JPS5839021A - 半導体装置の検査方法 - Google Patents

半導体装置の検査方法

Info

Publication number
JPS5839021A
JPS5839021A JP56137215A JP13721581A JPS5839021A JP S5839021 A JPS5839021 A JP S5839021A JP 56137215 A JP56137215 A JP 56137215A JP 13721581 A JP13721581 A JP 13721581A JP S5839021 A JPS5839021 A JP S5839021A
Authority
JP
Japan
Prior art keywords
forward voltage
measured
semiconductor device
chamber
normal temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56137215A
Other languages
English (en)
Japanese (ja)
Other versions
JPS649731B2 (cg-RX-API-DMAC10.html
Inventor
Yoshihide Nakamura
吉秀 中村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Home Electronics Ltd
NEC Corp
Original Assignee
NEC Home Electronics Ltd
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Home Electronics Ltd, Nippon Electric Co Ltd filed Critical NEC Home Electronics Ltd
Priority to JP56137215A priority Critical patent/JPS5839021A/ja
Publication of JPS5839021A publication Critical patent/JPS5839021A/ja
Publication of JPS649731B2 publication Critical patent/JPS649731B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07173—Means for moving chips, wafers or other parts, e.g. conveyor belts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Wire Bonding (AREA)
JP56137215A 1981-08-31 1981-08-31 半導体装置の検査方法 Granted JPS5839021A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56137215A JPS5839021A (ja) 1981-08-31 1981-08-31 半導体装置の検査方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56137215A JPS5839021A (ja) 1981-08-31 1981-08-31 半導体装置の検査方法

Publications (2)

Publication Number Publication Date
JPS5839021A true JPS5839021A (ja) 1983-03-07
JPS649731B2 JPS649731B2 (cg-RX-API-DMAC10.html) 1989-02-20

Family

ID=15193473

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56137215A Granted JPS5839021A (ja) 1981-08-31 1981-08-31 半導体装置の検査方法

Country Status (1)

Country Link
JP (1) JPS5839021A (cg-RX-API-DMAC10.html)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6384132A (ja) * 1986-09-29 1988-04-14 Toshiba Corp ワイヤボンデイング検査方法および検査装置
JPH0541435A (ja) * 1991-02-13 1993-02-19 Nec Corp 半導体装置の検査方法
JPH05136230A (ja) * 1991-11-14 1993-06-01 Fujitsu Ltd バーイン装置の診断回路
EP3715887A1 (en) 2019-03-29 2020-09-30 Sintokogio, Ltd. Inspecting device
EP3715886A1 (en) 2019-03-29 2020-09-30 Sintokogio, Ltd. Inspecting device
EP3719835A1 (en) 2019-03-29 2020-10-07 Sintokogio, Ltd. Inspecting device
CN114267604A (zh) * 2021-12-22 2022-04-01 浙江里阳半导体有限公司 具有控制引脚的电子器件的制造方法及其缺陷检测方法

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6384132A (ja) * 1986-09-29 1988-04-14 Toshiba Corp ワイヤボンデイング検査方法および検査装置
JPH0541435A (ja) * 1991-02-13 1993-02-19 Nec Corp 半導体装置の検査方法
JPH05136230A (ja) * 1991-11-14 1993-06-01 Fujitsu Ltd バーイン装置の診断回路
EP3715887A1 (en) 2019-03-29 2020-09-30 Sintokogio, Ltd. Inspecting device
EP3715886A1 (en) 2019-03-29 2020-09-30 Sintokogio, Ltd. Inspecting device
EP3719835A1 (en) 2019-03-29 2020-10-07 Sintokogio, Ltd. Inspecting device
KR20200115344A (ko) 2019-03-29 2020-10-07 신토고교 가부시키가이샤 검사 장치
KR20200115345A (ko) 2019-03-29 2020-10-07 신토고교 가부시키가이샤 검사 장치
CN111830386A (zh) * 2019-03-29 2020-10-27 新东工业株式会社 检查装置
CN114267604A (zh) * 2021-12-22 2022-04-01 浙江里阳半导体有限公司 具有控制引脚的电子器件的制造方法及其缺陷检测方法

Also Published As

Publication number Publication date
JPS649731B2 (cg-RX-API-DMAC10.html) 1989-02-20

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