JPS5843479B2 - Electrolytic etching method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an electrolytic etching method, and more particularly, to a method for achieving uniform electrolytic etching when performing multiple electrolytic etchings using one mold pattern.

Conventionally, electrochemical means and chemical means are known as means for etching metal.

The former method of electrochemically etching metal includes the following three methods.
There are various methods.

(1) A method in which a corrosion-resistant resist pattern is provided on a metal surface and left in an electrolytic solution, the metal is used as an anode and an insoluble metal is used as a cathode, and only the bare metal portion is electrolytically eluted.

(2) A method commonly known as electrolytic processing method, using a molded cathode,
The mold cathode is brought close to the metal surface which is the anode, and the electrolytic solution is jetted out from the mold cathode and etched, and as the etching progresses, the gap is kept the same and it is inserted into the deep part of the etched part. how to.

(3) Using a method known as the electrolytic marking method, a water-retaining stencil with an opening and a water-retaining substance present on the opening is wetted with an electrolyte and then brought into contact with metal, and a cathode is attached to the stencil. A method of electrolytic etching to a minute depth by bringing the metal into contact and applying electricity to it as an anode.

The first method of etching metal using a resist is to form a pattern by screen printing the resist onto the metal and drying it, or by drying the photoresist onto the metal and forming the desired pattern. A method is used in which the pattern is exposed using a pattern opposite to that of the pattern, and then developed and dried to form the desired butter.

When forming a pattern by screen printing and performing electrolytic etching, (1) metal pretreatment, (2) drying, (3)
It requires nine steps: resist printing, (4) drying, (5) electrolytic etching, (6) water washing, (7) resist removal, (8) washing, and (9) drying.

Furthermore, when performing electrolytic etching after forming a pattern using photoresist, (1) metal pretreatment, (2) drying, (
3) Photoresist coating, (4) drying, (5) pattern exposure, (6) development, (7) drying, (8) baking, (
It requires an operation consisting of 13 steps: 9) electrolytic etching, dO) water washing, (11) photoresist removal, zero washing, and (13) drying.

As described above, in the method of etching metal using these resists, the resist or photoresist must be formed each time the metal is etched, and the operation steps are many and complicated. However, it has the disadvantage of being expensive.

Furthermore, the second electrolytic processing method has the disadvantage that the electrode mold is expensive and that it is difficult to process complicated shapes.

Furthermore, the third electrolytic marking method has the disadvantage that the liquid is consumed instantaneously and only extremely shallow etching of 2 to 3 microns can be performed.

Furthermore, as the latter chemical etching method, a flexible and corrosion-resistant template such as a rubber plate called a masking plate is used, and metal is clamped between the masking plate and the corrosion-resistant substrate to remove the non-etched parts. A method is known in which chemical milling is performed while protecting the

In this method, one masking plate can be repeatedly used to etch a large number of metals, so it has the advantage of being able to etch metals efficiently and at a low cost, but on the other hand, it requires repeated etching of simple shapes. In particular, this method cannot be applied to patterns having isolated parts like islands, and is unsuitable for etching over a large area.
Furthermore, there is a drawback that processing accuracy is extremely low.

One of the inventors of the present invention first closely attached a mold pattern made of an electrically insulating material with openings corresponding to the areas to be etched onto a metal workpiece, and then placed an electrode facing the metal workpiece. The metal workpiece is electrolytically etched by passing an electric current using the metal workpiece as an anode and the electrode as a cathode while jetting an electrolytic solution between the metal workpiece and the electrode, and then The mold pattern is separated from the electrolytically etched metal workpiece, the separated mold pattern is brought into close contact with a second metal workpiece to be electrolytically etched, and the latter is electrolytically etched in the same manner as described above. The present invention has invented an electrolytic etching method characterized in that electrolytic etching is repeatedly performed on a metal workpiece to be electrolytically etched in sequence using - pieces of the pattern, and the electrolytic etching method described above is improved. Succeeded in improving various shortcomings.

(See Patent Application No. 138617 of 1972).

However, when this method is applied to a metal workpiece having a relatively large area, it is extremely difficult to perform electrolytic etching uniformly by using a single long electrode, and the current distribution is The current density near both ends of the electrode is higher than that near the center, so that the electrolytic etching at both ends tends to be excessive, while at the center it tends to be insufficient.

In view of these shortcomings, the inventors of the present invention have conducted repeated research on how to obtain uniform electrolytic etching even by using a single long electrode, and have developed a flow rate adjustment device that can adjust the supply amount of electrolytic etching solution. The present invention has been completed by providing a plurality of electrolytic etching liquid supply pipes, each provided with an electrolytic etching liquid supply pipe, in an individual or integrated electrolytic etching jet apparatus.

Therefore, in the present invention, a mold pattern made of an electrically insulating material, which is open in a region corresponding to the area to be etched, is brought into close contact with a metal workpiece, and an electrode plate is vertically opposed to the metal workpiece. A plurality of electrolytic etching liquid supply pipes, each equipped with a flow rate adjustment device that can adjust the supply amount of electrolytic etching liquid, are used individually or as a single electrolytic plate, with the metal workpiece used as an anode and the electrode plate used as a cathode. The electrolytic etching liquid is supplied to the electrolytic etching liquid jet apparatus from the electrolytic etching liquid supply pipe while adjusting the flow rate, and is electrolytically etched while being jetted from the apparatus. The pattern is separated from the electrolytically etched metal workpiece, the separated pattern is brought into close contact with a second metal workpiece to be electrolytically etched, and the latter is electrolytically etched in the same manner as described above. This is an electrolytic etching method characterized in that engraving is repeatedly performed on a metal workpiece to be electrolytically etched in sequence using - number of the die patterns.

Mold patterns that can be used in the method of the present invention include (1) a mold formed by applying an emulsion (for example, photosensitive photoresist) to an electrically insulating screen, applying an original plate, and performing exposure and development to form an electrically insulating emulsion pattern; pattern.

(2) A mold pattern formed by applying an emulsion to a base film in advance, applying an original plate, exposing and developing it to form an electrically insulating emulsion pattern, and then transferring the emulsion pattern to an electrically insulating screen.

(3) A mold pattern formed by forming an electrically insulating paste pattern on an electrically insulating screen by hand drawing or screen printing using electrically insulating paste.

(4) A mold pattern formed by opening an electrically insulating film and adhering the film to an electrically insulating screen.

(5) A mold pattern obtained by coating a base film with a thick electrically insulating emulsion in advance, applying an original plate, exposing and developing it, and then peeling it off from the base film.

(6) A mold pattern formed by opening an electrically insulating film.

etc. can be used.

As the screen material used for the mold pattern used in the method of the present invention, commercially available materials such as ordinary materials, nylon, Tetron-based materials, etc. can be used.

Electrolytic shielding resists include polyvinyl cinnamate resists, such as KPR (Kodak Photoresist), cyclized rubber-based resists, KMER (Kodak Metal Etch Resist whose main component is cis-polyisoprene), ornquinone diazide resists, such as AZ (U.S. Silapray). It is preferable to use a solvent-soluble photoresist such as those manufactured by Co., Ltd.).

For other mold patterns, the selection of materials described in the above-mentioned Patent Application No. 138617 of 1972,
structure and other implementation guidelines.

According to the present invention, all metals or alloys such as iron, copper, manazuru, aluminium, nickel, chromium, lead, tin, zinc, stainless steel, permalloy, etc., in general terms, are anodized at the anode and are not passivated. Can engrave metals and alloys.

As the electrolytic etching liquid used in the present invention, those conventionally used for various metals and alloys can be used.

Next, the electrolytic etching method of the present invention will be specifically explained based on the drawings.

FIG. 1 is a partially sectional front view illustrating an example of the electrolytic etching method of the present invention, and FIG. 2 is a partially sectional front view illustrating another example of the electrolytic etching method of the present invention. Figure 3 is the second
It is a top view seen from the top of a figure.

In Fig. 1, 1 is a metal workpiece, 2 is a mold pattern,
3 is the opening of the mold pattern 2, 4 is the support base, 5 is the cathode plate,
6 is an electrolytic etching liquid jet nozzle, 7 is a branch pipe for sending the electrolytic etching liquid, 8 is an electrolytic etching liquid jet flow control valve, 9 is a main pipe for sending the electrolytic etching liquid, 10 is a valve, and 11 is an electrolytic etching liquid The liquid inlet pipe and 12 are power sources.

Figure 1 shows an example in which the electrolytic etching liquid jet nozzles are individually installed, in which a mold pattern 2 is closely placed on a metal workpiece 1 and is placed on a support base 4 and fixed. Then, the electrolytic etching liquid is sent from the electrolytic etching liquid inflow pipe 11 to each of the branch pipes 7 that send the electrolytic etching liquid through the main pipe 9 that sends the electrolytic etching liquid by controlling the valve 10, and then to the branch pipes 7 that send the electrolytic etching liquid. The flow rate of the electrolytic etching liquid is controlled by the flow rate control valve 8 and supplied to the electrolytic etching liquid jet nozzle 6, and the electrolytic etching liquid is supplied from the electrolytic etching liquid jet nozzle 6 to the metal cover connected to the anode side of the power source 12. The metal workpiece 1 is electrolytically etched by supplying current from the power source 12 while flowing between the workpiece 1 and the cathode plate 5 to form a mold pattern 2.
An etching corresponding to the shape of the opening 3 is obtained.

Next, the mold pattern 2 is removed, and this mold pattern 2 is brought into close contact with the metal workpiece to be electrolytically etched next, and electrolytically etched in the same manner as above, and the same operation is repeated sequentially to form a single sheet. A large number of metal workpieces are electrolytically etched using only the die pattern.

In FIGS. 2 and 3, 13 is a metal workpiece, 1
4 is a mold pattern, 15 is an opening of the mold pattern 14, 16
17 is a support base, 17 is a cathode plate, 18 is an integrated electrolytic etching liquid jet nozzle, 19 is a branch pipe for sending the electrolytic etching liquid, 20 is an electrolytic etching liquid jet flow control valve, and 21 is a main pipe for sending the electrolytic liquid. ,
22 is a valve, 23 is an electrolytic etching liquid inlet pipe, and 24 is a power source.

In the case of FIGS. 2 and 3, the mold pattern 14 is closely placed on the metal workpiece 13 and fixed on the support base 16, and the electrolytic etching liquid is injected into the metal workpiece 13. The electrolytic etching liquid is sent from the pipe 23 to each of the branch pipes 19 through the main pipe 21 which sends the electrolytic etching liquid by adjusting the valve 22, and then the flow rate of the electrolytic etching liquid is adjusted by the electrolytic etching liquid jet flow control valve 20. The electrolytic etching liquid is supplied to the electrolytic etching liquid jet nozzle 18 in a controlled manner, and the electrolytic etching liquid is jetted from the electrolytic etching liquid jet nozzle 18 between the metal workpiece 13 connected to the anode side of the power source 24 and the cathode plate 17. The opening 1 of the mold pattern 14 is etched by electrolytically etching the metal workpiece 13 by supplying current from the power source 24 while
Obtain an etching according to the shape of step 5.

Next, the mold pattern 14 is removed, and the mold pattern 14 is brought into close contact with the metal workpiece to be electrolytically etched next, and electrolytically etched in the same manner as described above. A large number of metal workpieces are electrolytically etched using only the die pattern.

As explained above, according to the electrolytic etching method of the present invention,
An electrolytic etching liquid jet nozzle is used which is capable of electrolyzing a large number of metal workpieces by using only one mold pattern and which separates or integrates jets of electrolytic etching liquid. The flow rate of the electrolytic etching liquid is controlled by the electrolytic etching liquid jet flow control knob from the branch pipe that sends the electrolytic etching liquid, and the electrolytic etching liquid is sent in a uniform amount over the entire surface of the metal workpiece. Since the etching liquid can be jetted out from the nozzle, the current density between the cathode and the anode can be made uniform, and the desired uniform electrolytic etching can be obtained even on a metal workpiece having a large area. Highly accurate etching can be achieved.

Next, examples of the present invention will be shown.

Example 1 KMER on a 150 line/inch Tetron screen.

A mold pattern was prepared by metal etching (metal etching, resist).

700x1000m with this mold pattern connected to the anode side
, placed closely on a stainless steel plate with a thickness of 0.3 m,
Electrolytic etching was carried out using three short nozzles as shown in FIG. 1, with each nozzle having an arrangement of one liter and adjusting the discharge amount of each nozzle.

When etching is completed, the etching depth is approximately 0.15 mm, and the variation in depth is about ±15 μ, compared to the ±30 μ variation when etching is performed using a single long nozzle under the same conditions. , high-precision etching was obtained.

Example 2 When etching was carried out under the same conditions as in Example 1, but with the number of nozzles increased to 7, the dimensional variation was improved compared to Example 1 and was within ±10μ.

[Brief explanation of drawings]

FIG. 1 is a partially sectional front view illustrating an example of the electrolytic etching method of the present invention, and FIG. 2 is a partially sectional front view illustrating another example of the electrolytic etching method of the present invention. Figure 3 is the second
It is a top view seen from the top of a figure. 1... Metal workpiece material, 2... Mold pattern, 3... Opening of mold pattern 2, 4...
...Support stand, 5...Cathode plate, 6...Electrolytic etching jet nozzle, 7...Branch pipe for sending electrolytic etching liquid, 8...・Electrolytic etching liquid jet flow control valve, 9
...Main pipe for sending electrolytic etching solution, 10...
Valve, 11... Electrolytic etching liquid inflow pipe, 12...
...Power source, 13...Metal workpiece material, 14.
... Mold pattern, 15 ... Mold pattern 1
4 opening, 16... Support stand, 17...
・Cathode plate, 18... Electrolytic etching liquid jet nozzle, 1
9...Branch pipe for sending electrolytic etching solution, addition...
・Electrolytic etching liquid jet flow rate adjustment valve, 21...Main pipe for sending electrolytic solution, 22...Valve, 23...
...Electrolytic etching liquid inflow pipe, 24...Power supply.

Claims (1)

[Claims] 1. Closely place a mold pattern made of an electrically insulating material that is open in the area corresponding to the area to be etched into the metal workpiece,
A plurality of electrode plates are vertically opposed to the metal workpiece, the metal workpiece is used as an anode, and the electrode plate is used as a cathode, each of which is provided with a flow rate adjustment device capable of adjusting the supply amount of electrolytic etching solution. An electrolytic etching liquid supply pipe is provided in an individual or integrated electrolytic etching liquid jet device, and the electrolytic etching liquid is supplied from the electrolytic etching liquid supply pipe to the electrolytic etching liquid jet device while adjusting the flow rate. Electrolytic etching is carried out while the jet is flowing from the device, and then the mold pattern is separated from the electrolytically etched metal workpiece, and the separated pattern is closely attached to a second metal workpiece to be electrolytically etched. Electrolytic etching is carried out in the same manner as described above, and then the latter electrolytic etching is sequentially repeated on the metal workpiece to be electrolytically etched using - pieces of the die pattern. Method.