JPS5836495B2 - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法

Info

Publication number
JPS5836495B2
JPS5836495B2 JP48066191A JP6619173A JPS5836495B2 JP S5836495 B2 JPS5836495 B2 JP S5836495B2 JP 48066191 A JP48066191 A JP 48066191A JP 6619173 A JP6619173 A JP 6619173A JP S5836495 B2 JPS5836495 B2 JP S5836495B2
Authority
JP
Japan
Prior art keywords
junction
ohmic contact
layer
pellet
contact layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP48066191A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5017176A (enExample
Inventor
丈祐 中田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP48066191A priority Critical patent/JPS5836495B2/ja
Publication of JPS5017176A publication Critical patent/JPS5017176A/ja
Publication of JPS5836495B2 publication Critical patent/JPS5836495B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/27—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Dicing (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Weting (AREA)
  • Die Bonding (AREA)
JP48066191A 1973-06-12 1973-06-12 半導体装置の製造方法 Expired JPS5836495B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP48066191A JPS5836495B2 (ja) 1973-06-12 1973-06-12 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP48066191A JPS5836495B2 (ja) 1973-06-12 1973-06-12 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS5017176A JPS5017176A (enExample) 1975-02-22
JPS5836495B2 true JPS5836495B2 (ja) 1983-08-09

Family

ID=13308694

Family Applications (1)

Application Number Title Priority Date Filing Date
JP48066191A Expired JPS5836495B2 (ja) 1973-06-12 1973-06-12 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS5836495B2 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH649789A5 (de) * 1980-09-29 1985-06-14 Sandoz Ag Elektrolytische zelle.
JPS5886743A (ja) * 1981-11-18 1983-05-24 Nec Home Electronics Ltd 半導体装置の製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49114365A (enExample) * 1973-02-28 1974-10-31
JPS506144A (enExample) * 1973-05-18 1975-01-22

Also Published As

Publication number Publication date
JPS5017176A (enExample) 1975-02-22

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