JPS5840345B2 - サイリスタ - Google Patents
サイリスタInfo
- Publication number
- JPS5840345B2 JPS5840345B2 JP51032393A JP3239376A JPS5840345B2 JP S5840345 B2 JPS5840345 B2 JP S5840345B2 JP 51032393 A JP51032393 A JP 51032393A JP 3239376 A JP3239376 A JP 3239376A JP S5840345 B2 JPS5840345 B2 JP S5840345B2
- Authority
- JP
- Japan
- Prior art keywords
- region
- groove
- junction
- regions
- conductivity type
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 25
- 239000011810 insulating material Substances 0.000 claims description 24
- 239000010410 layer Substances 0.000 claims 1
- 239000002344 surface layer Substances 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 description 21
- 238000009792 diffusion process Methods 0.000 description 16
- 108091006146 Channels Proteins 0.000 description 14
- 239000011521 glass Substances 0.000 description 13
- 230000000903 blocking effect Effects 0.000 description 8
- 239000012535 impurity Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 6
- 230000002093 peripheral effect Effects 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- 230000004888 barrier function Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 230000000873 masking effect Effects 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000000206 photolithography Methods 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 238000003698 laser cutting Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- 108010075750 P-Type Calcium Channels Proteins 0.000 description 1
- 241000282806 Rhinoceros Species 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 description 1
- 230000002779 inactivation Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/402—Field plates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0603—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions
- H01L29/0607—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration
- H01L29/0638—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for preventing surface leakage due to surface inversion layer, e.g. with channel stopper
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0603—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions
- H01L29/0642—Isolation within the component, i.e. internal isolation
- H01L29/0646—PN junctions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0657—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body
- H01L29/0661—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body specially adapted for altering the breakdown voltage by removing semiconductor material at, or in the neighbourhood of, a reverse biased junction, e.g. by bevelling, moat etching, depletion etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/70—Bipolar devices
- H01L29/74—Thyristor-type devices, e.g. having four-zone regenerative action
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Thyristors (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB12648/75A GB1499845A (en) | 1975-03-26 | 1975-03-26 | Thyristors |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS51120681A JPS51120681A (en) | 1976-10-22 |
| JPS5840345B2 true JPS5840345B2 (ja) | 1983-09-05 |
Family
ID=10008565
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP51032393A Expired JPS5840345B2 (ja) | 1975-03-26 | 1976-03-24 | サイリスタ |
Country Status (11)
Families Citing this family (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55133569A (en) * | 1979-04-06 | 1980-10-17 | Hitachi Ltd | Semiconductor device |
| US4261000A (en) * | 1980-05-23 | 1981-04-07 | General Electric Company | High voltage semiconductor device having an improved dv/dt capability |
| US4261001A (en) * | 1980-05-23 | 1981-04-07 | General Electric Company | Partially isolated amplifying gate thyristor with controllable dv/dt compensation, high di/dt capability, and high sensitivity |
| JPS5773956A (en) * | 1980-10-27 | 1982-05-08 | Hitachi Ltd | Glass coated semiconductor device |
| US4412242A (en) * | 1980-11-17 | 1983-10-25 | International Rectifier Corporation | Planar structure for high voltage semiconductor devices with gaps in glassy layer over high field regions |
| BR8203630A (pt) * | 1981-06-29 | 1983-06-14 | Westinghouse Electric Corp | Dispositivo semicondutor processo de preparacao de uma pluralidade de dispositivos semicondutores apassivados com vidro |
| DE3151141A1 (de) * | 1981-12-23 | 1983-06-30 | Siemens AG, 1000 Berlin und 8000 München | Halbleiterbauelement mit hoher stossstrombelastbarkeit |
| FR2542148B1 (fr) * | 1983-03-01 | 1986-12-05 | Telemecanique Electrique | Circuit de commande d'un dispositif a semi-conducteur sensible du type thyristor ou triac, avec impedance d'assistance a l'auto-allumage et son application a la realisation d'un montage commutateur associant un thyristor sensible a un thyristor moins sensible |
| DE3331298A1 (de) * | 1983-08-31 | 1985-03-14 | Brown, Boveri & Cie Ag, 6800 Mannheim | Leistungsthyristor auf einem substrat |
| JPS63205955A (ja) * | 1987-02-21 | 1988-08-25 | Nec Corp | プレ−ナ型高耐圧サイリスタ |
| DE3832709A1 (de) * | 1988-09-27 | 1990-03-29 | Asea Brown Boveri | Thyristor |
| US4974050A (en) * | 1989-05-30 | 1990-11-27 | Motorola Inc. | High voltage semiconductor device and method |
| FR2666174B1 (fr) * | 1990-08-21 | 1997-03-21 | Sgs Thomson Microelectronics | Composant semiconducteur haute tension a faible courant de fuite. |
| DE4119904A1 (de) * | 1991-06-17 | 1992-12-24 | Telefunken Electronic Gmbh | Halbleiteranordnung |
| US20040061170A1 (en) * | 1995-07-31 | 2004-04-01 | Ixys Corporation | Reverse blocking IGBT |
| US5698454A (en) * | 1995-07-31 | 1997-12-16 | Ixys Corporation | Method of making a reverse blocking IGBT |
| US6727527B1 (en) | 1995-07-31 | 2004-04-27 | Ixys Corporation | Reverse blocking IGBT |
| JP4222092B2 (ja) * | 2003-05-07 | 2009-02-12 | 富士電機デバイステクノロジー株式会社 | 半導体ウェハ、半導体装置および半導体装置の製造方法 |
| US7326596B2 (en) * | 2004-04-26 | 2008-02-05 | Ixys Corporation | High voltage power device with low diffusion pipe resistance |
| FR2987698B1 (fr) * | 2012-03-02 | 2014-04-04 | St Microelectronics Tours Sas | Composant de puissance vertical |
| DE102016124670B4 (de) * | 2016-12-16 | 2020-01-23 | Semikron Elektronik Gmbh & Co. Kg | Thyristor mit einem Halbleiterkörper |
| DE102016124669B3 (de) | 2016-12-16 | 2018-05-17 | Semikron Elektronik Gmbh & Co. Kg | Thyristoren mit einem jeweiligen Halbleiterkörper |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4994285A (US06605200-20030812-C00035.png) * | 1973-01-12 | 1974-09-06 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BE636316A (US06605200-20030812-C00035.png) * | 1962-08-23 | 1900-01-01 | ||
| US3446995A (en) * | 1964-05-27 | 1969-05-27 | Ibm | Semiconductor circuits,devices and methods of improving electrical characteristics of latter |
| DE1614751A1 (de) * | 1967-01-07 | 1970-12-03 | Telefunken Patent | Halbleiteranordnung |
| NL6904619A (US06605200-20030812-C00035.png) * | 1969-03-25 | 1970-09-29 | ||
| US3628106A (en) * | 1969-05-05 | 1971-12-14 | Gen Electric | Passivated semiconductor device with protective peripheral junction portion |
| US3608186A (en) * | 1969-10-30 | 1971-09-28 | Jearld L Hutson | Semiconductor device manufacture with junction passivation |
| CH517379A (de) * | 1971-06-18 | 1971-12-31 | Transistor Ag | Halbleitervorrichtung |
| US3772577A (en) * | 1972-02-10 | 1973-11-13 | Texas Instruments Inc | Guard ring mesa construction for low and high voltage npn and pnp transistors and diodes and method of making same |
| JPS4974486A (US06605200-20030812-C00035.png) * | 1972-11-17 | 1974-07-18 | ||
| NL161301C (nl) * | 1972-12-29 | 1980-01-15 | Philips Nv | Halfgeleiderinrichting en werkwijze voor de vervaar- diging daarvan. |
| DE2306842C3 (de) * | 1973-02-12 | 1981-10-29 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zum Herstellen einer Vielzahl von Halbleiterelementen aus einer einzigen Halbleiterscheibe |
-
1975
- 1975-03-26 GB GB12648/75A patent/GB1499845A/en not_active Expired
-
1976
- 1976-02-24 SE SE7602247A patent/SE404107B/xx unknown
- 1976-03-15 DE DE2610828A patent/DE2610828C2/de not_active Expired
- 1976-03-16 CA CA248,046A patent/CA1066428A/en not_active Expired
- 1976-03-22 CH CH354676A patent/CH600573A5/xx not_active IP Right Cessation
- 1976-03-23 IT IT21489/76A patent/IT1058673B/it active
- 1976-03-24 AU AU12280/76A patent/AU504477B2/en not_active Expired
- 1976-03-24 BE BE165512A patent/BE839971A/xx unknown
- 1976-03-24 JP JP51032393A patent/JPS5840345B2/ja not_active Expired
- 1976-03-26 FR FR7608864A patent/FR2305854A1/fr active Granted
-
1977
- 1977-12-12 US US05/859,688 patent/US4148053A/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4994285A (US06605200-20030812-C00035.png) * | 1973-01-12 | 1974-09-06 |
Also Published As
| Publication number | Publication date |
|---|---|
| CA1066428A (en) | 1979-11-13 |
| GB1499845A (en) | 1978-02-01 |
| IT1058673B (it) | 1982-05-10 |
| FR2305854B1 (US06605200-20030812-C00035.png) | 1981-11-27 |
| SE7602247L (sv) | 1976-09-27 |
| AU504477B2 (en) | 1979-10-18 |
| JPS51120681A (en) | 1976-10-22 |
| DE2610828A1 (de) | 1976-10-07 |
| DE2610828C2 (de) | 1982-06-03 |
| SE404107B (sv) | 1978-09-18 |
| BE839971A (fr) | 1976-09-24 |
| AU1228076A (en) | 1977-09-29 |
| FR2305854A1 (fr) | 1976-10-22 |
| US4148053A (en) | 1979-04-03 |
| CH600573A5 (US06605200-20030812-C00035.png) | 1978-06-15 |
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