JPS5840900A - Chip type electronic part containing band - Google Patents

Chip type electronic part containing band

Info

Publication number
JPS5840900A
JPS5840900A JP57141439A JP14143982A JPS5840900A JP S5840900 A JPS5840900 A JP S5840900A JP 57141439 A JP57141439 A JP 57141439A JP 14143982 A JP14143982 A JP 14143982A JP S5840900 A JPS5840900 A JP S5840900A
Authority
JP
Japan
Prior art keywords
tape
shaped
chip
holes
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57141439A
Other languages
Japanese (ja)
Other versions
JPS6160600B2 (en
Inventor
文彦 金子
新田 晃一
浩一 斎藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Fukui Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Fukui Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd, Fukui Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to JP57141439A priority Critical patent/JPS5840900A/en
Publication of JPS5840900A publication Critical patent/JPS5840900A/en
Publication of JPS6160600B2 publication Critical patent/JPS6160600B2/ja
Granted legal-status Critical Current

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  • Supply And Installment Of Electrical Components (AREA)
  • Packages (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 形 この発明は、チップ方電子部品収納帯に関するもので、
特にプリント基板等への自動マウントのそe 行ないやすい状態でチップ形電子部品を収納する収納帯
に関する。
[Detailed Description of the Invention] This invention relates to a chip-side electronic component storage band.
In particular, the present invention relates to a storage belt for storing chip-shaped electronic components in a state where it is easy to automatically mount them onto a printed circuit board or the like.

従来、殆どの電子部品にはリード線が付着されている。Conventionally, most electronic components have lead wires attached to them.

ところが種々の電子装置の最近の傾向として超薄形化や
起生形化が進んでいる。この傾向に応じるために、電子
装置の種々の個所において改良が加えられているが、そ
のにうな改良(,1電子部品のリード線の占有量をでき
るだり94丁くJるところまで波及してきている。その
たV)に右利に用いられるのがリード線を−6た27い
ブーツブ形宙了部品である。これは例えば積層=1ンデ
ンリなどに適用されていて、その成る面に1.1、外部
電極が形成されている。そしてこのにうなチップ形電r
部品は、配線基板等にその外部電極を介してU″j’ 
IP、 ?l′Ill付され、それによって配線基板等
にり・1して電気的にも機械的にも接続されるものであ
る。
However, the recent trend in various electronic devices is toward ultra-thin and raised shapes. In order to respond to this trend, improvements have been made in various parts of electronic devices, but these improvements have spread to the point where the amount of lead wires occupied by electronic components has increased by as much as 94 mm. In addition, V) is a boot-stub type suspension part with a lead wire of -6 and 27 that is used for right-handers. This is applied, for example, to a stack of 1 layer, and 1.1 external electrodes are formed on the surface formed by the layer. And this chip type electric r
The component is connected to a wiring board, etc. via its external electrode.
IP? It is attached to a wiring board, etc., and connected electrically and mechanically.

上述のような配線基板へのチップ形電子部品の供給は、
整列を必要とするため、手作業?)パーツフィーダなど
で行なっていた。そのため手間が煩雑となり、自動化が
困ガで、確実111やイ8頼111が低いという欠点が
あった。
The supply of chip-shaped electronic components to the wiring board as described above is
Is it done manually because it requires alignment? ) This was done using parts feeders, etc. As a result, it is troublesome, difficult to automate, and has the drawbacks of low reliability 111 and 8 reliability 111.

そのために例えばマガジン方式やパ1ノツ1〜/j式が
提案されている。第1図はマガジンを示す断面図、第2
図はパレットを示寸斜祝図eある。マガジン方式は筒状
収納体1に複数IIJのブツプ形電子部品2をJi!i
層1ノ(収納したマガジン3によってチップ118電子
部品2を供給ηる1)のである。パレット/J戊(,1
、組構に複数個の凹所5を有する平板状収納1ホ4の各
凹所5内に、それぞれチップ形電子部品24収納、\I
!たパレット6にJ−ってチップ彫型1′部品2を供給
りる1)のCある。これらの収納体IJjよび4は、ア
ルミニウムあるい【まプラスチック<7−ど゛にJニー
>て構成され、一定の長さ、寸法、面fl’r ′’;
を(:) −:) ’(:)のである。しかしながらこ
れらの7’j”jl: t、!、マガジン3、パレット
6のプール聞が少/iく、1繁(、−交換を必要どし、
たとえチップ彫型子部品2の取り出1)を自動化しても
、マガジン31゛)パ1ノット0の取り扱いが動点どイ
する。また、ブツノ′彫型r部品2の自動取出時には、
電子部品2を)χり出したり、引さ出りことが必要で、
送り出tノ?+引さ出1ノtuイ〉いは位1h“決めの
ための装買が必νジど<2る。、\らにマガジンh式で
は、隣り合うチップ形Yiir部品相liが接触してい
るので、この接触により711了部品2が[−11!2
することがある。
For this purpose, for example, a magazine system and a 1-/j system have been proposed. Figure 1 is a sectional view showing the magazine, Figure 2
The figure is a perspective view showing the pallet. The magazine system stores multiple IIJ bump-shaped electronic components 2 in a cylindrical storage body 1! i
Layer 1 (chips 118 and electronic components 2 are supplied by the housed magazine 3). Palette/J 戊(,1
In each recess 5 of the flat storage 1 housing 4 having a plurality of recesses 5 in its structure, a chip-shaped electronic component 24 is stored, \I
! There is C in 1) on the pallet 6 where J- supplies the chip mold 1' parts 2. These containers IJj and 4 are constructed of aluminum or plastic and have a fixed length, dimension and surface fl'r'';
(:) −:) '(:) is. However, these 7'j"jl: t,!, Magazine 3, Pallet 6 pool is small/i, 1 often(,-requires replacement,
Even if the removal 1) of the chip die part 2 is automated, the handling of the magazine 31') part 1 knot 0 will be the main focus. Also, when automatically taking out Butsuno' carved r part 2,
It is necessary to pull out or pull out the electronic component 2).
Sending out? +Drawer 1 position or 1 h "It is necessary to purchase equipment for determining the position.In addition, in the magazine h type, adjacent chip type Yiir parts phase li are in contact with each other. Therefore, due to this contact, 711 completed part 2 becomes [-11!2
There are things to do.

それゆλ、1.゛ごの発明の十たる目的は、上述のよう
な問題点を解消し1!するチップ形t+s r部品11
M納・;11・を捏供することである。
That's λ, 1. The tenth purpose of this invention is to solve the above-mentioned problems and 1! Chip type t+sr part 11
It is to fabricate 11.

この発明は要約Jれば、少4丁<どl:) Iv −’
i 7j向lこ沿い、かつ隣り合うものどLl: ?−
7いに独S’/ Lッ℃等間隔に形成されるデツプ彫型
了^11品をIIV納cする複数個の透孔を設()たテ
ープ状体と、このテープ状イ4\の両平面に貼着されか
つ前記透fLをにI 11. tcろノJバーシートと
、テープ状体をぞのI:?千7′j向に送るl、−めの
送り穴を等間隔にα^えるプツシ彫型r部品収納帯であ
る。
This invention is summarized as follows:) Iv -'
i 7j direction, along this direction, and next to it: ? −
7. A tape-shaped body with a plurality of through holes for storing the 11 pieces of depth carvings formed at equal intervals, and this tape-shaped body 4\. 11. It is attached to both planes and the transparent fL is attached to I11. TCrono J bar sheet and tape-like body I:? It is a push carving r parts storage belt with l and - eyes feed holes arranged at equal intervals α^ in the 1,7' and 7' directions.

この発明のイの他の[1的と’t、’+ l牧(11,
1ス十(こ回向を参照しで行/=、う詳細な説明から一
層明らかと41ろう。
Other features of this invention (11,
It will become clearer from the detailed explanation.

第3図はこの発明にかかるチップ11(電子部品収納帯
の製作過程を示すもの(゛、第4図LL I!Iられ1
.:収納帯の巻回状態を示J斜祝図である。
FIG. 3 shows the manufacturing process of the chip 11 (electronic component storage band) according to the present invention.
.. : It is a J oblique view showing the winding state of the storage band.

ここに示すチップ形電子部品収納(1シは、紙、プラス
チック、鉄もしくはアルミーウIX<Kどの金属、また
はゴムなどから構成されるテープ状体1()を含む。好
ましくは第4図示のj、うに巻1−リし11〉すい川1
6−1’lの0のが用いられる1、テープ状体10の艮
手力向に沿−)で複数個の透孔11が形成される。この
複数個の透/l、 11 G;、1.、隣り合う−bの
どは互いに独立し、か゛)″9聞隔に形成、\れている
。また、この透孔11は、−I−・プ状体10に例えば
パンチングなどをi −t、−と(J二よ−)で形成さ
れる。12はテープ状体10の透11.11のPli!
 IIIじツー1に相関して等間隔に設()られた〜数
ill、IC1))Xり穴で゛、例えば前記透孔11の
形成と同11、’l kT、Inl 4& tn F(
Q テti 1.r イ+rt ル。かくすれば透孔1
1ど送り穴12どのイ1°l胃関係ならびに寸法精度が
極めi I’Jり(’+L % ルt+ t−、(1)
送り穴12ハ、’j −フ状体10の加111、“j\
ゝ)、1’C/ ’rd”r する電子部品の自動マウ
ン1〜時T’l L−、+liいで、−1−プ状体10
をビッグ送り覆るどき(に用い1)れろt)(1)−’
Cあイ)。このにうなテープ状体10の ゛11面;;
二児1!1ら)状のカバーシート13が貼着されどl 
、、 t″のハバーシート13 t;L、前記透孔11
の一方の燕イト(l/、成C1ろ0のぐあるlメ、送り
穴12を蓋しては/I−ら/1−い1、土1.−1この
ツノバーシー1〜13の貼着手段せて取りf4けるとい
ういわゆる熱シールd1に、」、って行なえば好都合で
あるが、接着剤等を用いCIf/i着してもにい。しか
し、透孔11内に収納されるジップ形電子部品がカバー
シー1へ13ど1g着されることがないようにしな【プ
ればイTらイTいこと131いう;1でもない。なお、
熱シールさlる場合、/Jバーシーl−13全体を溶融
しなりればhら4Tいことは(<、透孔11を器できる
ように行なえば足りる。例えばテープ状体10の「1」
方向両側端部近傍にのみ加熱を行なう如きである。
The chip-shaped electronic component storage (1) shown here includes a tape-shaped body 1 () made of paper, plastic, iron, any metal such as aluminum, or rubber. Preferably, Sea urchin roll 1-Rishi 11〉Suigawa 1
A plurality of through holes 11 are formed along the direction in which the tape-like body 10 is gripped. The plurality of T/l, 11 G;, 1. , adjacent -b throats are independent of each other, and are formed at intervals of 9". Also, the through holes 11 are formed by punching, etc. - and (J2yo-).12 is transparent 11.11 of the tape-shaped body 10, Pli!
For example, the formation of the through hole 11 and the formation of the above-mentioned through hole 11, 'l kT, Inl 4 & tn F(
Q Teti 1. r i+rt le. Thus, through hole 1
1st feed hole 12th position 1°l stomach relation and dimensional accuracy are extremely high ('+L % t + t-, (1)
Sprocket hole 12c, 'j - addition 111 of flat body 10, "j\
ゝ), 1'C/'rd''r Automatic mounting of electronic components 1~T'l L-, +li, -1-Pull body 10
When the big send is covered (used for 1) rero t) (1) -'
C). The 11th side of this tape-like body 10;
Although the cover sheet 13 in the form of two children 1!
,, t″ huber sheet 13 t;L, said through hole 11
One of the swallowtails (l/, the number C1-0, the spout hole 12 is covered, /I-ra/1-i1, soil 1.-1, and this hornbarcy 1 to 13 is pasted) It is convenient to attach the so-called heat seal d1, which can be removed by placing the means f4, but it is also difficult to attach the CIf/i using an adhesive or the like. Make sure that shaped electronic parts do not get attached to the cover sheet 1.
When heat-sealing, it is sufficient to melt the entirety of the /J Vershie l-13 so that the through holes 11 can be sealed.
It is as if heating is performed only in the vicinity of both ends in the direction.

一方の開[]端をカバーシート13にJ、つて品された
透孔11内には、それぞれ1飼づつブップ彫型γ部品2
が、ぞの方向や表裏をJ)め−C収納される。
One open [] end is attached to the cover sheet 13, and each through hole 11 contains one bup-shaped γ part 2.
are stored in the opposite direction and front and back.

電子部品2が収納されたデーーI状体10の他甲面にも
またN膜状のカバーシート14が貼ン1される。
A cover sheet 14 in the form of an N film is pasted 1 on the back surface of the deck I-shaped body 10 in which the electronic components 2 are housed.

このカバーシー1〜14は、前記透孔11の他方の益を
構成するものであるが、送り穴12を黙しCは<(らな
い。このカバーシー1−14は、前述のカバーシート1
3と同様のものであるので、その余の説明は省略する。
These cover sheets 1 to 14 constitute the other side of the through hole 11, but do not cover the perforation hole 12.
Since this is the same as 3, the remaining explanation will be omitted.

1述の、1、うにし−(−この発明のチップ彫型子部品
収納帯1.1: lb’+成−1′L、例λぽ第4図に
示すように、)凶宜呑芯1 !+ +、I: /:l;
Iリール(図示せず)が用意され−F、(1)周面(に
温容状に巻回される。また、図示しないが、収納ぜ;シ
4い])ゆるツヅラ析すして重畳させ−C□J、い。従
−)′C多故のチップ形電子部品2を]ンバクトf−1
とめることができ、その状態で運送し、ぞの、1、:1
白動マウント装置等に装着することが(゛さる。、 :
f 1)TI−−ゾ状体10の長さを長くすれぽりる(
、1ど、J、 u)多くのfツブ彫型子部品2が収(T
の3」うイ1措成の収納帯にJ:って、実際にブツ1”
 +14電r部品2を自動1ノウント装F7等によって
供尋 給する1易含には、送り穴に、j:つて順次送り出すと
どb 1.二、適宜の手段ににつて、テープ状体10に
貼r、さ1′1(いるカバーシート13.14の一方を
剥がしイ1がl−+ (ツブ形電子部品2を取り出して
行なえば31、い、1 第11図はこの発明の(pHの実施例を説明するICめ
の断面図であり、収納帯のIll 7j向にl/J)わ
i 1.、/ /、:状態の図である。ここに示すチッ
プ彫型Y部品収納帯は、2列の透孔21a 、 211
+をbつj−−7′状体20を含む。このテープ状体2
0には、前)1(の揚台と同様に内平面にカバーシー1
〜23.24が、3I、た送り穴22が設置)られてい
る。この実施例によれば、ノ−−−f状体20の一定長
さに2倍の数のf−ツーノ゛形fli r部品2を収納
することができる。この意味か−)、1Nらに透孔を多
列に設c−Jてもよいことが理解され31、)、1なお
上述した実施例は、この発明を具体的に示すものであっ
て、この発明を限定(jるbのCkl、 <rい。例え
ばテープ状体に設LJられろ送り穴(、l多列あっても
よく、またそれは透孔(1,12K < ”j −’、
7’状体の側縁に等間隔に設【]られた切欠C−あっC
Iv 、J−い。さらに送り穴の配列ピップは、透孔ど
同i、L−選ばれたが、これに限らず例えば透fLの2
 +11.Iごとに設けたりして−bよく、そのも”I
 M −(:I )−ノ゛状1本の任意の位置に選ぶこ
ともでさる1、まlこ、j−I状体の内平面に貼着され
るカバーシートは、先の実施例では送り穴を蓋してはイ
TI′:′)ない構成としくいるが、少<’L りどb
収納帯として送り穴を利用覆るどきにさλ燕されていな
りれば足り、製作段階に、1jい−(は必らザしム蓋し
ないようにしなければなら(7い必昔kl:ない。−)
J:り製作段階で送り穴に蓋さり、tいるどして−b1
後にこの蓋を例えば鉤状の1)の−1ゝ)パン117−
等で突ぎ破ったりしておけばよいのである3゜ 以1−. (1) J、・)にこの発明にJ:れば、多
数のチップ形電工部品が]ンパクトに収納できるととも
に、ぞの1ツノ形宙了部品がカバーシー1−によって、
プリン1へM仮等への実際のマウンl一時以外は外気/
l’ ”) if患蔽されCいるので、長期保存に適す
るとと1)に、IIIす1及い中に11(1落するおそ
れが全くなく、安定/r1葉f’lを行イ「わしめるこ
とができるものである。まA= 、この収納状態から、
自動マウンl〜時には、11確にジップ形電子部品が供
給できるので、従来の2へ・3倍のスピードでかつ信頼
性の高いマウントをt’j’ <cうことができる。従
って従来自動マウントのtiな;I′) 1′していな
かった用途にも幅広く利用で、(るJ、′1に/′rる
ことが予想される。また、従来のマガジン方式やパレツ
1〜j)式にくらべ、電子部品のプール吊をかなり多く
することがで、\゛るので、自動マリン1〜作業に対J
る省力化をはかイ)ことができる。一方チツブ形電子部
品の牛+1r1−稈ど直結してケーシングが可能であり
、出(+l +Iでの1−程が簡略化される。また、電
子部品の数組;、11、収納帯の長さにJ、つて把択1
」るこIがて゛さる。さらにデツプ形電子部品が1個つ
づ個別的に11V、納された状態であるので、運送中ば
かりC’ 4’l < 、マウント時に至るまで一員し
U ’/ツJ形r1tT一部品の劣化や破損を折tJる
ことができる。
1. Sea urchin (-Chip molding part storage band of this invention 1.1: lb'+Ni-1'L, example λPo as shown in FIG. 4) 1! + +, I: /:l;
An I reel (not shown) is prepared; -C□J, yes. F-1
It can be stopped and transported in that condition.
Can be attached to a white motion mount device, etc.
f 1) TI-- lengthen the length of the zodiac body 10 (
, 1, J, u) Many f-shaped mold parts 2 are collected (T
There is actually a thing 1 in the storage belt of 3.
To feed +14 electric parts 2 using an automatic 1-noun device F7, etc., feed them sequentially through the feed hole.1. 2. Peel off one side of the cover sheet 13. ,I,1 Figure 11 is a sectional view of the IC of this invention (explaining an example of pH, l/J in the Ill 7j direction of the storage band)Wi 1., / /,: state diagram The chip engraving Y component storage band shown here has two rows of through holes 21a and 211.
+b j--7'-shaped bodies 20 are included. This tape-like body 2
0 has a cover sheet 1 on the inner plane similar to the lifting platform of
~23.24, 3I, and feed hole 22) are installed. According to this embodiment, twice the number of f-shaped flir parts 2 can be accommodated in a given length of the f-shaped body 20. Is this meaning?), it is understood that through holes may be provided in multiple rows in 1N et al. This invention is limited to Ckl of j r b, <r. For example, there may be multiple rows of perforation holes (LJ provided in the tape-like body), and it is also possible that there are through holes (1,12K <"j-',
Notches C-A-C provided at equal intervals on the side edge of the 7'-shaped body
Iv, J-i. Furthermore, the arrangement pips of the sprocket holes are selected as i and L for the through holes, but are not limited to this, for example, 2 for the through hole fL.
+11. It is good to set it up for each I.
The cover sheet to be attached to the inner plane of the M-(:I)-shaped body can be selected at any arbitrary position of the M-(:I)-shaped body. Although it is designed so that it is not possible to cover the sprocket hole, it is difficult to cover the sprocket hole.
It is sufficient that the sprocket hole is used as a storage band.It is sufficient that it is covered when covering it, and it is necessary to make sure that the lid is not covered during the production stage. −)
J: At the manufacturing stage, cover the sprocket hole and insert the t-b1
Later, this lid is attached to a hook-shaped 1)-1) pan 117-
All you have to do is break it through with something like 3° or more 1-. (1) If this invention is applied to J,..., a large number of chip-shaped electric parts can be stored in a compact manner, and each horn-shaped hanging part can be stored in a cover sheet 1-.
To Pudding 1 M Temporary etc. Actual mounting l Outside air except for one time /
l''') If it is infected with C, it is suitable for long-term storage and 1), there is no risk of it falling off, and it is stable/r1 leaf f'l. This is something that can be determined.A= From this storage state,
When automatic mounting is performed, zip-type electronic components can be supplied with 11 accuracy, making it possible to mount a highly reliable mount 2 to 3 times faster than the conventional method. Therefore, it is expected that it will be widely used in applications where conventional automatic mounting was not possible; ~J) Compared to the formula, the number of electronic parts suspended in the pool can be considerably increased.
A) It is possible to save labor. On the other hand, it is possible to connect the casing directly to the culm of the chip-shaped electronic components, and the 1- step in +I is simplified.In addition, several sets of electronic components; Sana J, Tsute Grasping 1
``Ruko I is a teacher.'' Furthermore, since the depth-type electronic components are individually stored at 11V, there is no risk of deterioration of the U'/J-type r1tT parts. Damage can be folded.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は従来のマガジンを示−iJ断面図、第2図は同
じくパレットを示り斜視図、第3図はこの弁明の製作過
程を説明Jるための斜視図、第4図はこの発明の一実施
例の巻回状態を示′?l斜視図、第5図はこの発明の他
の実施例を説明1」るlごめの断面図である。 10・・・・・・テープ状体、11・・・・・・透孔、
12・・・・・・送り穴13.14・・・・・・カバー
シー1− 。
Fig. 1 is a cross-sectional view of a conventional magazine, Fig. 2 is a perspective view of a pallet, Fig. 3 is a perspective view for explaining the manufacturing process of this invention, and Fig. 4 is a perspective view of the present invention. Shows the winding state of an example of ? 1 is a perspective view, and FIG. 5 is a cross-sectional view of another embodiment of the present invention. 10...Tape-shaped body, 11...Through hole,
12...Sprocket hole 13.14...Cover sea 1-.

Claims (1)

【特許請求の範囲】[Claims] テープ状体、このテープ状体の少なくとも長手方向に沿
いかつ隣り合うものとは互いに独立して等間隔に形成さ
れるチップ形電子部品が収納される複数個の透孔、この
透孔を封止するように前記テープ状体の両面に貼着され
るカバーシート、および前記テープ状体をその長手方向
に送るためにこのテープ状体の長手方向に等間隔に設け
られた送り穴を備えるチップ形電子部品収納帯。
A tape-shaped body, a plurality of through holes formed along at least the longitudinal direction of the tape-shaped body and spaced apart from each other and at equal intervals to accommodate chip-shaped electronic components, and the through holes are sealed. a cover sheet affixed to both sides of the tape-like body so as to feed the tape-like body in the longitudinal direction thereof, and a tip-shaped chip having feeding holes provided at equal intervals in the longitudinal direction of the tape-like body for feeding the tape-like body in the longitudinal direction thereof; Electronic parts storage belt.
JP57141439A 1982-08-13 1982-08-13 Chip type electronic part containing band Granted JPS5840900A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57141439A JPS5840900A (en) 1982-08-13 1982-08-13 Chip type electronic part containing band

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57141439A JPS5840900A (en) 1982-08-13 1982-08-13 Chip type electronic part containing band

Publications (2)

Publication Number Publication Date
JPS5840900A true JPS5840900A (en) 1983-03-09
JPS6160600B2 JPS6160600B2 (en) 1986-12-22

Family

ID=15291974

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57141439A Granted JPS5840900A (en) 1982-08-13 1982-08-13 Chip type electronic part containing band

Country Status (1)

Country Link
JP (1) JPS5840900A (en)

Also Published As

Publication number Publication date
JPS6160600B2 (en) 1986-12-22

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