JPS5832484A - Composite printed board - Google Patents

Composite printed board

Info

Publication number
JPS5832484A
JPS5832484A JP13021281A JP13021281A JPS5832484A JP S5832484 A JPS5832484 A JP S5832484A JP 13021281 A JP13021281 A JP 13021281A JP 13021281 A JP13021281 A JP 13021281A JP S5832484 A JPS5832484 A JP S5832484A
Authority
JP
Japan
Prior art keywords
board
printed circuit
block
circuit board
composite printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13021281A
Other languages
Japanese (ja)
Inventor
和宣 池田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Faurecia Clarion Electronics Co Ltd
Original Assignee
Clarion Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Clarion Co Ltd filed Critical Clarion Co Ltd
Priority to JP13021281A priority Critical patent/JPS5832484A/en
Publication of JPS5832484A publication Critical patent/JPS5832484A/en
Pending legal-status Critical Current

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  • Structure Of Printed Boards (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 本発明はプリント基板に関するものであって、特に電子
機器に使用する各機能別の複数枚のプリント基板を補助
基板を介して一体化した複合プリント基板に係る。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a printed circuit board, and more particularly to a composite printed circuit board in which a plurality of printed circuit boards for each function used in electronic equipment are integrated via an auxiliary board.

従来、複数枚のプリント基板よりなる電子機器は、各機
能専用のプリント基板を用意し、これらが独立に分割さ
れた状態で部品を挿入し、オートカッタを掛けて、更に
半田デツピングを行って部品とプリント基板のパターン
とを半田付した上で、各機能のプリント基板ごとに機構
的、電気的な検査調整を行っていた。そして、これ等の
プリント基板を機器筺体内に組込み、各プリント基板間
の配線を行った後、再びその機器の総合的な機構的、電
気的な検査調整を行っていた。
Conventionally, electronic devices consisting of multiple printed circuit boards have been manufactured by preparing printed circuit boards dedicated to each function, inserting components into these independently divided circuit boards, applying an auto cutter, and then soldering. After soldering the circuit board and the pattern of the printed circuit board, mechanical and electrical inspection and adjustment were performed for each printed circuit board for each function. After installing these printed circuit boards into the equipment housing and wiring between the printed circuit boards, the equipment was again subjected to comprehensive mechanical and electrical inspection and adjustment.

しかるに、この従来法であると、電子機器が複数種類よ
りなるプリント基板にて構成されている為に、各機能別
のプリント基板の形状や部品点数の相違から、部品を挿
入したりオートカッタに掛けたり、デツピングを施した
りする際に組立工数に差異を生じその加工能力のバラン
スがとれないという欠点があった。また、各プリント基
板を各々で機構的、電気的な検査調整を行った後、機器
筐体内に組込み及び配線を行った場合、各プリント基板
間の相関がとれずに、機構的不良や電気的不具合を発生
させる虞れがあり、再度の調整が必要となって、不要な
修理調整工数が多くなる不都合もあった。更に、各プリ
ント基板が各々の機能で個別に検査調整されるので、そ
の為の検査用の測定機器や調整治具が多く必要とされ、
治具等の製作が困難であるという欠点もあった。
However, with this conventional method, since electronic devices are made up of multiple types of printed circuit boards, it is difficult to insert parts or use an auto cutter due to the differences in the shape and number of parts of the printed circuit boards for each function. There is a drawback that there is a difference in assembly man-hours when hanging or dipping, and the processing capacity cannot be balanced. In addition, if each printed circuit board is mechanically and electrically inspected and adjusted individually, and then assembled and wired into the equipment case, the correlation between each printed circuit board may not be established, resulting in mechanical defects or electrical failures. There is a risk that a malfunction may occur, and another inconvenience arises in that adjustment is required, resulting in an increase in unnecessary repair and adjustment man-hours. Furthermore, since each printed circuit board is individually inspected and adjusted for each function, many inspection measuring instruments and adjustment jigs are required.
Another drawback was that it was difficult to manufacture jigs and the like.

本発明は以上述べた様な、従来型のプリント基板の欠点
を除去する為に提案されたものであって、その目的は、
一つの機器に使用される各機能の複数枚のプリント基板
を補助基板を介して一体化することによって、重複検査
や重複調整作業が低減される複合プリント基板を提供す
ることにある。
The present invention was proposed to eliminate the drawbacks of conventional printed circuit boards as described above, and its purpose is to:
An object of the present invention is to provide a composite printed circuit board that reduces redundant inspection and redundant adjustment work by integrating a plurality of printed circuit boards for each function used in one device via an auxiliary board.

以下、本発明を第1〜4図に示す実施例により詳細に説
明する。
Hereinafter, the present invention will be explained in detail with reference to embodiments shown in FIGS. 1 to 4.

電子機器における複合プリント基板1のパターン面には
、各機能別の回路−区別されたブロック基板2.3.4
.5.6.7が配設されており、この各ブロック基板2
.3.4.5,6.7相互の闇には補助基板8が形成さ
れている。そして、この補助基板8と各ブロック基板2
.3.4.5゜6.7との境界線上にはミシン目状の小
孔9が連設されており、各ブロック基板2.,3.4,
5゜6.7はこの小孔9に沿って切離される様になって
いる。また、補助基板8には、各ブロック基板2.3.
4.5.6.7の相互間の入力信号、出力信号、電源、
アース等の各ラインを接続するパターン10が設けられ
ている。そして、補助基板8は、前記パターン10が充
分通れる幅となっている。
On the pattern surface of the composite printed circuit board 1 in electronic equipment, there are circuits for each function - differentiated block boards 2.3.4
.. 5.6.7 are arranged, and each block board 2
.. 3.4.5, 6.7 An auxiliary substrate 8 is formed between each other. Then, this auxiliary board 8 and each block board 2
.. 3. On the boundary line between 4.5° and 6.7°, perforation-like small holes 9 are continuously provided, and each block board 2. ,3.4,
5°6.7 is cut along this small hole 9. The auxiliary board 8 also includes each block board 2.3.
4.5.6.7 mutual input signals, output signals, power supply,
A pattern 10 is provided to connect each line such as ground. The auxiliary substrate 8 has a width sufficient for the pattern 10 to pass through.

以上述べた様な構成を有する本発明の複合プリント基板
の使用方法を、次に説明する。
Next, a method of using the composite printed circuit board of the present invention having the above-described configuration will be explained.

まず、複合プリント基板1上に配設された各ブロック基
板2.3,4.5.6.7における部品面の所定の位置
に所定の部品を挿入した後、オートカッタに掛けて部品
のリード線の余分を切除し、更に、この半田mlにデツ
ピングを施こして部品とパターンとを半田付けする。次
に、複合プリント基板1に電気検査治具と測定機器を使
用して、製品と同様の品質のチェック及び調整を行う。
First, after inserting a predetermined component into a predetermined position on the component surface of each block board 2.3, 4.5.6.7 arranged on the composite printed circuit board 1, the lead of the component is cut by an automatic cutter. The excess wire is cut off, and the solder ml is then tapped to solder the parts and the pattern. Next, the composite printed circuit board 1 is checked and adjusted for quality in the same manner as the product using an electrical inspection jig and measuring equipment.

そして、品質チェック及び調整が終了した後、複合プリ
ント基板1をその機能別の各ブロック基板2゜3.4.
5,6.7にミシン目状の小孔9に沿って補助基板8よ
り切離す。この時、各ブロック基板2.3,4.5.6
.7を接続しているパターン10も一緒に切離されるこ
とになる。切離された各ブロック基板2,3.4.5.
6.7を機器の筐体内に組込むと共に、各ブロック基板
ごとを接続する配線を行い、最後に簡単な総合動作11
mを行って製品は完成する。
After the quality check and adjustment are completed, the composite printed circuit board 1 is transferred to each block board 2 according to its function.
5, 6.7, it is separated from the auxiliary substrate 8 along the perforated small holes 9. At this time, each block board 2.3, 4.5.6
.. The pattern 10 connecting 7 will also be separated. Each separated block substrate 2, 3.4.5.
6.7 into the device housing, wire to connect each block board, and finally simple overall operation 11
The product is completed by performing m.

以上述べた様に、本発明の複合プリント基板によれば;
電子機器に組込まれる複数のプリント基板が、一枚の複
合プリント基板上に総合的に接続された状態にある為、
部品挿入、オートカッタやデツピング等の作業が能率的
に行える。即ち各々の基板の組立工数に差異を生ずる様
なことがないので加工能力のバランスがとれる。そして
、複合プリント基板の状態で得られた検査調整の性能は
、各ブロック基板を機器に組込及び配線もその性能が保
証されるので、従来各ブロック基板ごとに行っていた検
査調整が不要となり、従って検査調整の工数が低減され
るという効果がある。それに伴い、検査調整に使用され
る測定機器が少なくてすみ、また調整治具の製作も容易
となる効果もある。
As described above, according to the composite printed circuit board of the present invention;
Because multiple printed circuit boards incorporated into electronic equipment are comprehensively connected on one composite printed circuit board,
Operations such as parts insertion, auto cutter and depping can be performed efficiently. That is, since there is no difference in the number of steps required to assemble each board, the processing capacity can be balanced. In addition, the performance of inspection and adjustment obtained in the state of composite printed circuit boards is guaranteed even when each block board is assembled into equipment and wired, so the inspection and adjustment that was conventionally performed for each block board is no longer necessary. Therefore, there is an effect that the number of man-hours for inspection and adjustment is reduced. Accordingly, the number of measuring instruments used for inspection and adjustment can be reduced, and the adjustment jig can also be manufactured easily.

次に本発明の第2実施例を説明する。Next, a second embodiment of the present invention will be described.

本発明において、切離用のミシン目状の小孔を設けるに
あっては、ブロック基板の周囲に限られたものではなく
、第4図の第2実施例に示される様に複合プリント基板
を細分化していく段階でブロック基板を傷付けることな
く、且つ能率的に切離すのに必要な箇所にも切離用のミ
シン目状の小孔12を設けてもよい。
In the present invention, the perforation-like small holes for separation are not limited to the periphery of the block board, but are also provided on the composite printed board as shown in the second embodiment of FIG. Perforation-like small holes 12 for cutting may be provided at necessary locations to efficiently separate the block substrate without damaging it during the step of dividing the block substrate.

即ち、第4図によりブロック基板を取離す際、まずA−
A−闇を切離した後、閤B−8−を切離し、更にc−c
′問を切離した後、D−D−園を切離すと左半分より二
枚のブロック基板2.3が取れる。その後、E−E−間
を切離すとブロック基板4が取れる。そして、F−F=
間とG−G−闇を切離した後H−H間を切離すと70ツ
ク基板6が取れる。次にI−1”間とJ−J−間とを切
離すとブロック基板5が取れ、最後にに−に=間とC′
−に−間を切離すとブロック基板7が取れることになる
That is, when removing the block board according to FIG.
After separating A-darkness, separate B-8-, and then c-c
After cutting off the board 2 and 2 and then cutting off the board DD, two block boards 2 and 3 can be removed from the left half. Thereafter, the block substrate 4 can be removed by separating the E-E-. And F−F=
After separating the gap and G-G-dark, 70 pieces of substrate 6 can be obtained by separating the gap between H-H. Next, the block board 5 is removed by separating between I-1'' and J-J-, and finally between C'
The block substrate 7 can be removed by separating it between - and -.

以上の様な段取りで切離作業を行えば、切離時に切れ目
を途中で止めたり曲がった切り方をする必要がないので
スムーズに各ブロック基板を切離すことができる。
If the cutting operation is performed according to the above-described setup, each block substrate can be separated smoothly since there is no need to stop the cut midway or make a curved cut during cutting.

因みに、ブロック基板と補助基板との境界に設けられた
ミシン目状の小孔は第4図に示す様に小孔9と長孔11
との組合せたものでもよい。
Incidentally, the perforated small holes provided at the boundary between the block board and the auxiliary board are small holes 9 and long holes 11, as shown in FIG.
It may also be a combination of

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明の複合プリント基板のパターン面より見
た平面図、第2図は本発明の複合プリント基板の切離状
態を示す斜視図、第3図は同じく配線状態を示す斜視図
、第4図は本発明の第2実施例を示す平面図である。 1・・・複合プリント基板、2.3.4,5.6゜7・
・・ブロック基板、8・・・補助基板、9・・・小孔、
10・・・パターン、11・・・長孔、12・・・小孔
FIG. 1 is a plan view of the composite printed circuit board of the present invention as seen from the pattern surface, FIG. 2 is a perspective view showing the composite printed circuit board of the present invention in a separated state, and FIG. 3 is a perspective view similarly showing the wiring state. FIG. 4 is a plan view showing a second embodiment of the present invention. 1... Composite printed circuit board, 2.3.4, 5.6°7.
...Block board, 8...Auxiliary board, 9...Small hole,
10... Pattern, 11... Long hole, 12... Small hole.

Claims (3)

【特許請求の範囲】[Claims] (1)複数枚のプリント基板より構成される電子機器に
おいて、各機能別のブロック基板が基板上に区画され、
こ・の各ブロック基板の間には補助基板が設けられ、こ
の補助基板上には各ブロック基板間が電気的に接続され
る導体が設けられており、この各ブロック基板と補助基
板との境界には各ブロック基板の切離補助用の小孔が一
列に連らなって設けられたことを特徴とする複合プリン
ト基板。
(1) In electronic equipment composed of multiple printed circuit boards, block boards for each function are divided on the board,
An auxiliary board is provided between each block board, and a conductor is provided on this auxiliary board to electrically connect each block board, and a boundary between each block board and the auxiliary board is provided. A composite printed circuit board characterized in that small holes are arranged in a row to assist in separating each block board.
(2)切離補助用の小孔を補助基板内にも連設した特許
請求の範囲第1項記載の複合プリント基板。
(2) The composite printed circuit board according to claim 1, wherein small holes for assisting separation are also provided in the auxiliary board.
(3)切離補助用の小孔と交互に長孔を連設した特許請
求の範囲第1項又は第2項記載の複合プリント基板。
(3) The composite printed circuit board according to claim 1 or 2, wherein long holes are arranged alternately with small holes for assisting separation.
JP13021281A 1981-08-21 1981-08-21 Composite printed board Pending JPS5832484A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13021281A JPS5832484A (en) 1981-08-21 1981-08-21 Composite printed board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13021281A JPS5832484A (en) 1981-08-21 1981-08-21 Composite printed board

Publications (1)

Publication Number Publication Date
JPS5832484A true JPS5832484A (en) 1983-02-25

Family

ID=15028766

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13021281A Pending JPS5832484A (en) 1981-08-21 1981-08-21 Composite printed board

Country Status (1)

Country Link
JP (1) JPS5832484A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6016572U (en) * 1983-07-11 1985-02-04 日立電子株式会社 assembly printed wiring board
JPH02146467U (en) * 1989-05-15 1990-12-12
JP2014096533A (en) * 2012-11-12 2014-05-22 Denso Corp Method of manufacturing component built-in substrate

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5618487A (en) * 1979-07-24 1981-02-21 Hitachi Electronics Method of regulating split substrate

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5618487A (en) * 1979-07-24 1981-02-21 Hitachi Electronics Method of regulating split substrate

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6016572U (en) * 1983-07-11 1985-02-04 日立電子株式会社 assembly printed wiring board
JPH02146467U (en) * 1989-05-15 1990-12-12
JP2014096533A (en) * 2012-11-12 2014-05-22 Denso Corp Method of manufacturing component built-in substrate

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