JPS5838658A - 放熱フインの接合方法 - Google Patents

放熱フインの接合方法

Info

Publication number
JPS5838658A
JPS5838658A JP13673381A JP13673381A JPS5838658A JP S5838658 A JPS5838658 A JP S5838658A JP 13673381 A JP13673381 A JP 13673381A JP 13673381 A JP13673381 A JP 13673381A JP S5838658 A JPS5838658 A JP S5838658A
Authority
JP
Japan
Prior art keywords
fins
thickness
seat plate
parts
heat radiation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13673381A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6348640B2 (cs
Inventor
Masabumi Kaneko
正文 金子
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MA Aluminum Corp
Original Assignee
Mitsubishi Aluminum Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Aluminum Co Ltd filed Critical Mitsubishi Aluminum Co Ltd
Priority to JP13673381A priority Critical patent/JPS5838658A/ja
Publication of JPS5838658A publication Critical patent/JPS5838658A/ja
Publication of JPS6348640B2 publication Critical patent/JPS6348640B2/ja
Granted legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/0008Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP13673381A 1981-08-31 1981-08-31 放熱フインの接合方法 Granted JPS5838658A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13673381A JPS5838658A (ja) 1981-08-31 1981-08-31 放熱フインの接合方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13673381A JPS5838658A (ja) 1981-08-31 1981-08-31 放熱フインの接合方法

Publications (2)

Publication Number Publication Date
JPS5838658A true JPS5838658A (ja) 1983-03-07
JPS6348640B2 JPS6348640B2 (cs) 1988-09-29

Family

ID=15182229

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13673381A Granted JPS5838658A (ja) 1981-08-31 1981-08-31 放熱フインの接合方法

Country Status (1)

Country Link
JP (1) JPS5838658A (cs)

Also Published As

Publication number Publication date
JPS6348640B2 (cs) 1988-09-29

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