JPS58313Y2 - Solder removal device - Google Patents

Description

[Detailed Description of the Invention] The present invention relates to a solder removal device suitable for use in parts replacement of printed wiring boards, repair soldering work, etc.

When replacing electrical components soldered to a printed wiring board or repairing soldered parts, the work is carried out by melting the solder at the location to be removed with a soldering iron, but it is common to leave the melted solder alone. If left unattended, it may fuse to other parts and cause wiring defects.

Conventionally, therefore, a solder remover (solder cleaner) having a melting function and a suction function is used to melt and suck up the solder on the spot.

However, conventionally used solder removers have the following drawbacks.

There was a problem that it could not be used easily and efficiently.

That is, in a conventional solder sucker, a rubber dropper is attached to a soldering iron, and by pressing the dropper, melted solder is sucked into the soldering iron from the tip of the iron, or expelled (discharged). There are two types of dropper-type vacuum cleaners and high-pressure air vacuum cleaners that use the suction power of a compressor to suck up melted solder. The former dropper-type vacuum cleaner sucks and eliminates solder. It is very cumbersome to operate as you have to use your fingertips to operate the dropper every time.
The suction and discharge power of the dropper is weak, so you may not be able to suck up enough solder, or the solder may not be completely discharged and the solder may remain inside the iron, so do not clean the inside of the iron frequently. It was such a hassle that it shouldn't have happened.

The latter type of high-pressure air suction device has a strong suction force and can suction out solder well, but it cannot work without a high-pressure air intake, so if there is no such intake at the work place.
c) If a heavy compressor has to be moved to each work site, work efficiency will be reduced, and if high-pressure air intakes are installed at each work site, the equipment will become larger and more expensive. There is a problem that the amount becomes very high.

Furthermore, when using a high-pressure air absorber, the suction force can be adjusted appropriately using the ejector when suctioning the solder, but when discharging the solder, the pressure of the compressor is applied directly to the solder and the solder is discharged with extremely strong force, which poses a danger in handling. There was a problem with the high cost.

In view of the above-mentioned problems, the present invention uses a small and lightweight vacuum pump as the air source, making it possible to easily carry and use the entire device anywhere as long as there is a power supply, and to use a vacuum pump. The extremely good suction power of the pump makes it possible to suction the solder without any trouble, and the soldering iron holder is equipped with a switch mechanism that reverses the vacuum pump, so that when the soldering iron is applied, the pump reverses and sucks the solder. The purpose is to provide a solder suction device devised to automatically and safely discharge solder, and the structure of the present invention will be explained in detail below with reference to embodiments in the attached drawings. .

As shown in FIG. 1, the solder suction and removal device of the present invention is constructed entirely of a soldering iron A and a pump device B.1. As shown in FIGS. 1 and 2, the soldering iron A includes a soldering iron body 1 having a nozzle 2 serving as a tip of the soldering iron attached to its tip, and a gripping body 3 to which the soldering iron body 1 is attached. An electric cord 4 of a heater for heating the iron body 1 is led out from the rear end side, and a passage hole 5 communicating with the nozzle 2 is provided inside the iron body 1 as shown by the imaginary line in FIG.
The solder melted by the nozzle 2 is sucked from the nozzle 2 into the hole 5, and vice versa.
The structure is such that the liquid is ejected more toward the nozzle 2 side.

In addition, the nozzle 2 is attached to the tip of the iron body 1 by screwing, and if the thickness of the lead wire of the electrical component to be worked on is different, or if the nozzle opening is worn out, the nozzle 2 can be replaced as appropriate. can do.

Furthermore, the mouth of a solder reservoir 6 having a cylindrical structure with an interior C communicating with the passage hole 5 is connected to the upper end of the soldering iron body 1, and the solder reservoir 6 is fixed to the gripping body 3 by a clip γ.

6a... is a large number of heat radiation fins formed on the circumferential surface of the solder pool 6, 6b is a nipple protruding from the solder pool 6,
An air hose 8 is connected to this nipple 6b.

Reference numeral 9 denotes a nut hinged to the rear end of the solder pool 6, and this nut 9 is removed when cleaning the inside of the solder pool 6.

Next, the pump device B includes a pump case 10 shown in FIGS.
A vacuum pump 11 is housed in the vacuum pump 11, which performs a suction action when the pump is rotating in the forward direction, and performs an exhaust (discharge) action when the pump is rotating in the reverse direction.
In addition, filters 13 that also serve as silencers are installed on the discharge side, and a power cord 1 is installed inside the pump case 10.
4 and the motor M, etc., and an automatic switching mechanism for the motor M, generally indicated by the reference numeral 16, are housed.

1γ is a nipple that protrudes from the filter chamber 12 to the outside of the pump case 10, and the tip of the air hose 8 mentioned above is connected to this nipple 1T.

Further, as shown in FIG. 1, the side surface of the pump case 10 is provided with a power lamp 18, an outlet 19 into which a plug 4a attached to the tip of the electric cord 4 can be freely inserted, and a power switch 20. When turned on, the lamp 18 lights up and the soldering iron A is heated.

The automatic switch changeover mechanism 16 described above includes a microswitch 21 and a relay R, as shown in FIGS. 3 and 4.

This switch 21 is built into the operating circuit of the motor M, and can freely switch the rotation of the motor M, and is fixed to a mounting plate 22 provided inside the pump case 10. .

Further, a switching plate 23 is rotatably attached to this plate 22 about a shaft 24, which presses the actuator 21a of the switch 21 to switch the switch.

Reference numeral 25 designates a mounting piece formed on the upper side of the switching plate 23, into which the tip 2γa of the iron holder 2γ is inserted and fixed into two mounting holes 25a and 25b formed in the mounting piece 25.

The trowel holder 2γ, which has a heat dissipating structure with a spiral strip, is disposed outside the pump case 10, and its tip 27
a is inserted through a movable hole 26 drilled in the side surface of the case 10 and fixed to the mounting piece 25, so that the switching plate 23 can be rotated from the outside.

Furthermore, the soldering iron holder A can be inserted into the inside of the soldering iron holder 2γ as shown by the imaginary line in FIG. 23 rotates to switch the microswitch 21.

In other words, in the state shown in FIGS. 3 and 4, the motor M rotates and the vacuum pump 11 is operated to suck the solder 9, which is melted by the nozzle 2, and the solder 9 is removed from the passage hole 5 of the iron body 1 and the solder pool 6 through the nozzle 2.
This figure shows a state in which an inward suction effect is exerted on the soldering iron A side through the air hose 8. However, if soldering iron A is inserted into the iron holder 2γ as shown by the imaginary line in Fig. 4, then , the switching plate 23 rotates counterclockwise in the figure with the shaft 24 as a fulcrum, presses the actuator 21a, and switches the microswitch 21.

When the micro switch 21 is switched, as shown in FIGS. 3 and 5, the I/-R operates to reverse the motor M, causing the vacuum pump 11 to discharge and operate, and to supply the soldering iron through the air hose 8. Discharged air is supplied to the A side, specifically to the solder reservoir 96 side.

When the discharge air is supplied, the solder accumulated in the inside C of the solder reservoir 6 and the passage hole 5 of the iron body 1 is discharged to the outside from the nozzle 2.
Complete internal cleaning.

The above-mentioned supply of discharged air to the soldering iron A continues until the soldering iron A is removed from the iron holder 2T, and when the soldering iron A is removed, the actuator 21a pushes the switching plate 23 to the original position by its own elasticity. Then, the motor M can be rotated by returning the microswitch 21 to its original state.

The above-mentioned vacuum pump 11 is of such a suction power that the suctioned solder remains in the inside 6' of the fine solder pool 6.

Further, in the figure, 28 is a substantially plate-shaped solder receiver attached to the bottom of the iron holder 2γ to receive the solder discharged from the nozzle 2, and 29a and 29b indicate stoppers of the switching plate 23.

Since the present invention has the structure as described above, during normal operation with the rotation of the motor M, the vacuum pump 11 is connected to the soldering iron A.
In order to exert a suction force on the side, the melted solder is sucked from the nozzle 2 into the passage hole 5 of the iron body 1 and the inside 6' of the solder pool 6.
You can cleanly finish parts replacement and repair soldering work on printed wiring boards, and the solder sucked into the soldering iron can be soldered into the micro switch 21 by inserting the soldering iron A into the iron holder 2γ protruding from the side of the pump case 10. operates to reverse the motor M and switch the vacuum pump 11 to discharge operation, so that the discharged air discharges the solder from the nozzle 2 to the solder receiver 28 mentioned above, and the solder is removed from the passage hole 5 of the iron body 1 and the solder pool. 6
The interior 6' of the machine can be cleaned automatically.

Therefore, in the present invention, when the power is turned on, the soldering iron is heated, and the electric motor and vacuum pump are activated, the nozzle at the tip of the iron melts the solder attached to the electrical component and pours the solder into the passage hole and the solder pool. The solder can be sucked into the interior, and the solder that has been sucked into the soldering iron is automatically discharged evenly from the nozzle by simply inserting the soldering iron into the soldering iron, making it extremely easy and safe to use the soldering iron. The number of internal cleanings can be reduced as much as possible, and along with the functional advantages that it can be easily carried and used anywhere as long as there is a power supply for the pump device, the print It is suitable for replacing parts of wiring boards and performing various solder repair work.

[Brief explanation of the drawing]

The drawings show an embodiment of the present invention, in which Fig. 1 is a perspective view of the entire device, Fig. 2 is a side view of the soldering iron, Fig. 3 is a plan view showing the internal structure of the pump device, and Fig. 4 is a perspective view of the entire device. FIG. 5, a partially sectional top view of the switch mechanism, shows a simple electrical circuit diagram. 1... Iron body, 2... Nozzle, 5... Passage hole, 6...
...Solder puddle, 8...Air hose, M...Motor, 1
1... Vacuum pump, 16... Automatic switch switching mechanism, 21... Micro switch, 2γ... Trowel holder, A
... Soldering iron, B... Pump device.

Claims (1)

[Scope of utility model registration request] A passage hole for the molten solder is bored in the inside of the iron body, which has a nozzle attached to the tip for suctioning and discharging the melted solder, and the iron body has a cylindrical structure that communicates with the passage hole. A soldering iron is attached with a solder pool, and an air hose is connected to the large solder pool 9, and air suction or discharge can be applied to the solder pool side through the air hose by regular rotation of the motor. The pump device is equipped with a vacuum pump mechanism that can freely rotate in reverse, and an automatic switch changeover mechanism that allows the motor to rotate in the opposite direction when the soldering iron is applied to the soldering iron holder and switches the vacuum pump mechanism to discharge operation. A solder suction/removal device characterized in that it is configured as follows.