JPH04133301A - Resistor - Google Patents
ResistorInfo
- Publication number
- JPH04133301A JPH04133301A JP2254536A JP25453690A JPH04133301A JP H04133301 A JPH04133301 A JP H04133301A JP 2254536 A JP2254536 A JP 2254536A JP 25453690 A JP25453690 A JP 25453690A JP H04133301 A JPH04133301 A JP H04133301A
- Authority
- JP
- Japan
- Prior art keywords
- resistance value
- resistor
- resistive film
- width
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims abstract description 21
- 239000000758 substrate Substances 0.000 claims abstract description 10
- 238000009966 trimming Methods 0.000 abstract description 11
- 238000005488 sandblasting Methods 0.000 abstract description 4
- 230000000052 comparative effect Effects 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Landscapes
- Non-Adjustable Resistors (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の目的〕
（産業上の利用分野）
本発明は、絶縁基板上に印刷あるいは蒸着等によって抵
抗膜を形成した抵抗体に関する。DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to a resistor in which a resistive film is formed on an insulating substrate by printing, vapor deposition, or the like.
（従来の技術）
近年、電子機器の小型軽量化に伴って、ハイブリットＩ
Ｃが多用されてきており、このハイブリットＩＣの一般
的なものとしては抵抗体がある。(Prior art) In recent years, as electronic devices have become smaller and lighter, hybrid I
C has been widely used, and a resistor is a common example of this hybrid IC.
この抵抗体は、例えば第３図に示すように、絶縁基板１
上に２つの導体２を対向形成し、この導体２上にまたが
るように矩形状に抵抗膜３を形成している。この抵抗膜
３は、抵抗値が予め所望の抵抗値以下になるように長さ
しと幅Ｗとを設定しておき、抵抗膜３をレーザー光線ま
たはサンドブラスト等によってトリミングして切削溝４
を形成することにより、一対の電極２間の抵抗膜３の幅
Ｗを減少させて抵抗値を上昇させ、所望の抵抗値を得る
ようにしている。For example, as shown in FIG.
Two conductors 2 are formed facing each other on the top, and a resistive film 3 is formed in a rectangular shape so as to straddle the conductors 2 . The length and width W of this resistive film 3 are set in advance so that the resistance value is equal to or less than a desired resistance value, and the resistive film 3 is trimmed with a laser beam or sandblasting, etc. to form cutting grooves.
By forming this, the width W of the resistive film 3 between the pair of electrodes 2 is decreased, the resistance value is increased, and a desired resistance value is obtained.
そして、この抵抗体の抵抗膜３の長さしを１．７ｍＩＩ
、幅Ｗを２，５１１とした場合、切削量Ｘと抵抗値Ｒと
の関係を第２図に比較例１として破線で示す。同図によ
れば、特性の直線性が悪く、単位切削量に対する抵抗値
変動量が小さく、所望の抵抗値を得ることが困難であっ
た。The length of the resistive film 3 of this resistor is 1.7 mII.
, when the width W is 2,511, the relationship between the cutting amount X and the resistance value R is shown in FIG. 2 by a broken line as Comparative Example 1. According to the figure, the linearity of the characteristics was poor, the amount of resistance value variation with respect to the unit cutting amount was small, and it was difficult to obtain the desired resistance value.
また、特開昭６：３−１２１０５号公報に記載された抵
抗体がある。この抵抗体は、第４図に示すように、絶縁
基板１上に矩形状の抵抗膜３を形成し、この抵抗膜３の
一端上に一対の電極２を近接して対向形成しており、こ
の抵抗膜３の他端側には電極２から突出する突出部３！
を有している。There is also a resistor described in Japanese Patent Application Laid-Open No. 6:3-12105. As shown in FIG. 4, this resistor has a rectangular resistance film 3 formed on an insulating substrate 1, and a pair of electrodes 2 formed close to each other and facing each other on one end of this resistance film 3. A protrusion 3 protrudes from the electrode 2 on the other end side of the resistive film 3!
have.
そして、抵抗膜３は、抵抗値が予め所望の抵抗値以下に
なるように長さしと幅Ｗとを設定しておき、抵抗膜３を
レーザー光線またはサンドブラスト等によって一端側か
ら他端側の突出部３２に向けてトリミングして切削溝４
を形成することにより、その切削溝４によって一対の電
極２間の距離りを長くとって抵抗値を上昇させ、所望の
抵抗値を得るようにしている。The length and width W of the resistive film 3 are set in advance so that the resistance value is equal to or less than a desired resistance value, and the resistive film 3 is made to protrude from one end side to the other end by laser beam or sandblasting. Cut groove 4 by trimming toward section 32.
By forming the cut grooves 4, the distance between the pair of electrodes 2 is increased and the resistance value is increased to obtain a desired resistance value.
そして、この抵抗体の抵抗膜３の長さしを２．５■、幅
Ｗを１．７１とした場合、切削量Ｘと抵抗値Ｒとの関係
を第２図に比較例２として１点鎖線で示す。同図によれ
ば、比較例１に比べて特性の直線性が大幅に改善されて
いるため、速いトリミングスピードでも所望の抵抗値を
正確に得ることができ、また、低抵抗値領域での抵抗値
変動率も大きく、比較的低い抵抗値も迅速に得ることが
できる。When the length of the resistive film 3 of this resistor is 2.5 mm and the width W is 1.71, the relationship between the cutting amount X and the resistance value R is shown in Fig. 2 as Comparative Example 2. Indicated by a chain line. According to the figure, the linearity of the characteristics has been significantly improved compared to Comparative Example 1, so the desired resistance value can be accurately obtained even at high trimming speeds, and the resistance in the low resistance value region The value fluctuation rate is also large, and relatively low resistance values can be obtained quickly.
（発明が解決しようとする課題）
しかし、第４図の抵抗体では、例えばシート抵抗値がＩ
ＯＫΩの場合に抵抗値の変化幅が３ ＫΩ〜２０にΩ程
度までと狭い範囲に限られ、抵抗膜３の長さしを一定と
して、より広範囲の抵抗値を得ることは困難であった。(Problem to be Solved by the Invention) However, in the resistor shown in FIG. 4, for example, the sheet resistance value is I
In the case of OKΩ, the range of change in resistance value is limited to a narrow range of about 3 KΩ to 20Ω, and it is difficult to obtain a wider range of resistance values by keeping the length of the resistive film 3 constant.
特に、ファンクショントリミングでは抵抗値の変化幅の
大きなものを必要とするが、抵抗体の長さしを変えずに
は変化幅を大きくすることは困難であった。In particular, function trimming requires a large variation range in resistance value, but it has been difficult to increase the variation range without changing the length of the resistor.
また、切削溝４の単位切削量に対する抵抗値変化率が小
さく、トリミングによって所望の抵抗値を迅速に得るこ
とが困難であった。Further, the rate of change in resistance value with respect to the unit cutting amount of the cutting groove 4 was small, making it difficult to quickly obtain a desired resistance value by trimming.
本発明は、このような点に鑑みてなされたもので、抵抗
膜の一定長さ内でより広範囲の抵抗値を得ることを可能
とし、トリミングによって所望の抵抗値を迅速に得るこ
とができる抵抗体を提供することを目的とするものであ
る。The present invention has been made in view of these points, and provides a resistor that makes it possible to obtain a wider range of resistance values within a certain length of a resistive film, and that allows a desired resistance value to be quickly obtained by trimming. The purpose is to provide the body.
（課題を解決するための手段）
本発明は、絶縁基板上に抵抗膜を形成するとともにこの
抵抗膜の幅方向両側に重接する一対の導体を対向形成し
、その抵抗膜には一対の導体間の一端側から他端側へ切
削溝を入れて所望の抵抗値を設定した抵抗体において、
前記抵抗膜は、他端側に前記切削溝を形成可能とする突
出部を前記導体より突出形成し、この突出部の幅を導体
が重接された一端側より小さくしたものである。(Means for Solving the Problems) The present invention forms a resistive film on an insulating substrate, and also forms a pair of conductors facing each other, which overlap each other on both sides of the resistive film in the width direction. In a resistor that has a cutting groove cut from one end to the other end to set the desired resistance value,
The resistive film has a protruding portion protruding from the conductor that allows the cutting groove to be formed on the other end thereof, and the width of the protruding portion is smaller than that of the one end on which the conductor overlaps.
（作用）
本発明では、絶縁基板上に形成された抵抗膜に一対の導
体間の一端側から他端側の突出部にわたりトリミングに
よって切削溝を入れ、所望の抵抗値を設定する。(Function) In the present invention, a desired resistance value is set by trimming a cut groove in a resistive film formed on an insulating substrate from one end to the protrusion between a pair of conductors and extending from the other end.
そして、前記抵抗膜の突出部の幅を小さくすることによ
り、抵抗膜の一定長さ内でより広範囲の抵抗値が得られ
、かつ、切削溝の単位切削量に対する抵抗値変化率が大
きくなり、トリミングによって所望の抵抗値を迅速に得
られる。By reducing the width of the protrusion of the resistive film, a wider range of resistance values can be obtained within a certain length of the resistive film, and the rate of change in resistance value per unit cutting amount of the cutting groove is increased; The desired resistance value can be quickly obtained by trimming.
（実施例）
以下、本発明の一実施例の構成を第１図および第２図を
参照して説明する。(Embodiment) Hereinafter, the configuration of an embodiment of the present invention will be described with reference to FIGS. 1 and 2.
第１図は抵抗体の平面図を示し、１１はアルミナ等のセ
ラミック材料で形成された絶縁基板で、この絶縁基板１
１上に、抵抗ペーストを印刷、焼成して抵抗膜１２を形
成し、さらに、この抵抗膜１２上の一端幅方向両側に、
銅系あるいは銀パラジウム系等の導体ペーストを印刷、
焼成して一対の導体１３を近接した間隔Ｗ１で対向形成
している。FIG. 1 shows a plan view of the resistor, and 11 is an insulating substrate made of a ceramic material such as alumina.
1, a resistive paste is printed and fired to form a resistive film 12, and furthermore, on both sides of one end of the resistive film 12 in the width direction,
Printing copper-based or silver-palladium-based conductive paste,
By firing, a pair of conductors 13 are formed facing each other at a close distance W1.
前記抵抗膜１２は、導体１３が重接された一端の重接部
１５と、導体１３より突出する他端の突出部１６とから
略Ｔ字状に形成され、この突出部１６の幅Ｗ２は重接部
１５の幅Ｗ、より小さくなっている。The resistive film 12 is formed into a substantially T-shape including an overlapped portion 15 at one end where the conductor 13 overlaps, and a protrusion 16 at the other end that protrudes from the conductor 13, and the width W2 of the protrusion 16 is as follows. The width W of the overlapped portion 15 is smaller.
次に、抵抗膜１２の抵抗値のトリミングを行う。Next, the resistance value of the resistive film 12 is trimmed.
抵抗膜１２は抵抗値が予め所望の抵抗値以下になるよう
に設定されており、一対の導体１３間の抵抗膜１２の一
端側から他端側の突出部１６に向けてレーザー光線また
はサンドブラスト等によってトリミングして切削溝１７
を形成し、この切削溝１７によって一対の電極１３間の
距離を長くとって抵抗値を上昇させ、所望の抵抗値を得
るようにしている。The resistance value of the resistive film 12 is set in advance to be less than or equal to a desired resistance value, and the resistive film 12 is heated by laser beams, sandblasting, etc. from one end side of the resistive film 12 between the pair of conductors 13 toward the protrusion 16 on the other end side. Trim and cut groove 17
The cut grooves 17 increase the distance between the pair of electrodes 13 to increase the resistance value and obtain a desired resistance value.
そして、このように構成された抵抗体において、導体１
３の間隔Ｗ＋ ＝０．７ｍｍ、抵抗波膜１２の突出部１
６の幅Ｗ２＝０．７１１１、重接部１５の幅Ｗ。In the resistor configured in this way, the conductor 1
3 interval W+ = 0.7 mm, protrusion 1 of resistive wave membrane 12
Width W2 of 6 = 0.7111, width W of overlapped portion 15.
＝１．７＋ｅｍ、重接部１５の長さＬ＋ ＝０．３１１
３抵抗膜１２の長さＬ２＝２．５１１とした場合、切削
溝１７の切削量Ｘと抵抗値Ｒとの関係を第２図に実線で
示す。突出部１６の幅Ｗ２を小さくすることにより、抵
抗値の変化幅が比較例１．２に比べて１．５〜２倍に大
きくなり、３にΩから３０にΩまで直線性の非常によい
抵抗値を得ることができる。また、切削溝１７の単位切
削量に対する抵抗値変化率が大きく、トリミングによっ
て所望の抵抗値を迅速に得ることができる。また、低抵
抗領域での抵抗値変動率は小さいため、比較的低い抵抗
値も正確に得ることができる。=1.7+em, length L+ of overlapped part 15 =0.311
When the length L2 of the three-resistance film 12 is set to 2.511, the relationship between the cutting amount X of the cutting groove 17 and the resistance value R is shown by a solid line in FIG. By reducing the width W2 of the protruding portion 16, the range of change in resistance value becomes 1.5 to 2 times larger than that of Comparative Example 1.2, and the linearity is very good from 3Ω to 30Ω. You can get the resistance value. Further, the rate of change in resistance value with respect to the unit cutting amount of the cutting groove 17 is large, and a desired resistance value can be quickly obtained by trimming. Furthermore, since the resistance value variation rate in the low resistance region is small, a relatively low resistance value can be obtained accurately.
本発明によれば、絶縁基板上に形成された抵抗膜に一対
の導体間の一端側から他端側の突出部にわたりトリミン
グによって切削溝を入れ、所望の抵抗値を設定する抵抗
体において、前記抵抗膜の突出部の幅を小さくすること
により、抵抗膜の一定長さ内でより広範囲の抵抗値が得
られ、がっ、切削溝の単位切削量に対する抵抗値変化率
が大きく、トリミングによって所望の抵抗値を迅速に得
ることができる。According to the present invention, in the resistor in which a desired resistance value is set by cutting grooves by trimming a resistive film formed on an insulating substrate from one end side to the other end side protrusion between a pair of conductors. By reducing the width of the protrusion of the resistive film, a wider range of resistance values can be obtained within a certain length of the resistive film, and the rate of change in resistance value per unit cutting amount of the cutting groove is large. resistance value can be obtained quickly.
第１図は本発明の抵抗体の一実施例を示す平面図、第２
図は特性図、第３図および第４図は従来の抵抗体の平面
図である。
１１・・絶縁基板、１２・・抵抗膜、１３・・導体、１
６・・突出部、１７・・切削溝。
】Ｉ■４FIG. 1 is a plan view showing one embodiment of the resistor of the present invention, and FIG.
The figure is a characteristic diagram, and FIGS. 3 and 4 are plan views of conventional resistors. 11...Insulating substrate, 12...Resistive film, 13...Conductor, 1
6... Protrusion, 17... Cutting groove. 】I■4
Claims (1)
膜の幅方向両側に重接する一対の導体を対向形成し、そ
の抵抗膜には一対の導体間の一端側から他端側へ切削溝
を入れて所望の抵抗値を設定した抵抗体において、 前記抵抗膜は、他端側に前記切削溝を形成可能とする突
出部を前記導体より突出形成し、この突出部の幅を導体
が重接された一端側より小さくしたことを特徴とする抵
抗体。(1) A resistive film is formed on an insulating substrate, and a pair of conductors are formed facing each other on both sides of the resistive film in the width direction, and a groove is cut in the resistive film from one end to the other end between the pair of conductors. In the resistor in which a desired resistance value is set by setting a desired resistance value, the resistive film has a protruding portion protruding from the conductor that allows the cutting groove to be formed on the other end side, and the width of the protruding portion is determined by the weight of the conductor. A resistor characterized by being smaller than one end that is in contact with the other end.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2254536A JPH04133301A (en) | 1990-09-25 | 1990-09-25 | Resistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2254536A JPH04133301A (en) | 1990-09-25 | 1990-09-25 | Resistor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04133301A true JPH04133301A (en) | 1992-05-07 |
Family
ID=17266410
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2254536A Pending JPH04133301A (en) | 1990-09-25 | 1990-09-25 | Resistor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04133301A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6480092B1 (en) * | 1995-02-21 | 2002-11-12 | Murata Manufacturing Co., Ltd. | Resistor trimming method |
-
1990
- 1990-09-25 JP JP2254536A patent/JPH04133301A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6480092B1 (en) * | 1995-02-21 | 2002-11-12 | Murata Manufacturing Co., Ltd. | Resistor trimming method |
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