JPS5830175A - Device for mounting superconducting element - Google Patents

Abstract

PURPOSE:To omit a supporting structure and to make the mounting device simple and light weight, by applying various minor machinings to a guide pin which serves as a guide when micropins are inserted in microsockets, thereby imparting a function as a fixing tool to the guide pin. CONSTITUTION:Josephson chips 4 are mounted on a wired silicon card 3. Said card 3 is supported by a silicon foot 2. The micropins 201 are inserted into the corresponding microsocket 101 of a microsocket board in the vicinity of the upper and lower ends of the silicon foot 2. At this time, the guide pin 6, which serves as the guide, is provided. A groove 601 is provided at the tip part of the guide pin 6. The tip of the guide pin 6 is inserted in a plate spring 8 for the guide pin which is provided on the microsocket board. In this way, the function as the simple fixing tool is imparted to the guide pin 6 without providing the special supporting structure, and the device for mounting the superconducting element is made simple and light weight.

Description

[Detailed Description of the Invention] The present invention relates to a device for suspending a superconducting element lj, which is constructed by mounting a plurality of Josephson chips and fixing a card with nine wires to a micro socket board through seven pins with a large number of micro pins. It is.

Fig. 1 is a perspective view of the appearance of a conventional OζO type device. Silicon board with four sockets formed (microphone four socket mate), 101 is microphone socket, 2
1 is a silicone foot with four bins, 201 is a micro pin, 6 is a silicon card with Jose7 non-chip (card with wiring), 4 is a Josephson chip, 5 is a silicone card shelf, 501 is a guide groove for card insertion . The silicone card shelf 5 is positioned such that when the silicone card 3 and the silicone foot 2 with micro pins are inserted therein along the card insertion guide groove 501, all the microphone pins 201 are correctly accommodated in the four microphone sockets 101. In this regard, it is believed that the micro turbine 201 will not fall off from the micro socket 101 even with this structure because the silicon board IK is fixed with adhesive and is held by the inserted silicon card shelf 5. There is.

However, in the above configuration, since the Josephson chip is formed on a silicon substrate, in order to avoid distortion and destruction of the structure due to the difference in thermal expansion coefficient when immersed in liquid helium, it is necessary to Card Chef 5 also had to be made from a silicone plate, making it very difficult to make. In addition, since the guide groove 501 serves as a guide when inserting the card and also serves to hold the card after insertion, the width of the groove needs to be close to the thickness of the card 50.
It was difficult to form the groove, and it was also extremely difficult to accurately set the positional relationship between the guide groove 501 and the microsocket when O was fixed to the silicon board 1. Furthermore,
In the future, even higher-density packaging is expected, but the conventional configuration described above requires a large number of shelves in one module, and the weight of the module increases by the number of shelves. .

The present invention improves the conventional drawbacks such as ζO,
The aim is to make it possible to attach a silicon card to a microsocket board in the simplest and lightest possible construction. Examples will be described in detail below.

FIG. 2 is a structural diagram of an apparatus according to an embodiment of the present invention. The same reference numerals as in FIG. 1 indicate the same parts, 6 is a guide bin, 601
7 is a groove, 7 is a guide bin socket, and 8 is a specially shaped O plate spring for fixing the guide bin.

In the same figure, the tip of the guide tube y6 is chamfered into a hemispherical or conical shape, and the parallel part is chamfered into a hemispherical or conical shape.
It has a length and enough thickness to penetrate the silicon board 1 when the holder 201 is completely inserted into the Mitaro socket 101. At least one guide bin 6 is fixed to each of the upper and lower ends O of the silicone 70 with adhesive or the like.

When inserting a microbin into the silicon board IC)ff Iku4 socket 101, the guide bin 6 is first inserted into the guide bin socket 7 provided on the silicon board 1, and the upper and lower guide bins are inserted together so that the board surface and the 7
The tip of the microbottle 2010 is inserted into the microsocket 101 with the top surfaces parallel. Therefore, Microbin 201! It can be easily inserted into the Iku4 socket 101. and,! After inserting the micropin, it protrudes from the board and the groove 601 at the tip of the guide bin 6
The larger hole 801 of the leaf spring 80 is inserted into the hole 801 of the leaf spring 8, and then the groove 601 is inserted into the small hole 802 of the leaf spring 8 to complete the fixing. As a result, the silicon board 5 is securely held and attached to the silicon board 1 via the foot 2° guide y6.

Fig. S is a structural diagram showing an embodiment of collection O according to O of the present invention.
9 is Thebabin. In this embodiment, a thin tapered hole 602 is provided at the tip of the guide bin 6 protruding from the board 1, and the tapered hole 602 is perpendicular to the axis of the guide bin, and a tapered hole 602 is inserted into this hole 602 to fix both.

FIG. 4 is a structural diagram showing still another embodiment of the present invention, in which the same reference numerals as in FIG. 1
1 is a small screw. In this embodiment, a coaxial thin female screw part 603 is provided at the tip of the guide pin 6, a screw 10 is fitted onto the outer periphery of the guide pin 6, and the coil spring 10 is pressed onto the guide pin using a small screw screwed into the tip of the guide pin. 6 and the silicon board 1 are fixed.

Figure 5 shows O1 in addition to the present invention! A structural diagram showing the example,
12 is a silicone rubber ring, and the same reference numerals as in FIG. 2 indicate the same parts. The ζO embodiment has guide bins 40&-
Insert the silicone rubber cylinder 12 into the protruding part of the cylinder 1, which is slightly smaller in inner diameter than the guide bottle diameter.
By pressing this against board 1, guide bin 6
and board 1 are fixed together.

As can be seen from the above explanation, the superconducting device mounting apparatus of the present invention can accommodate a large number of microbins provided in seven silicon tubes! ■It also has the function of a fixing device by applying various small processing to the guide that serves as a guide when inserting it into the socket, so there is no need to create a new holding structure such as a shelf. It has the advantage of being easy, lightweight, and safe to assemble.

Note that the method of fixing the guide bin according to the present invention is not limited to the above-described embodiments, and any method other than a plate, taper bin, silicone rubber cylinder, etc. that can fix the guide bin to a silicon board can be used. It can be towed even if it is fixed with the holder.

[Brief explanation of the drawing]

FIG. 1 is an external perspective view of a conventional superconducting element mounting apparatus, and FIGS. 2 to 5 are structural diagrams of different embodiments of the present invention. 1 is a silicon board, 2 is a silicon foot, 3 is a silicon card, 4 is a disodium Sefson chip, 5 is a card shelf, 6 is a guide bin, 7 is a socket for the guide bin, 8
is a leaf spring! is tapered. 10 is a coil spring, 11 is a small screw, 12 is a silicone rubber ring, 101 is a micro socket, 201 is a micro pin, 501 is a β-id groove, 601 is a groove, 602 is a tapered hole, and 605 is a female screw portion. Patent Applicant Nippon Telegraph and Telephone Public Corporation q persons 1 person Tamamukyu 5 persons 3 persons outside the department Figure 1 Figure 2

Claims (1)

[Claims] Said guide bin! A device for mounting a superconducting element, characterized in that it is inserted into a guide bin socket provided on an IkuP socket board, and the tip of the bin protruding from the microphone socket mate is fixed to a holder.