JPS5827027Y2 - Printed circuit board plating jig - Google Patents

Printed circuit board plating jig

Info

Publication number
JPS5827027Y2
JPS5827027Y2 JP14948379U JP14948379U JPS5827027Y2 JP S5827027 Y2 JPS5827027 Y2 JP S5827027Y2 JP 14948379 U JP14948379 U JP 14948379U JP 14948379 U JP14948379 U JP 14948379U JP S5827027 Y2 JPS5827027 Y2 JP S5827027Y2
Authority
JP
Japan
Prior art keywords
printed circuit
circuit board
plating
auxiliary cathode
plating jig
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP14948379U
Other languages
Japanese (ja)
Other versions
JPS5669671U (en
Inventor
成光 松本
秀夫 星野
茂 西沢
Original Assignee
富士通株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士通株式会社 filed Critical 富士通株式会社
Priority to JP14948379U priority Critical patent/JPS5827027Y2/en
Publication of JPS5669671U publication Critical patent/JPS5669671U/ja
Application granted granted Critical
Publication of JPS5827027Y2 publication Critical patent/JPS5827027Y2/en
Expired legal-status Critical Current

Links

Landscapes

  • Manufacturing Of Printed Wiring (AREA)

Description

【考案の詳細な説明】 本考案は印刷回路板のめつき治具の改良に関する。[Detailed explanation of the idea] The present invention relates to an improvement in a plating jig for printed circuit boards.

従来通信機用などの電気機器には部品の搭載とそれらの
部品間の配線を効率良く行なうために印刷回路板が用い
られている。
2. Description of the Related Art Conventionally, printed circuit boards have been used in electrical equipment such as communication devices in order to efficiently mount components and conduct wiring between those components.

この印刷回路板はその配線パターンを形成する過程にお
いて全面に銅めっきを行なう工程がある。
This printed circuit board includes a process of copper plating the entire surface in the process of forming the wiring pattern.

このめっきは大面積の回路板に平均した厚さで銅が析出
するのが望ましいが、めっきの特性として周辺効果があ
り、このため外周部の方が中心部より厚くなることは周
知の事実である。
It is desirable for this plating to deposit copper with an average thickness over a large area of the circuit board, but it is a well-known fact that there is a peripheral effect as a characteristic of plating, which causes the outer periphery to be thicker than the center. be.

そのためめっき厚分布均一制御法が種々考えられている
が、その1例として、回路板の外周部に接近して補助陰
極を設け、回路板の外周部に集中する電流を補助陰極に
逃がす方法が用いられている。
For this reason, various methods for controlling the uniformity of plating thickness distribution have been considered. One example is a method in which an auxiliary cathode is provided close to the outer periphery of the circuit board, and the current concentrated at the outer periphery of the circuit board is released to the auxiliary cathode. It is used.

ところがこの方法はめっきを繰返すと当然めっきが補助
陰極にも析出するためその表面積が大きくなり電流が流
れ易くなる。
However, in this method, when plating is repeated, the plating is naturally deposited on the auxiliary cathode, which increases the surface area and makes it easier for current to flow.

そして補助陰極への電流が多くなると印刷回路板の周辺
に流れる電流は必要以上に小さくなり、必要とするめつ
き厚さを確保することが困難となる。
When the current flowing to the auxiliary cathode increases, the current flowing around the printed circuit board becomes smaller than necessary, making it difficult to secure the required plating thickness.

本考案はこの欠点を改良するために案出されたものであ
る。
The present invention was devised to improve this drawback.

このため本考案の印刷回路板のめつき治具においては、
印刷回路板を懸吊する電流供給板と、該印刷回路板の外
周に沿って適宜の間隔を保った補助陰極とを設け、該電
流供給板と補助陰極との間に可変抵抗器を挿入して電気
的に接続したことを特徴とするものである。
Therefore, in the printed circuit board plating jig of the present invention,
A current supply board for suspending a printed circuit board and an auxiliary cathode are provided at appropriate intervals along the outer periphery of the printed circuit board, and a variable resistor is inserted between the current supply board and the auxiliary cathode. It is characterized by being electrically connected to each other.

以下添付図面に基づいて本考案の実施例について詳細に
説明する。
Embodiments of the present invention will be described in detail below based on the accompanying drawings.

図に印刷回路板を取着した本考案の実施例を斜視図によ
り示す。
The figure shows a perspective view of an embodiment of the invention with a printed circuit board attached thereto.

図において符号1は電流供給板であって一方に印刷回路
板2をボルト3により取着し、他方のフック状部分1′
をめっき装置の電流供給棒4に引掛けて印刷回路板2へ
の電流供給を行なうようになっている。
In the figure, reference numeral 1 denotes a current supply plate, on one side of which a printed circuit board 2 is attached with bolts 3, and on the other side a hook-shaped portion 1'.
The electric current is supplied to the printed circuit board 2 by hooking it onto a current supply rod 4 of the plating apparatus.

この電流供給板1には印刷回路板2の外周に沿って適宜
の間隔を保った補助陰極5が絶縁物6を介して金具7に
より取着されている。
Auxiliary cathodes 5 are attached to the current supply plate 1 at appropriate intervals along the outer periphery of the printed circuit board 2 with metal fittings 7 through insulators 6.

また補助陰極5の下部にも絶縁物8を介して金具9が取
着され、この金具9は印刷回路板2にボルト10により
取着されている。
Further, a metal fitting 9 is attached to the lower part of the auxiliary cathode 5 via an insulator 8, and this metal fitting 9 is attached to the printed circuit board 2 with bolts 10.

さらに電流供給板1と補助陰極5との間には可変抵抗器
11が挿入され両者を電気的に接続している。
Further, a variable resistor 11 is inserted between the current supply plate 1 and the auxiliary cathode 5 to electrically connect them.

このように構成された本考案のめつき治具の動作につい
て次に説明する。
The operation of the plating jig of the present invention constructed in this manner will be described next.

先ず本治具に印刷回路2を取着しめつき槽中に浸漬して
めっきを行い、印刷回路板2の周辺部と中心部とのめつ
き厚さに差ができないように可変抵抗器11を操作し、
補助陰極5へ流れる電流を調整する。
First, the printed circuit 2 is attached to this jig and immersed in a bath for plating.The variable resistor 11 is attached so that there is no difference in the plating thickness between the periphery and the center of the printed circuit board 2. operate,
The current flowing to the auxiliary cathode 5 is adjusted.

可変抵抗器11をこの状態のままにして繰返し何枚かの
印刷回路板のめっきを行なうと補助陰極5にもめっきが
析出しその表面積が増加して来て電流が流れ易くなる。
If the variable resistor 11 is left in this state and several printed circuit boards are repeatedly plated, the plating will also deposit on the auxiliary cathode 5, increasing its surface area and making it easier for current to flow.

そこで可変抵抗器11をその抵抗値が大となる方向に操
作して印刷回路板2の周辺部と中心部のめつき厚が等し
くなるように補助陰極5へ流れる電流を調整するのであ
る。
Therefore, the current flowing to the auxiliary cathode 5 is adjusted by operating the variable resistor 11 in a direction that increases its resistance value so that the plating thickness at the periphery and the center of the printed circuit board 2 are equal.

以上説明した如く本考案のめつき治具は補助陰極を設け
ると共にその電流を調整することができる可変抵抗器を
挿入することにより印刷回路板のめつき厚分布を均一に
することを可能としたものであって、印刷回路板の品質
向上に寄与するものである。
As explained above, the plating jig of the present invention makes it possible to make the plating thickness distribution of the printed circuit board uniform by providing an auxiliary cathode and inserting a variable resistor that can adjust the current. This contributes to improving the quality of printed circuit boards.

【図面の簡単な説明】[Brief explanation of the drawing]

図は本考案にかかる実施例の印刷回路板のめつき治具の
斜視図である。 1・・・・・・電流供給板、2・・・・・・印刷回路板
、5・・・・・・補助陰極、6,8・・・・・・絶縁物
、7,9・・・・・・金具、11・・・・・・可変抵抗
器。
The figure is a perspective view of a printed circuit board plating jig according to an embodiment of the present invention. DESCRIPTION OF SYMBOLS 1... Current supply board, 2... Printed circuit board, 5... Auxiliary cathode, 6, 8... Insulator, 7, 9... ...Metal fittings, 11...Variable resistor.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 印刷回路板を懸吊する電流供給板と、該印刷回路板の外
周に沿って適宜の間隔を保った補助陰極とを設け、該電
流供給板と補助陰極との間に可変抵抗器を挿入して電気
的に接続して戒る印刷回路板のめつき治具。
A current supply board for suspending a printed circuit board and an auxiliary cathode are provided at appropriate intervals along the outer periphery of the printed circuit board, and a variable resistor is inserted between the current supply board and the auxiliary cathode. A plating jig for printed circuit boards that can be electrically connected.
JP14948379U 1979-10-30 1979-10-30 Printed circuit board plating jig Expired JPS5827027Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14948379U JPS5827027Y2 (en) 1979-10-30 1979-10-30 Printed circuit board plating jig

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14948379U JPS5827027Y2 (en) 1979-10-30 1979-10-30 Printed circuit board plating jig

Publications (2)

Publication Number Publication Date
JPS5669671U JPS5669671U (en) 1981-06-09
JPS5827027Y2 true JPS5827027Y2 (en) 1983-06-11

Family

ID=29380567

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14948379U Expired JPS5827027Y2 (en) 1979-10-30 1979-10-30 Printed circuit board plating jig

Country Status (1)

Country Link
JP (1) JPS5827027Y2 (en)

Also Published As

Publication number Publication date
JPS5669671U (en) 1981-06-09

Similar Documents

Publication Publication Date Title
US1563731A (en) Electrical apparatus and method of manufacturing the same
US5227041A (en) Dry contact electroplating apparatus
KR20040051498A (en) Method and apparatus for controlling local current to achieve uniform plating thickness
US6267860B1 (en) Method and apparatus for electroplating
CN113862760A (en) Electroplating device for controlling current of individual clamp
JPH11246999A (en) Plating method for wafer and apparatus therefor
JPS5827027Y2 (en) Printed circuit board plating jig
US20170298530A1 (en) Electroplating anode assembly
JPS5633500A (en) Averaging apparatus of distribution of plating electric current
JPS63274794A (en) Method for electroplating dielectric core
US20020157959A1 (en) Process for electroplating a work piece coated with an electrically conducting polymer
JPH05148693A (en) Copper electroplating jig
JPH05239698A (en) Electroplating method
US20170298529A1 (en) Electroplating system
JPH0722473A (en) Continuous plating method
JP3416620B2 (en) Electrolytic copper foil manufacturing apparatus and electrolytic copper foil manufacturing method
JPH073000B2 (en) Electroplating equipment
TWI769643B (en) A plating apparatus having individual partitions
JPH08246194A (en) Method for electrodeposition coating of work and apparatus therefor
KR102410794B1 (en) High-quality plating apparatus
US2683112A (en) Method of electroplating
JPH02188989A (en) Electrically plating method for printed circuit board
JPS63202089A (en) Electrolytic copper plating equipment
KR20030025523A (en) apparatus for electroplating PCB
JPH1168293A (en) Horizontal carriage electric plating device