JPS5834761Y2 - Cooling device for semiconductor devices - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a cooling device for a semiconductor device, and more particularly to a device in which the semiconductor device is brought into close contact with a heat sink that is integrally formed with a heat pipe, thereby dramatically increasing its cooling efficiency.

Conventionally, heat sinks made of aluminum, copper, or the like having cooling fins have been widely used as means for cooling semiconductor elements.

According to this, there is a natural limit to the cooling efficiency with respect to the increase in the amount of heat generated due to the increase in the current capacity of the semiconductor.

For this reason, it is necessary to increase the surface area of the cooling fins, that is, the volume of the heat radiation fins.

However, in this case, as the volume of the radiation fin increases, the heat conduction characteristics of the material of the radiation fin itself cannot be ignored, and the temperature gradient thereof will dominate its cooling characteristics.

For this reason, there are limits to the size and thermal cooling characteristics of the radiation fins.

Furthermore, in order to improve cooling efficiency, a method of cooling semiconductor elements with forced air from the center line direction has also been implemented.

However, in the case where multiple semiconductor devices are stacked in the direction of the center line via the heat sink, these tightening jigs and the semiconductor devices themselves obstruct air flow, making it difficult to cool the semiconductor devices downwind. It becomes insufficient.

If the outer diameter of the semiconductor element is sufficiently large, such insufficient cooling will greatly affect the life of the device.

The present invention has been developed to improve such conventional problems, and in particular, in order to efficiently cool semiconductor elements that are alternately interposed in the heat sink by using the heat sink as a part of the heat pipe, Adjacent heat pipes having radiation fins have different outer diameter dimensions,
A novel semiconductor device cooling device is provided.

An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is a front view of a heat sink of a cooling device according to the present invention.

Reference numeral 1 denotes a block made of a metal with high thermal conductivity such as copper or aluminum, and a semiconductor element is held in pressure contact with the block 1 at a position indicated by a chain line.

A ring-shaped hollow part 2 is formed in the block 1 as shown in FIG. 2, and a pipe 4 having heat dissipating fins 3 on its circumference is attached to the block 1 as shown in the figure so as to communicate with the ring-shaped hollow part 2. There is.

A necessary amount of boiling refrigerant liquid such as distilled water or fluorocarbon liquid is filled in the hollow portion 2 and the pipe 4 in a deaerated state.

The pipe 4 surrounds the block 1, and its surface should be made of a thin plate with high thermal conductivity such as copper, aluminum or iron alloy.

Next, in order to attach a semiconductor element to a heat sink having the above configuration, a heat sink A having the above configuration with different external dimensions is required.
, B are arranged alternately with a plurality of semiconductor elements 5 interposed therebetween, as shown in FIG.

At this time, the semiconductor element 5 is held in each block 1 at the position indicated by the chain line.

In this way, a cooling device for the semiconductor element is formed, and when the cooling fan 9 sends air in the direction of the center line of the semiconductor element 5, the radiation fins 3 are forcibly cooled.

In this case, the airflow is blocked by the block 1 and the bracket 6, but it flows through the radiation fins 3 in the direction along these surfaces, so the wind pressure on the radiation fins 3 is approximately the same regardless of whether they are in the front or the rear. Therefore, the cooling effect thereon is not hindered.

Boiling refrigerant liquid is sealed in the hollow part 2 and the pipe 4, and this constitutes a heat pipe, so the heat exchange efficiency is excellent, and heat radiation from the radiation fins 3 is effective due to the heat exchange action of the heat pipe. Therefore, the semiconductor element 5 is also quickly cooled.

As explained above, according to the present invention, heat sinks made of heat pipes filled with boiling coolant having different outer diameters are arranged alternately in the air blowing direction via semiconductor elements. By doing so, the heat exchange efficiency of the radiation fins can be increased.

Therefore, the cooling efficiency of the semiconductor element is increased, and it is extremely beneficial to use it for cooling a semiconductor element with a large heat capacity.

Also, because the outer diameter of the heat sink is different, the wind pressure on the heat radiation fins is approximately the same both in the front and rear.
It is possible to prevent the cooling effect from deteriorating due to the overlapping of semiconductor elements as in the prior art.

Further, such effects can be obtained at low cost with a simple configuration, and if put to practical use, it will be extremely beneficial.

[Brief explanation of the drawing]

Figure 1 is a front view of the heat sink in the present invention, Figure 2 is a cross-sectional view taken along line A-A in Figure 1, and Figure 3 is an exploded side view of the overall configuration of the cooling device. It is. 1... Heat sink block, 2...
・Pipe, 3... Radiation fin, 5...
semiconductor element.

Claims (1)

[Scope of utility model registration request] A cooling device for a semiconductor device, characterized in that heat sinks having different outer diameters, which are formed from heat pipes filled with boiling coolant, are alternately arranged perpendicular to the air blowing direction with the semiconductor device interposed therebetween.