JPS5828724B2 - How to adjust the resistance value of thin film resistor elements - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for adjusting the resistance value of a thin film resistive element.

FIGS. 1 and 2 are explanatory diagrams of a conventionally known resistance value adjustment method.

The method shown in FIG. 1 adjusts the resistance value between the electrodes 21 and 22 by changing the area of the thin film resistor 10.

For example, a portion p of the resistor 1 is removed using a laser trimmer, a trimmer using ultrasonic vibration, a sand-plast trimmer, or the like to change the area.

This method is difficult to control the amount removed, and
There are drawbacks such as difficulty in stably maintaining the surface of the resistor after it has been scraped off.

The method shown in FIG. 2 uses a plurality of adjusting resistors R, , R2°R3, which are connected in series apart from the resistor Rx, and short-circuit parts Sl, S2 + S3 that short-circuit these resistors. If the resistance value between the electrodes 21 and 22 is lower than a predetermined value, the resistor R1゜R2+R3 is set in advance.
In order to add in series with ゛, short circuit parts S1゜S2 . Adjustment is made by cutting S3.

This method has the drawback of requiring a large number of resistors R1+R2 to Rn to be provided in advance in order to precisely adjust the amount of adjustment, and requiring a large substrate area.

The present invention aims to provide a new resistance value adjustment method that eliminates the drawbacks of such conventional methods.

3 to 5 are explanatory diagrams of the resistance value adjustment method according to the present invention, where FIG. 3 is a plan view of the configuration of a thin film resistor element before resistance value adjustment, and FIG. 4A is a cross-sectional view taken along line AA in FIG. 3. , FIG. 4B is a sectional view taken along line B-B in FIG. 3, FIG. 5 is a configuration diagram of the thin film resistive element after resistance value adjustment, A is a plan view, and B is a sectional view taken along line B-B in FIG. .

The thin film resistor element according to the present invention includes a thin film resistor 1 on the surface of a substrate 30, which has a plurality of bent portions 41, 42, .・
...It is formed in a zigzag shape with 4n.

As the material of this resistor 1, for example, Ni-Cr or the like is used.

Next, each bent portion 41, 42 of this resistor 1.・・・・・・
・・・A good conductive material (e.g. Au
'y) Thin films 51, 52.・・・・・・・・・5n is boxwood.

In this manner, the thin film resistance element has a resistor having a zigzag shape with a plurality of bent portions, and the plurality of bent portions are covered with a highly conductive material.

In the thin film resistive element constructed in this way, in this state, the resistance value between the electrodes 21 and 22 is determined by the resistance value between the electrodes 21 and 22 at each bent portion of the thin film 51, 52, . Since the resistor on the lower side is short-circuited by 5n, the value obtained by multiplying the resistance value of the straight part by the number of straight parts (6 in this case) (each straight line) (if the resistance values of the parts are equal).

Now, if the resistance value between the electrodes 2L22 is smaller than a predetermined value, the bent portions 4L42.・・・・・・・・・4
A thin film of conductive material covering n, for example 51.53, is dissolved by chemical etching as shown in FIG.

As a result, the short circuit caused by the highly conductive thin film of the resistor in the bent portions 41 and 420 is removed, and by inserting the resistance value of this portion, the resistance value can be increased and the resistance value can be adjusted.

Note that a stabilizer may be applied to the bent portion dissolved by chemical etching to stabilize the bent portion thereafter.

Here, for example, if the shape and length of each bent part are set so that the total resistance value increases by 1% when the thin film of good conductive material covering one bent part is melted, the good conductive material By changing the number of bends that melt the thin film, the resistance value can be easily adjusted with an accuracy of 1%.

By changing the width and length of the bent portion of the resistor, the resistance value can be adjusted more accurately.

Note that the highly conductive thin film may be removed by a method other than chemical etching.

In addition to forming the resistor 1 on the substrate, for example, if the substrate is made of metal, the resistor 1 may be formed with an insulating film interposed therebetween.

As explained above, the resistance value adjustment method of the present invention adjusts the resistance value by removing the highly conductive thin film covering the resistor at the bent portion, and the resistance value adjustment method of the present invention adjusts the resistance value by using the bent portion of the resistor. Since it is a type of resistor, there is no need to increase the substrate area, and since it does not deform the resistor itself, it has the advantage that the resistance value can be maintained stably even after the resistance value is adjusted.

[Brief explanation of the drawing]

1 and 2 are explanatory diagrams of a conventionally known resistance value adjustment method, FIGS. 3 to 5 are explanatory diagrams of a resistance value adjustment method according to the present invention, and FIG. 3 is a thin film before resistance value adjustment. Configuration diagram of resistance element,
4A is a sectional view taken along line AA in FIG. 3, FIG. 4B is a sectional view taken along line BB in FIG. 3, and FIG. Figures and B are sectional views taken along line 13-B in Figure A. 1... Thin film resistor, 2L22... Electrode, 3... Substrate, 41, 42.・・・・・・・・・
・4n...Bent part, 51.52.・・・・・・
...5n... Thin film of well-conductive material.

Claims (1)

[Scope of Claims] 1. A thin film resistor is formed on a substrate in a zigzag shape having a plurality of bent portions, and the plurality of bent portions are covered with a thin film of a conductive material. A method for adjusting the resistance value of a thin film resistance element, in which the resistance value is adjusted by removing a thin film of conductive material. 2. A method for adjusting the resistance value of a thin film resistance element according to claim 1, wherein the conductive material thin film is removed by chemical etching.