JPS5830253U - IC with temperature fuse - Google Patents

IC with temperature fuse

Info

Publication number
JPS5830253U
JPS5830253U JP12487881U JP12487881U JPS5830253U JP S5830253 U JPS5830253 U JP S5830253U JP 12487881 U JP12487881 U JP 12487881U JP 12487881 U JP12487881 U JP 12487881U JP S5830253 U JPS5830253 U JP S5830253U
Authority
JP
Japan
Prior art keywords
temperature fuse
recorded
embedded
fuse
temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12487881U
Other languages
Japanese (ja)
Inventor
徳山 義夫
Original Assignee
日本ビクター株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本ビクター株式会社 filed Critical 日本ビクター株式会社
Priority to JP12487881U priority Critical patent/JPS5830253U/en
Publication of JPS5830253U publication Critical patent/JPS5830253U/en
Pending legal-status Critical Current

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Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図はこの考案による温度ヒユーズ付ICの一実施例
を示す斜視図、第2図はこの考案の他の実施例を示す温
度ヒユーズ埋め込み前の斜視図である。 1・・・・・・IC12・・・・・・樹脂成形部、3・
・・・・・温度ヒユーズ、4・・・・・・温度ヒユーズ
の両端子、5・・・・・・凹陥部。
FIG. 1 is a perspective view showing one embodiment of an IC with a temperature fuse according to this invention, and FIG. 2 is a perspective view showing another embodiment of this invention before the temperature fuse is embedded. 1...IC12...Resin molding part, 3.
... Temperature fuse, 4 ... Both terminals of temperature fuse, 5 ... Recessed part.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ICの樹脂成形部に温度ヒユーズを埋め込んで一体的に
構成したことを特徴とする温度ヒユーズ付IC0
IC0 with a temperature fuse, characterized in that the temperature fuse is embedded in the resin molded part of the IC and configured integrally.
JP12487881U 1981-08-24 1981-08-24 IC with temperature fuse Pending JPS5830253U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12487881U JPS5830253U (en) 1981-08-24 1981-08-24 IC with temperature fuse

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12487881U JPS5830253U (en) 1981-08-24 1981-08-24 IC with temperature fuse

Publications (1)

Publication Number Publication Date
JPS5830253U true JPS5830253U (en) 1983-02-26

Family

ID=29918728

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12487881U Pending JPS5830253U (en) 1981-08-24 1981-08-24 IC with temperature fuse

Country Status (1)

Country Link
JP (1) JPS5830253U (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4923553U (en) * 1972-06-06 1974-02-28

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4923553U (en) * 1972-06-06 1974-02-28

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