JPS58224165A - Vacuum deposition device - Google Patents

Vacuum deposition device

Info

Publication number
JPS58224165A
JPS58224165A JP10621782A JP10621782A JPS58224165A JP S58224165 A JPS58224165 A JP S58224165A JP 10621782 A JP10621782 A JP 10621782A JP 10621782 A JP10621782 A JP 10621782A JP S58224165 A JPS58224165 A JP S58224165A
Authority
JP
Japan
Prior art keywords
steel
differential pressure
chamber
transverse direction
electron beam
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10621782A
Other languages
Japanese (ja)
Other versions
JPH027394B2 (en
Inventor
Toshio Taguchi
田口 俊夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Heavy Industries Ltd
Nippon Steel Nisshin Co Ltd
Original Assignee
Mitsubishi Heavy Industries Ltd
Nisshin Steel Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Heavy Industries Ltd, Nisshin Steel Co Ltd filed Critical Mitsubishi Heavy Industries Ltd
Priority to JP10621782A priority Critical patent/JPS58224165A/en
Publication of JPS58224165A publication Critical patent/JPS58224165A/en
Publication of JPH027394B2 publication Critical patent/JPH027394B2/ja
Granted legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/562Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54Controlling or regulating the coating process
    • C23C14/541Heating or cooling of the substrates

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

PURPOSE:To make the temp. distribution in the transverse direction of a band steel uniform, by providing plural pieces of electron beam heaters in one of differential pressure chambers on an inlet side of a band steel or in a vacuum deposition chamber in the transverse direction of the band steel. CONSTITUTION:A band steel 1 is let off from an un-coiler 1' and is introduced through a pretreatment installation 2 and differential pressure chambers 3, 4, 5,- into a vapor deposition chamber 6. Plating metal is vapor deposited on the bottom surface of the steel 1 in the chamber 6, and the band steel is coiled on a recoiler 11 after it is passed through differential pressure chambers 8, 9,- and a post treatment installation 10. An electron beam heater 13 disposed with plural electron beam guns in the transverse direction of the steel 1 is equipped in a differential pressure chamber 12 on the inlet side of the steel 1 in this stage, and the outputs of the individual electron beams are controlled discretely while the steel 1 passes through the chamber 12 so that the temp. in the transverse direction of the steel 1 is made uniform. The uneven plating in the stage of vapor deposition is thus prevented.

Description

【発明の詳細な説明】 して施すだめの真空蒸着装置に関し、特に該銅帯の幅方
向の温度分布を均一にすることのできる上記装置に関す
る。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a vacuum evaporation apparatus for performing copper strips, and more particularly to the above-mentioned apparatus which can make the temperature distribution of the copper strip uniform in the width direction.

近年、鋼帯に連続的に亜鉛メッキ皮膜を形成する方法と
して、従来の溶融亜鉛浴法や電気メツキ法の外に、片面
のみのメッキに対する有利性から真空蒸着メッキ法が研
究されている。
In recent years, as a method for continuously forming a galvanized film on a steel strip, in addition to the conventional molten zinc bath method and electroplating method, research has been conducted on a vacuum evaporation plating method due to its advantage over plating only on one side.

第1図は工業的規模の真空蒸着メツキラインの説明図で
、1は銅帯、1′は素材コイルのアンコイラ、2は連続
通板に必要な前処理設備で、ウエルク、シャ、レヘラ、
ルーパ、前処理炉等によ多構成されている。5,4.5
・・・ は隔壁WおよびシールロールRにより構成され
る差圧室で、それぞれ図示省略の真空ポンプによシ吸引
されて差圧室3,4.5  ・・・・の順に圧力が低く
なっている。6は蒸着室で、図示省略の真空ポンプによ
り吸引されて通常1トール以下の中高真空雰囲気下に設
定される。7は該蒸着室6内の、銅帯1通過位置の下方
に設けられるメッキ金属の入った蒸発ルツボで、鋼帯1
の下面が該ルツボ7上を通過する間にメッキ金属が蒸着
される。
Figure 1 is an explanatory diagram of an industrial-scale vacuum evaporation plating line. 1 is a copper strip, 1' is an uncoiler for the raw material coil, and 2 is pretreatment equipment necessary for continuous sheet threading.
It is composed of a looper, pretreatment furnace, etc. 5,4.5
. . . is a differential pressure chamber composed of a partition wall W and a seal roll R, and the pressure is lowered in the order of differential pressure chambers 3, 4.5, . . . by suction by a vacuum pump (not shown), respectively. There is. Reference numeral 6 denotes a deposition chamber, which is suctioned by a vacuum pump (not shown) and set to a medium-high vacuum atmosphere of usually 1 Torr or less. Reference numeral 7 denotes an evaporation crucible containing plated metal, which is provided in the vapor deposition chamber 6 below the position where the copper strip 1 passes.
While the lower surface of the crucible 7 passes over the crucible 7, plating metal is deposited.

8、9・・・・は上記した差圧室4,5.6・・・・・
と同じ構成の差圧室で、8,9・・・・の順に圧力が高
くなっている。10は後処理設備で、レヘラ、ルーパ、
シャ等により構成されている。11はメッキ済み鋼帯1
のリコイラであり、図中の矢印は鋼帯1の進行方向を示
している。
8, 9... are the differential pressure chambers 4, 5, 6...
In the differential pressure chamber with the same configuration as , the pressure increases in the order of 8, 9, and so on. 10 is post-processing equipment, including rehera, roopa,
It is composed of Sha, etc. 11 is plated steel strip 1
The arrow in the figure indicates the direction of movement of the steel strip 1.

ところで、第1図に示すようなメツキラインにおいては
、各差圧室間には圧力差があるだめ、ンールロールR部
の隙間を通って高い圧力の室から低い圧力の室へ雰囲気
ガスが流れ、またソールロールR部では上下に一対とな
ったシールロール8間に鋼帯1が挟まれているため、銅
帯1の両端部の隙間を通って雰囲気ガスが流れる。
By the way, in the plating line as shown in Fig. 1, since there is a pressure difference between the differential pressure chambers, atmospheric gas flows from the high pressure chamber to the low pressure chamber through the gap in the round roll R section, and In the sole roll R section, since the steel strip 1 is sandwiched between a pair of upper and lower seal rolls 8, atmospheric gas flows through the gap between both ends of the copper strip 1.

従って、鋼帯1の両端がガス流によって冷却され、銅帯
10幅方向に温度分布が生じる。幅方向の温度分布があ
ると、蒸着時のメッキむらの原因となる。
Therefore, both ends of the steel strip 1 are cooled by the gas flow, and a temperature distribution occurs in the width direction of the copper strip 10. A temperature distribution in the width direction causes uneven plating during vapor deposition.

本発明は、このメッキむらの原因となる幅方向の温度分
布を解消するためになされたもので、銅帯の真空蒸着室
への入側差圧室のうちの少くとも一つの差圧室内、もし
くは真空蒸着室内に電子ビーム加熱装置を銅帯の幅方向
に複数個設けることによシ、銅帯の幅方向の温度分布を
均一にすることのできる真空蒸着装置に関するものであ
る。
The present invention has been made in order to eliminate the temperature distribution in the width direction that causes this uneven plating. Alternatively, the present invention relates to a vacuum evaporation apparatus that can make the temperature distribution in the width direction of the copper strip uniform by providing a plurality of electron beam heating devices in the width direction of the copper strip in the vacuum evaporation chamber.

) 以下、添付図面を参照して本発明装置を詳細に説明する
) Hereinafter, the apparatus of the present invention will be described in detail with reference to the accompanying drawings.

第2図は本発明装置の一実施態様例を示す図である。FIG. 2 is a diagram showing an embodiment of the apparatus of the present invention.

第2図中、第1図と同一符号は第1図と同一機能部品を
示し、12が本発明に係る電子ヒーム加熱装置を設けた
差圧室であり、該差圧室としては圧力が1ト一ル程度以
下のものが選ばれる。
In FIG. 2, the same reference numerals as in FIG. 1 indicate the same functional parts as in FIG. Those with a torque of about 1 to 1 or less are selected.

該差圧室12は、複数個の電子ヒームカンを鋼帯1の幅
方向に配置した電子ビーム加熱装置13を装備しており
、鋼帯1が該差圧室12を通過する間に、個々の電子ヒ
ームガンの出力を個別に制御し、これにより鋼帯1の幅
方向の温度を一様とする。
The differential pressure chamber 12 is equipped with an electron beam heating device 13 in which a plurality of electron beam cans are arranged in the width direction of the steel strip 1, and while the steel strip 1 passes through the differential pressure chamber 12, each individual The outputs of the electronic heat guns are individually controlled, thereby making the temperature of the steel strip 1 uniform in the width direction.

なお、電子ビーム加熱装置16は、蒸着室6内の蒸発ル
ツボ7の手前に設置してもよい。
Note that the electron beam heating device 16 may be installed in front of the evaporation crucible 7 in the deposition chamber 6.

本発明装置において、電子ビーム加熱装置を設ける差圧
室として圧力が1ト一ル程度以下のものを選択する理由
、あるいは蒸着室(前記したように圧力は通常1トール
以下)に電子ビーム加熱装置を設ける理由は、次の通り
である。
In the apparatus of the present invention, the reason why a pressure differential chamber in which the electron beam heating device is installed is selected to be one with a pressure of about 1 torr or less, or the reason why the pressure is about 1 torr or less is selected as the differential pressure chamber in which the electron beam heating device is installed, or the electron beam heating The reason for providing this is as follows.

スナわち、ンールロールR部でのガス流による鋼帯1端
部の温度降下は、雰囲気圧力が1トール以下になると急
激に少なくなり、このため圧力が1ト一ル程度以下の差
圧室において鋼帯1の幅方向の温度分布を均一とすれば
、それ以降の差圧室での鋼帯1端部の温度降下は無視し
得るので、幅方向に均一な温度の鋼帯1を蒸着室へ供給
することができるのである。このことから、蒸着室内の
蒸発ルツボの手前に電子ヒーム加熱装置を設けておくこ
とが、よシ好ましいことは言うまでもない。
In other words, the temperature drop at the end of the steel strip due to the gas flow in the R section of the roll roll decreases rapidly when the atmospheric pressure becomes 1 torr or less, so in a differential pressure chamber where the pressure is about 1 torr or less, If the temperature distribution in the width direction of the steel strip 1 is made uniform, the subsequent temperature drop at the end of the steel strip 1 in the differential pressure chamber can be ignored. It can be supplied to From this, it goes without saying that it is highly preferable to provide an electronic heat heating device in front of the evaporation crucible in the evaporation chamber.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は通常の真空蒸着装置を説明するだめの図、第2
図は本発明装置の一実施態様例を説明するための図であ
る。 復代理人  内 1)  明 復代理人  萩 原 亮 −
Figure 1 is a diagram for explaining a normal vacuum evaporation device, Figure 2
The figure is a diagram for explaining one embodiment of the apparatus of the present invention. Sub-agents 1) Meifuku agent Ryo Hagiwara -

Claims (1)

【特許請求の範囲】[Claims] 真空蒸着室の前後に複数の差圧室をそれぞれ配置してな
る連続真空蒸着装置において、銅帯の入側差圧室のうち
の少くとも一つの差圧室内、もしくは蒸着室内に電子ヒ
ーム加熱装置を銅帯の幅方向に複数個設けたことを特徴
とする真空蒸着装置。
In a continuous vacuum evaporation apparatus in which a plurality of differential pressure chambers are arranged before and after a vacuum evaporation chamber, an electronic beam heating device is provided in at least one of the differential pressure chambers on the entrance side of the copper strip or in the evaporation chamber. A vacuum evaporation device characterized in that a plurality of are provided in the width direction of a copper strip.
JP10621782A 1982-06-22 1982-06-22 Vacuum deposition device Granted JPS58224165A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10621782A JPS58224165A (en) 1982-06-22 1982-06-22 Vacuum deposition device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10621782A JPS58224165A (en) 1982-06-22 1982-06-22 Vacuum deposition device

Publications (2)

Publication Number Publication Date
JPS58224165A true JPS58224165A (en) 1983-12-26
JPH027394B2 JPH027394B2 (en) 1990-02-16

Family

ID=14427976

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10621782A Granted JPS58224165A (en) 1982-06-22 1982-06-22 Vacuum deposition device

Country Status (1)

Country Link
JP (1) JPS58224165A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6211173U (en) * 1985-07-04 1987-01-23
DE102010028777A1 (en) * 2010-05-07 2011-11-10 Von Ardenne Anlagentechnik Gmbh Removal of backcoat on substrate e.g. glass substrate, involves warming up surface area of edge of back of substrate by electron bombardment for evaporation of solitary particles

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6211173U (en) * 1985-07-04 1987-01-23
DE102010028777A1 (en) * 2010-05-07 2011-11-10 Von Ardenne Anlagentechnik Gmbh Removal of backcoat on substrate e.g. glass substrate, involves warming up surface area of edge of back of substrate by electron bombardment for evaporation of solitary particles
DE102010028777B4 (en) * 2010-05-07 2013-12-05 Von Ardenne Anlagentechnik Gmbh Method and apparatus for removing a backside coating on a substrate

Also Published As

Publication number Publication date
JPH027394B2 (en) 1990-02-16

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