JPS5826170B2 - ウエハ処理方法 - Google Patents
ウエハ処理方法Info
- Publication number
- JPS5826170B2 JPS5826170B2 JP48060892A JP6089273A JPS5826170B2 JP S5826170 B2 JPS5826170 B2 JP S5826170B2 JP 48060892 A JP48060892 A JP 48060892A JP 6089273 A JP6089273 A JP 6089273A JP S5826170 B2 JPS5826170 B2 JP S5826170B2
- Authority
- JP
- Japan
- Prior art keywords
- jig
- wafer
- etching
- cleaning
- processing method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Weting (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP48060892A JPS5826170B2 (ja) | 1973-06-01 | 1973-06-01 | ウエハ処理方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP48060892A JPS5826170B2 (ja) | 1973-06-01 | 1973-06-01 | ウエハ処理方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5011670A JPS5011670A (OSRAM) | 1975-02-06 |
| JPS5826170B2 true JPS5826170B2 (ja) | 1983-06-01 |
Family
ID=13155450
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP48060892A Expired JPS5826170B2 (ja) | 1973-06-01 | 1973-06-01 | ウエハ処理方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5826170B2 (OSRAM) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56164548U (OSRAM) * | 1980-05-08 | 1981-12-07 |
-
1973
- 1973-06-01 JP JP48060892A patent/JPS5826170B2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5011670A (OSRAM) | 1975-02-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR920003878B1 (ko) | 반도체기판의 표면처리방법 | |
| US6269511B1 (en) | Surface cleaning apparatus | |
| DE102009012878B4 (de) | Schauerkopf und Substratbearbeitungsvorrichtung | |
| JP3261683B2 (ja) | 半導体の洗浄方法及び洗浄装置 | |
| US20020033186A1 (en) | Processes and apparatus for treating electronic components | |
| US20040216764A1 (en) | Method and system for cleaning a semiconductor wafer | |
| JPH11121417A (ja) | 半導体基板の処理システムおよび処理方法 | |
| US20020066717A1 (en) | Apparatus for providing ozonated process fluid and methods for using same | |
| KR20190002396A (ko) | 액 처리 방법 및 액 처리 장치 | |
| JPS5826170B2 (ja) | ウエハ処理方法 | |
| JP2002143795A (ja) | 液晶用ガラス基板の洗浄方法 | |
| JPS6072233A (ja) | 半導体ウエ−ハの洗浄装置 | |
| JP2002110624A (ja) | 半導体基板の表面処理方法及び装置 | |
| JPS614525A (ja) | アルミニウム合金製真空容器および真空機器用部品の酸化膜形成方法 | |
| JP2003124198A5 (OSRAM) | ||
| JPH02143418A (ja) | 薄膜形成装置 | |
| JPH0897185A (ja) | 半導体装置の製造方法 | |
| JP3576216B2 (ja) | 合成樹脂製収納ケースの洗浄方法 | |
| JPH0371194B2 (OSRAM) | ||
| JPS5571027A (en) | Continuous surface treatment apparatus | |
| JPS599926A (ja) | 半導体装置の製造方法 | |
| JP2000208458A (ja) | 基板洗浄装置 | |
| JPS6298728A (ja) | ドライエツチング装置 | |
| JPH0441172Y2 (OSRAM) | ||
| JPS62287079A (ja) | プラズマcvd装置 |