JPS58225689A - Method of producing laminated board for printed circuit board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method VL for manufacturing a laminate for a printed wiring board that has excellent through-hole reliability.

Conventionally, laminates for printed distribution boards have been made of woven fabrics, non-woven fabrics, # shaped materials, etc. made of sand, glass fibers, 1-iso fibers, wood pulp, etc. Phenol resins, epoxy resins, untrusted olopolyester resins, etc. are used as fiber base materials. υThermosetting τl, resin ligatures are combined and molded, and 7t has also been used for some time. For example, 1 paper, phenol, paper epoxy, glass cloth epoxy, glass matte polyester, etc.
Yes, there is a lamination, and it is used for various purposes. In other words, it is not used in consumer electronic equipment.
Most of the printed wiring boards used are paper-based laminates with a thickness of 1゜.
A little over 80% of the wiring is covered by a printed wiring board. However, recent consumer electronic devices also have fewer and fewer conventional parts.
There is a tendency for VL to be deployed in a limited space circle, and in order to cope with this, one board has wiring on two sides (front and back),
Electrical conduction through hole on both sides? Paper material to be connected through, both ■ There are many glint winning boards, 〇 -10,000, computers -1 Communication equipment control 1 III
A glass cloth epoxy laminated board was first used in the printed wiring board used for so-called /8 chestnut Vt, and the miniaturization of the board and the density mounting of 2 parts of 6 and the same VCC18 harmony were achieved. 1
Most of the 3゜ glass cloth epoxy laminated boards are used as double-sided printed wiring boards, and are becoming more and more expensive. The increased integration of devices sold on the market and the increased density of packaging on the board of cn, etc.
/) The thermal expansion of the substrate (lJ) causes a large residue compared to the thermal expansion of the device, resulting in an open circuit that reduces reliability.

In other words, the thermal expansion of the board causes problems such as disconnection of the circuit, poor connection, or poor connection of through-hole plating. Sex (lJ sure magazine or required chivalry).

As mentioned above, the applications of printed wiring boards are relatively low-grade fields for consumer use such as 1 paper base substrate, representative IL, and glass cloth epoxy board 1c, 6 types of large computers, etc. The high reliability of Gin is admired, and it is the oldest in the field of 7L, Onice Automation in the φ administrative and indirect departments of companies, Factory Automation in factory VC, and Home Electronics pM Merai Giant in Boiwa VT. Vernal electronics, etc. Q for individuals
) Computerization has progressed in all aspects of office life, and the number of printed wiring boards in these fields is rapidly decreasing and increasing.
However, in the field of printed wiring boards in the field of FT, GAR, and Konrari, glass cloth epoxy laminates are at a level close to glass cloth epoxy laminates with characteristic RC RRX 1llII II, or glass cloth epoxy laminates are The lower level is Yasugi.

Therefore, for the above-mentioned application VC, the surface glass cloth and the core material V
Relatively inexpensive glass-based composite laminates made of glass non-woven fabric are beginning to be used. However, due to the stiffness of the composite laminated plate, the glass non-woven cloth tray tableware has a sparse glass content compared to glass cloth.
The inside of the substrate is molded with resin (1J vehicle JUII compound or inevitably PC is necessary), therefore, as a substrate, the disadvantage is that the thermal expansion and contraction is larger than that of the tar glass cloth base material.

Due to the stiffness defect, is there a problem that the axiality of the through hole in the plate is low at 1 m in practical use? bring about In other words, the In1w6υ connection failure was caused by the cutting of the through-hole plating due to the thermal shock VC of the lifting platform that filled the through-hole with 1G, and the RC board was completely immersed in the bath with 1J in each case.
Due to the PJ disaster attack, there is a gap in the board (interlayer ex <ri)
A phenomenon occurs. The reason for this is that the entire thickness of the board is not clear, or the thickness of the board is greater than that of the copper plated. From 2 to 0 Now, the plane of the substrate 'r, x
If y is (xy force direction) and the thickness direction of the substrate is <z direction, then the floating direction QJ of the substrate is large due to thermal expansion LcL, and the xy direction of the substrate is the length direction of the fiber in the Xy force direction. Ayu rice reinforced with oriented glass cloth or glass non-woven fabric, the expansion and astringency of the same resin in the x and y directions is 2 times, and the FC is suppressed by the force of 2 times in the 2 directions, 1/ciI, and the 2 directions in the z direction. Because it was not in the tub material distributed to the area, a fever of 711 or almost 01 appeared in January 4th.
In order to do so, KajL et al. Therefore, in order to improve the thermal expansion and contraction τ of the two forces, σ, the base material with fibers arranged in two directions is convenient.
c Needle bunching process 'km' to distribute the fibers forcibly in the thickness direction of the base material (1-)z direction VC 'fc Mel material also used for grape material, the production of laminates is done in the x and y directions. (Since this is a method of forming by compressing L direction, the fibers which have been oriented δ 2L times in advance are also arranged in the XZ plane due to the compression force. V (There is no fiber in the distribution, and the improvement of thermal expansion in the thickness direction cannot be achieved.〇5- In addition, as a conventional method for producing glass epoxy laminates, the method of manufacturing glass base material The method of heating Gripreg 7° is generally used for VC.

The varnish VC (M-free CL) used in the preparation of a slip reg in the VC method is white-washed to obtain n7t.
I thought of a method of heat pressing the prepreg sheet.
However, if you use a short fibrous material with an average length of 10 μm (1), the fibrous material that is not suitable for the flow will also be removed when the heat is applied. Since there is a difference in the flow of the fibrous material, the VC of the fibrous material is not uniformly distributed throughout the laminate. In addition, the average length of the fibers is relatively small, 50 μm, and the fibers are distributed in the state 7. Due to the pressure force O in the thickness direction of the laminate during hot pressing, the fibers are thick. Since the fibers are oriented in the plane direction perpendicular to the vertical direction P], the fibers arranged in the floating direction of the laminate cannot be obtained in the existing laminate.

In response to the misfire T14, we extensively investigated methods for manufacturing laminates and obtained several laminates for Indo fat distribution boards with low thermal expansion and fibers arranged in the thickness direction of the board. The thing is t'sata. That is, inventively, a fibrous or flaky material with an average length of 30 μm or less is partially supplied to the fiber base material, and the necessary equipment (as appropriate) is applied. A copper agent is layered on the surface of the Cn layer, and then at least one of a pair of parallel plates is coated using a mold having a VC protrusion on the periphery of a pair of parallel plates. The present invention relates to a method for manufacturing a printed wiring board, characterized in that the printed wiring board is pressed and shaped while being held by protrusions.

Uninvented manufacturing method V (processing) As a result of distribution of omnidirectional VC-like fibers or flakes in the laminate, the thickness direction I/C-like fibers or flakes are arranged. If the average length of the fibrous or flaky material exceeds 60 μm, it may be used as a core material. Due to the glass fibers used, fibrous materials or flaky materials may be filtered, resulting in non-uniform distribution of the particles within the δtL1 substrate.

The average length of the fibrous or flaky material is 60 Am or less,
It is not clear why the longitudinal direction shows a disordered distribution, but the flow n of the 4 diaphragms or flakes 1/J strongly depends on the flow 1c of the sphere fat and the resin. It is thought that the glass ruts caused by the core material advance with turbulent flow, and the flaky material 1 is partially supplied to the fibers, and due to the turbulence caused by the resin yc, the direction VC If the resin is not aligned, it will flow out and the resin will harden.

μ-wollastonite, Merck, sericite, kaolinite, bath-fused silica and J inorganic substances are used as fibrous or flaky materials, and are those with a small coefficient of thermal expansion. The use of 1 ntri resin 100 rin IC against 5
~50. B'fjlIt capital use t'Lru.

Non-woven glass fabric, crow cloth, etc. are used for the glass fiber material.Hereinafter, IVC will be explained with specific examples of non-invention. (Manufactured by Tepa Co., Ltd., 3 product names: Araldai) 8011) Meeting 7JI] Melt at 110°C in a heat chamber, and put an acid anhydride curing agent (trade name: HN-2200, manufactured by Hitachi Chemical) and an accelerator ( Benzyldimethylamine) QJ mixture was prepared in a liquid state (lJ state) and
This container contains 100 resins, 65 hardeners, and 1.5 accelerators.
part, average length 9 μm (tJMerck powder was mixed with 50 pieces and 1 prodigy, stirred with a stirrer and mixed with 70 g of resin mixture 400 g 'f (521) ohm square, quality!i 2
00 g/m” glass non-woven fabric clay
[The land was supplied so that it was 1 ml φ. Furthermore, on top of that, a glass nonwoven fabric with a mass of 200 g/m”11
I fell asleep.

CLJ copper foil with a thickness of 65 μm and mass 2o 9 on both surfaces of this n.
g/nl"tZr Crow cloth (Asahi Schniebel product name 762B) and all-copper foil or VC are laid on the top surface, and the lower mold is a flat plate of 51Qmrn square and the upper mold is 510mm square flat. A mold with band-shaped protrusions with a thickness of 1.19 mm and a spacing of 5 um was charged at the inner peripheral edge of the disk, and a straight line of 5 tons (above the fin 1) was applied. During the mold vortex at the time of stiffness, the temperature of both upper and upper plates was 170℃, the mold was fully clamped in 50 seconds, and molding was performed for 5 minutes at the highest pressure cuff 0 kg/afP required for scrapping.7'+': (1 cCtJKt, Te When measuring the cost, expansion body, and mosquitoes in two directions (thickness direction) of the Toku1rikunhidan laminate, L
l s x 1o-'/'c, subordinate X (υ configuration CJ
It's lower and better than Kai's Hani VC. In addition, when all through holes were formed in the laminate and a series resistance vorticity cycle test was conducted, it was found to be superior to a laminate with a conventional configuration. In addition, the a between the through-hole plating wall and the resin layer in the board caused by the heat generated when through-hole VC soldering is r'L (called a resin recess fan) (+- , Under the microscope, the cross-section of the through-hole (as shown in Figure 1), the incidence of γL was very low.Table 1 shows the results of γL. mirror i
.

When I examined the T-side of the laminate (1), it was found that VC was evenly distributed between the talc powder or glass fibers oriented in all directions, including the length and force directions. It is believed that this characteristic of the distribution of talcum powder is responsible for the reduction in the coefficient of thermal expansion and the improvement in timeability.

<Comparative example> 111 Is it carried out with resin that does not distribute any fibrous or flaky materials? II
The entire laminate was made using the same method as Ct, and a similar evaluation was carried out.The results are shown in Table 1 for further consideration.R57. Akirakarayu' Raka l to v's non-invention 4) Inpaku j distribution! It is certain that the laminated plate for the plate has excellent cylindrical axis properties in the F and M directions (/7 heat tensile shrinkage or non-tight δ (through hole C7)) due to its different structure.
@1ko.

Table 1 & layer sacrifice ■Characteristics Note 1) 1IIIi Expansion IJjt, coefficient measurement using a thermomechanical testing machine 1500KJ made by Noodle 3 Kuuriko:! , 1 row was carried out 0 2) Series resistance key cycle test e, test butter 7 The fully formed test specimen was treated as 1 cycle below, t < 9, and the change in resistance was examined by fc
.

1 cycle - Vc in oil at 260°C 1 o seconds & + left for 1 minute at 100 degrees Celsius 50 seconds'eL left for 1 minute at 100 degrees Celsius 6) Through-hole gold-free solder at 288 degrees Celsius Bath 1. Pickled carrots [□1 through pole (z)lliliIm
I performed a resin recession ceremony using K-microscope. VC if the incidence rate is less than or equal to a.

16 one

Claims (1)

[Claims] 1. A printed wiring board characterized by partially applying a thermosetting resin containing fibrous or flaky materials with an average length of 50μ or less to a glass fiber base material, and heat-pressing the thermosetting resin. Method of manufacturing a laminate for use.