JPS5824764A - Heat pump device - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a heat pump device, and particularly to a heat pump device that pumps heat from a relatively low-temperature heat source and obtains high temperature heat.

As a field of use, waste heat recovery equipment in factories, etc. has 30
Hot water at ~60°C is difficult to use, and equipment costs are high to recover this heat. Therefore, in order to recover low-temperature heat sources that are in large quantities or are being discarded, it is necessary to improve operating efficiency and reduce operating costs.

This system can be used as a highly efficient waste heat recovery system. In addition, HEATBO/P air conditioners pump heat from outside air to heat the room, and the air at the indoor condenser inlet is approximately 20℃ and the outlet temperature is 40 to 50℃, which is a large temperature difference. If you use this device, you can improve the efficiency of your air conditioner.

A conventional basic refrigeration cycle system diagram is shown in Fig. 1. The high temperature refrigerant discharged from the compressor 1 exchanges heat with the water used in the condenser 2 and is liquefied. The liquefied refrigerant is depressurized by the expansion valve 3 and becomes a low-temperature refrigerant. The low-temperature refrigerant receives heat in the evaporator 4, gasifies it, and returns to the compressor 1. The figure shows, as an example, the temperature of the heat source and the water used at the inlet and outlet of the evaporator and condenser. Generally, in a refrigeration cycle for obtaining high-temperature water, the condensing pressure is high, so there is a tendency to increase the size of the condenser so that the temperature difference between the condensing temperature of the refrigerant and the water temperature at the outlet of the water used is close to that of the condenser. FIG. 2 shows an example of the temperature distribution of the refrigerant in the condenser and the water used. Therefore, the temperature efficiency expressed by equation (1) approaches 1, and the heat exchange efficiency decreases.

Here K ξ: Temperature efficiency, 'w,: Inlet temperature of used water t%
: Utilization Water Output

Temperature efficiency can be improved if heat flux can be made uniform throughout the condenser. To achieve this, the condensing temperature may be lowered at the inlet of the condenser and raised at the outlet. Details regarding this will be described later.

The present invention was invented in view of the above, and is a device that generates high temperature using a heat pump, and its operating efficiency (cop')
The purpose is to increase

In order to achieve the above object, the present invention improves the efficiency of the heat exchanger, uses the heat exchanger effectively, and lowers the condensing pressure on one side of the systematic refrigeration cycle (in the lowered part, the COP of the compressor ), the efficiency of the entire system (cop)
It has the characteristic of increasing the

An embodiment of the present invention will be explained based on the drawings.

FIG. 3 shows an embodiment of the high temperature water production apparatus. Examples of the temperatures of the heat source and the hot water used are appended to the figure. The refrigeration cycle has two systems, and each can be cycled! (low pressure side) and cycle 1 (high pressure side). The condenser and evaporator are in series with the water system 1 and the irises, and if the flow direction is as described above, the condenser and evaporator pot can be installed one by one as shown in the figure, or one
, ■ may be provided with an independent heat exchanger. The water used enters the condenser from the 1 side and exits from the I side. The heat source (water) enters from the ■ side and exits from the 1 side. Therefore, the pan is operated at a relatively cold load and the l is operated at a hot load. Condenser,
The performance will be described below when the total heat transfer area and total capacity of the evaporator and compressor are the same as those shown in FIG. 1.

FIG. 4 shows the distribution of the refrigerant condensation temperature and the temperature of the water used when the same amount of heat exchange as in the conventional cycle is obtained. This is the case when the refrigerant (2) has four condensers and the area of the condenser is equal to the area of the four condensers. As can be seen from this figure, the condensation temperature of the irises is only slightly higher than that of the conventional cycle (FIG. 1), whereas the condensation temperature of I is very low. Therefore, the COP of 1 becomes high. FIG. 5 shows the results of calculating the COP when the total heat transfer area and the total compressor capacity are kept constant and divided into cycles I and I. When the capacity of low pressure side cycle I is 40 to 50% of the total, C of the entire system
OP is the most highly expressed.

Next, an air source heat pump device will be described as another embodiment of the present invention.

When the present invention is applied to an air conditioner that uses an outdoor unit to draw heat from outside air to heat a room, the result will be as shown in FIG. When the capacity of each cycle is equal, the outside air is 7℃ DB, 5℃ WB
Under operating conditions where the room temperature is 21°C, calculation results show that the COP is approximately 10% higher than in the case of a single cycle.

As explained above, according to the present invention, the coefficient of performance of a heat pump cycle can be improved by 10 to 16% compared to the conventional technology.

[Brief explanation of drawings]

Fig. 1 is a conventional refrigeration cycle diagram, Fig. 2 is a diagram showing the relationship between temperature and heat transfer area, Fig. 3 is a refrigeration cycle diagram of a high-temperature water production apparatus showing an embodiment of the present invention, and Fig. 4 is a diagram showing the relationship between temperature and heat transfer area. The figure is a miniature diagram showing the relationship between temperature and direct heat transfer product, Figure 5 is a diagram showing the relationship between increase in coefficient of performance and capacity ratio, and Figure 6 is a refrigeration diagram of a heat pump device showing another embodiment of the present invention. It is a cycle diagram. 1...Compressor 2...Condenser 3...Evaporator 6...Indoor heat exchanger 7...Outdoor heat exchanger connection area - Konana 4 times

Claims (1)

[Scope of Claims] 1. A heat pump device characterized in that, in a refrigeration cycle with multiple systems, the load system for water, air, etc. of the evaporator and/or condenser is a single system. 2. The heat pump device according to claim 1, wherein the water or air passing through the condenser flows from the low-pressure cycle side to the high-pressure cycle side. 3. The heat pump device according to claim 1, wherein the water or air passing through the evaporator flows from the high-pressure side cycle to the low-pressure side cycle.