates to a support device for a printed wiring board, and in particular, a printed wiring board on which components are attached by solder dip and a solder dip layer is formed on the wiring pattern can be mounted on a chassis in one piece. In addition to soldering and fixing,
The present invention relates to a support device for a printed wiring board, in which the chassis and the printed wiring board are electrically connected by soldering.

1 and 2 show an example of a support device for a printed wiring board used in an electronic tuner of a television receiver.

In FIG. 1, printed wiring is provided on a rectangular printed wiring board 1, and circuit components (not shown) are attached using solder tape.

A ground pattern 3 is formed at the center of each of the four sides of this printed wiring board 1, and a solder layer 5 is also formed on this ground pattern 3 by solder dipping, as shown in FIG.

Further, as shown in FIG. 2, four printed wiring board mounting pieces 9 are formed on the electrically grounded chassis 7 at predetermined locations, parts of which are bent inward and protrude. The mounting piece 9 restricts the mounting position of the printed wiring board 1 to the chassis 7.

That is, when mounting the printed wiring board 1 on the chassis 7, the printed wiring board 1 is mounted so that the solder layer 5 formed on the ground pattern 3 contacts the mounting piece 9 as shown in FIG. Incorporate it into the chassis 7, and in this state,
For example, as shown by the dashed line in Figure 2, by hand,
The solder layer 5 and the mounting piece 9 were further connected by another solder layer 10.

As a result, the printed wiring board 1 is attached to the chassis 7, and the ground pattern 3 of this printed wiring board 1 is
was electrically grounded via the chassis 7 and the solder layers 5 and 10.

However, in such a case, as clearly shown in FIG. 2, the printed wiring board 1 is attached to the solder layer 10 with the piece 9 in contact with the upper surface of the solder layer 5. The relative mounting of is determined by the position, for example, the distance l(
(see FIG. 2) varies depending on the heights dl and d2 of the solder layer 5, resulting in variations in the mounting position.

That is, the heights dl and d2 change depending on the degree of swelling of the solder layer 5 and the amount of solder when solder tipping is performed.

Therefore, during the above-mentioned mounting operation, the presence of the solder layer 5 causes the printed wiring board 1 to be mounted at a predetermined position, making it impossible to perform accurate mounting.

Furthermore, since a solder layer 10 is further formed by soldering on the raised solder layer 5, some of the solder in this solder layer 10 flows and protrudes from the ground pattern 3, which causes the ground pattern 3 and other wiring patterns (Fig. There were also problems such as short-circuits caused by electrical connections (not shown) or poor appearance.

The present invention was devised to solve the above-mentioned problems, and in the above-mentioned printed wiring board support device, the solder tape layer is attached to the opposite part of the printed wiring board opposite to the mounting piece. The soldering joint that is not formed and is formed so as to surround this opposing part has a joining part, and the soldering part that surrounds this facing part is characterized in that the joining part and the mounting piece are joined to each other by soldering. The present invention relates to a support device for a printed wiring board.

Next, an embodiment of a printed wiring board support device to which the present invention is applied will be described with reference to FIGS. 3 to 6.

3 and 4 show a first embodiment of the present invention.

As shown in FIG. 3, a rectangular printed wiring board 12 is provided with a region 14 in which no pattern is formed approximately in the center of its four sides, and a ground pattern 16 is provided around this region 14. It is formed.

Further, as mentioned above, four printed wiring board mounting pieces 20 are formed on the chassis 18, parts of which are bent inward at predetermined locations to protrude. When the board 12 is assembled into the chassis 18 as shown in FIG.
4.

In other words, this region 14 is the opposing portion of the printed wiring board 12 that faces the mounting piece 20.

According to the printed wiring board support device configured in this way, when the printed wiring board 12 is soldered-dipped, the solder layer 22 is formed on the ground pattern 16, but the pattern is not provided in the above-mentioned area 14. Since no solder layer is formed.

In other words, the solder layer 22 is in the area 1 of the ground pattern 16.
4 is formed on the portion surrounding the U-shaped part 4, and is later connected to the mounting piece 20 by soldering. and a portion formed on the portion extending along the side edge of.

Therefore, the mounting piece 20 is attached to the area 14 of the printed wiring board 12.
(in which dl and d2 in FIG. 2 correspond to d1=0 and d2-0, respectively), and are bonded by the solder layer 23 as shown by the dashed line in FIG.

As a result, the printed wiring blocking board 12 is mounted on the chassis 18 with its mounting position regulated by the piece 20, and the ground pattern 16 on the printed wiring board 12 is electrically grounded via the chassis 18 and the solder layers 22 and 23. be done.

In this case, since there is no solder or the like intervening between the piece 20 and the printed wiring board 12, the chassis 18
The relative mounting of the printed wiring board 12 to the
(see Fig. 4), and therefore the printed wiring board 12 is accurately placed on the chassis 18 at the pre-designed position.
Can be installed on.

In addition, when joining the soldering part and the mounting piece 20,
The solder in the solder layer 23 swells up to surround the area 14. Since the solder accumulates in the joint, the solder protrudes from the ground pattern 16 and connects this ground pattern 16 with other wiring patterns (not shown). There will be no electrical connections that will cause short circuits or look unsightly.

5 and 6 show a second embodiment of the present invention, in which a ground pattern 16 is formed on the printed wiring board 12 as in the first embodiment, and the above-mentioned area A pattern 24 that is continuous with the ground pattern 16 is also formed on the ground pattern 14 .

Further, a solder resist layer 2 made of solder resist ink, etc.
6 is formed on the pattern 24 provided in the above-mentioned region 14.

When the printed wiring board 12 configured as described above is soldered, a solder layer 22 is formed on the ground pattern 16, but no solder layer is formed on the solder resist layer 26.

After this solder tape processing, the solder resist layer 26 described above is removed by, for example, chemical processing to form the pattern 2.
Expose 4.

Next, as shown in FIG. 6, the printed wiring board 12 is assembled into the chassis 18, and the mounting piece 20 is soldered in a state in which it is in direct contact with the upper surface of the pattern 24 formed on the printed wiring board 12.

In the case of this embodiment, the pattern 24 is interposed between the piece 20 and the printed wiring board 12 for mounting, but since the thickness of this pattern 24 is extremely thin and constant, the mounting does not affect the accuracy. Furthermore, this pattern 24 ensures the electrical connection between the chassis 18 and the ground pattern 16.

Although the present invention has been described above based on the embodiments, further modifications can be made based on the technical idea of the present invention.

For example, the ground pattern 16 and the pattern 24 may be formed as in the case of FIG. 5, and the solder resist layer 26 may be formed on these patterns 16.degree. 24.

In this case, the solder resist layer 26 on the ground pattern 16 may be removed by chemical treatment or the like before soldering.

As described above, in the present invention, the solder dip layer formed on the wiring pattern is not formed on the opposing portion of the printed wiring board that faces the mounting piece of the chassis, but the solder dip layer is formed to surround this opposing portion. The solder joint is provided with a connecting portion, and the soldering portion and the mounting piece are connected to each other by soldering.

Therefore, since no solder layer is interposed between the mounting piece and the printed wiring board, the printed wiring board can be mounted to the chassis with high precision.

In addition, when soldering, the solder used to connect the connecting part and the mounting piece accumulates in the connecting part, so this solder protrudes from the wiring pattern and causes electrical contact between this wiring pattern and other wiring patterns. This will not cause a short circuit or make it look unsightly.

[Brief explanation of drawings]

1 and 2 are for explaining a conventional printed wiring board support device, in which FIG. 1 is a plan view showing a printed wiring board mounted on a chassis, and
The figure is a sectional view taken along the line II--II in FIG. 3 and 4 are for explaining the first embodiment of the printed wiring board support device to which the present invention is applied, and FIG. 3 shows the state in which the printed wiring board is attached to the chassis. The plan view shown in FIG. 4 is a sectional view taken along the line IV--IV in FIG. 3. 5 and 6 show a second embodiment of the present invention;
The figure is a plan view similar to Figure 3, and Figure 6 is ■I-v of Figure 5.
It is a longitudinal cross-sectional view taken along the I line. In addition, in the symbols used in the drawings, 12...
・・Printed wiring board, 14・・・・area, 16・
...Earth pattern, 18...Chassis, 20...Printed wiring board mounting on one side, 22.
23...Solder layer.

Claims (1)

[Scope of utility model registration request] A printed wiring board, on which parts are attached by solder dip and a solder dip layer is formed on the wiring pattern, is attached to the chassis by soldering to one piece, and the chassis and the printed wiring board are connected by this soldering. In the support device for a printed wiring board, the solder dip layer is not formed on an opposing portion of the printed wiring board facing the mounting piece, but is formed to surround this opposing portion. A supporting device for a Phnont wiring board, characterized in that the soldering part surrounding the opposing part has a joining part, and the soldering part surrounding the opposing part and the mounting piece are joined to each other by the soldering.