JPS5831514A - 半導体部品のテ−プ片張付け装置 - Google Patents

半導体部品のテ−プ片張付け装置

Info

Publication number
JPS5831514A
JPS5831514A JP56129701A JP12970181A JPS5831514A JP S5831514 A JPS5831514 A JP S5831514A JP 56129701 A JP56129701 A JP 56129701A JP 12970181 A JP12970181 A JP 12970181A JP S5831514 A JPS5831514 A JP S5831514A
Authority
JP
Japan
Prior art keywords
tape
housing
collet
axis direction
connecting rod
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56129701A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6249744B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Inventor
Toshio Ono
大野　利雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP56129701A priority Critical patent/JPS5831514A/ja
Publication of JPS5831514A publication Critical patent/JPS5831514A/ja
Publication of JPS6249744B2 publication Critical patent/JPS6249744B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP56129701A 1981-08-18 1981-08-18 半導体部品のテ−プ片張付け装置 Granted JPS5831514A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56129701A JPS5831514A (ja) 1981-08-18 1981-08-18 半導体部品のテ−プ片張付け装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56129701A JPS5831514A (ja) 1981-08-18 1981-08-18 半導体部品のテ−プ片張付け装置

Publications (2)

Publication Number Publication Date
JPS5831514A true JPS5831514A (ja) 1983-02-24
JPS6249744B2 JPS6249744B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1987-10-21

Family

ID=15016055

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56129701A Granted JPS5831514A (ja) 1981-08-18 1981-08-18 半導体部品のテ−プ片張付け装置

Country Status (1)

Country Link
JP (1) JPS5831514A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6267243U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1985-10-17 1987-04-27
US6012502A (en) * 1995-07-31 2000-01-11 Micron Technology, Inc. Apparatus for attaching adhesive tape to lead-on-chip leadframes
US6281044B1 (en) 1995-07-31 2001-08-28 Micron Technology, Inc. Method and system for fabricating semiconductor components
US6607019B2 (en) 1997-08-07 2003-08-19 Micron Technology, Inc. Method and apparatus for application of adhesive tape to semiconductor devices

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6267243U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1985-10-17 1987-04-27
US6012502A (en) * 1995-07-31 2000-01-11 Micron Technology, Inc. Apparatus for attaching adhesive tape to lead-on-chip leadframes
US6025212A (en) * 1995-07-31 2000-02-15 Micron Technology, Inc. Method for attaching semiconductor dice to lead-on-chip leadframes
US6281044B1 (en) 1995-07-31 2001-08-28 Micron Technology, Inc. Method and system for fabricating semiconductor components
US6626222B1 (en) 1995-07-31 2003-09-30 Micron Technology, Inc. System for fabricating semiconductor components
US6607019B2 (en) 1997-08-07 2003-08-19 Micron Technology, Inc. Method and apparatus for application of adhesive tape to semiconductor devices
US6623592B1 (en) * 1997-08-07 2003-09-23 Micron Technology, Inc. Methods for application of adhesive tape to semiconductor devices
US6883574B2 (en) 1997-08-07 2005-04-26 Micron Technology, Inc. Apparatus for application of adhesive tape to semiconductor devices
US7087133B2 (en) 1997-08-07 2006-08-08 Micron Technology, Inc. Methods for application of adhesive tape to semiconductor devices

Also Published As

Publication number Publication date
JPS6249744B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1987-10-21

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