JPS5824016B2 - Transfer positioning device in chip bonder - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a transfer and positioning device for a chip bonder that directly bonds chips to the circuit surface of a substrate for manufacturing semiconductor devices.

Recently, with the development of electronic products, in order to further reduce costs, chips are being bonded directly to the circuit surface of the substrate for watches, calculators, thick film ICs, etc.

In this case, as shown in FIG.
The circuit board 1a is stored in the storage tray 2 with the circuit surface 1a facing upward to avoid scratches, dirt, etc.

As shown in FIG. 2, when bonding the bumps 1b of the chip 1 to the pads 3b on the circuit surface 3a of the substrate 3, the circuit surface 3a of the substrate 3 faces upward, and the circuit surface 1a of the chip 1 faces downward. It will be held in

For this reason, it is required that the chip 1 be transferred from the storage tray 2 to the bonding position, that its attitude be turned upside down and that the substrate 3 and the chip 1 be accurately aligned.

Conventionally, in order to transfer and invert and position the chip, a correction station is provided between a storage tray station where a storage tray containing chips is arranged and a bonding position, where the chip is placed and its position is corrected. The suction arm picks up the chip from inside the storage tray, transfers the chip to the position correction station, and after placing the chip on the position correction station, the position is corrected at that station, and then the suction arm again corrects the position. After sucking the chip on the station, the suction arm is reversed so that the circuit surface of the chip faces downward, and then the bonding head picks up the chip from the suction arm and transfers it to the bonding position to perform bonding.

Conventionally, the chip is transferred by a suction arm and placed on a position correction station, the position is corrected, and then the suction arm picks it up again, which makes the operation complicated and does not allow quick work. The disadvantage was that the sequence was complicated.

In addition, since the chip is sucked and reversed again after the position is corrected, the chip whose position has been corrected may shift slightly during suction, and the chip position may vary due to the accuracy of the reversal position.

The present invention has been made in view of the above-mentioned drawbacks of the prior art, and it is an object of the present invention to provide a transfer positioning device for a chip bonder that can bond a substrate and a chip accurately and quickly.

Hereinafter, the present invention will be explained with reference to illustrated embodiments.

FIG. 3 is a perspective view showing an embodiment of the device according to the present invention.

Reference numeral 10 denotes a chip reversal transfer mechanism, in which a nozzle 12 for vacuum suctioning chips is provided at the tip of a suction arm 11 that reciprocates in reverse motion.

Reference numeral 13 denotes a moving table that holds the storage tray 2 in which the chips 1 are arranged and stored and moves in the X and Y directions.

14A. Reference numeral 14B is a correction claw for correcting the position of the transferred and reversed chip 1, and its opposing tips are formed in a V-shape.

Reference numeral 15 denotes a drive device for driving the correction claws 14A, 14B, which moves the correction claws 14A, 14B so as to sandwich the chip from two directions in a plane.

A bonding head 16 attracts the inverted chip and transports it to a bonding position (not shown).

Next, the operation of the device constructed as above will be explained.

When the suction nozzle 12 suctions the circuit surface 1a of the chip 1 according to a control circuit and timing (not shown), the suction arm 11 is rotated 180 degrees as shown by the chain line by the reversing transfer mechanism 10, and the two correction claws 14A are rotated.

It is placed between 14B.

Next, the two correction claws 14A and 14B are driven by the drive device 15.
act simultaneously to grip the chip 1 from both sides as shown in FIG. 4 and correct the position of the chip.

Subsequently, the correction claws 14A and 14B open and the drive device 15 stops.

Next, the bonding head 16 descends and the suction portion 16
a comes into contact with the chip 1 being attracted by the suction nozzle 12, the vacuum between the suction nozzle 12 and the bonding head 16 is switched, and the chip 1 is transferred.

The bonding head 16 attracts the chip 1, moves to the bonding position, and bonds the bumps 1b of the chip 1 to the pads 3b of the substrate 3, as shown in FIG.

On the other hand, when the suction arm 11 suctions the chip 1 from the storage tray 2 and starts reversing as described above, the movable table 13 moves in the XY direction so that the next new chip to be suctioned is located directly below the suction nozzle 12. Moving.

Further, as described above, at the same time as the bonding head 16 moves to the bonding position, the suction arm 11 is reversed to its original position and suctions a new chip.

Thereafter, the above operations are sequentially repeated to perform bonding.

The position of the chip in the above embodiment was corrected by holding only the chip 1 between the correction claws 14A and 14B as shown in FIG. 4, but as shown in FIG. The same size as the outer diameter of the correction claw 14A,
14B may be made thicker so that the suction nozzle 12 and the chip 1 are held together.G).

As is clear from the above explanation, according to the transfer positioning device for a chip bonder according to the present invention, the suction arm adsorbs the chip, transfers and reverses it, and in this state the position of the chip is corrected. Chips can be delivered directly to the bonding head, improving chip positioning accuracy.

Furthermore, since the suction arm can be moved and reversed in a continuous motion, the apparatus can be simplified and work efficiency can be improved.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of a chip stored in a storage tray, FIG. 2 is a perspective view for explaining the state before the chip is bonded to a substrate, and FIG. 3 is an implementation of the device according to the present invention. FIG. 4 is a perspective view showing an example, FIG. 4 is a plan view, b is a cross-sectional view, and FIG. 5 is a cross-sectional view showing a modified example of the position correcting portion of the chip. 1...Chip, 1a...Circuit surface, 2.
...Storage tray, 11...Suction arm,
14A, 14B... Correction nails.

Claims (1)

[Claims] 1. A storage tray that stores the chip with its circuit side facing up, a suction arm that suctions the chip from above the storage tray, transfers it toward the bonding position, and reverses it, and a chip that is attracted to the reversed suction arm. A transfer positioning device in a chip bonder, comprising a correction means for performing position correction.