JPH0735566B2 - Continuous vacuum deposition equipment - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to a continuous vacuum vapor deposition apparatus, and more particularly to a deposition amount control apparatus for metal vapor of the apparatus, and more particularly to a deposition amount distribution control apparatus. .

[Conventional technology]

A continuous vacuum deposition apparatus is used as a means for continuously plating a metal such as zinc on a substrate such as a steel strip.
The schematic structure of this conventional continuous vacuum vapor deposition apparatus will be described with reference to FIG.

In FIG. 5, 1 is a strip steel (vapor deposition substrate), 2 is a vacuum sealing device including a plurality of sealing chambers, 3 is a vapor deposition chamber, 4 is a winding roll that guides the structural steel 1 to pass through, and 5 is a melt. A metal (for example, zinc), 6 is its metal vapor, 7 is a bath of molten metal, 8 is a duct (channel) for guiding the metal vapor 6 generated in the bath 7 to the strip steel 1, 9 is a heater, 10 is a shutter, 11 is the opening / closing device (cylinder) of the shutter 10, 12 is the opening of the shutter 10, 13 is a metal melting furnace, 14 is a snorkel,
Reference numeral 15 is a pipe, 16 is a valve, and 17 is a vacuum pump. Z indicates the flow direction of the metal vapor 6.

In this apparatus, the vapor 6 of the molten metal 5 is generated under a vacuum condition, and the vapor 6 is guided from the bath 7 to the strip steel 1 through the duct 8.

The amount of metal vapor (evaporation amount) necessary for vapor deposition on the strip steel 1 is
The electric power of the heater 9 installed in the bathtub 7 and the shutter 10 installed at the outlet of the bathtub 7 are connected to, for example, an opening / closing device 11 such as a cylinder.
It can be controlled by opening and closing with and changing the area of the opening 12.

The molten metal 5 is supplied to the bath 7 by suction from a melting furnace 13 below the vapor deposition chamber 3 via a snorkel 14 due to a pressure difference.

The vapor deposition chamber 3 is connected to a vacuum pump 17 via a pipe 15 and a valve 16, and is usually kept at a low pressure by an inert gas such as nitrogen (N ₂ ) due to the saturated vapor pressure of the molten metal 5.

Since the conventional continuous vacuum vapor deposition equipment has the above configuration, during operation, the vapor deposition rate (unit area) set based on the manufacturing instruction (steel type, strip width, strip thickness, stripping speed, target vapor deposition amount, etc.) , The amount of vapor deposition per unit time), the pressure of the vapor deposition chamber 3 is set, and the power of the heater 9 and the opening of the shutter 10 are adjusted so that the desired vapor deposition amount of the vapor deposition metal is achieved. The vapor deposition amount, that is, the vapor deposition film thickness is controlled to a target value.

[Problems to be solved by the invention]

However, in the conventional device, the opening of the shutter 10 is
Since the flow of the metal vapor 6 in the duct 8 after passing through 12 changes, the film thickness distribution of the vapor-deposited metal on the surface of the steel strip 1 is not always constant, and especially regarding the distribution in the plate width direction, In the charts showing the measured data in the actual machine of Fig. 3 and Fig. 4,
As shown by the dotted lines a ₁ and a ₂ , variations occur, and there is a problem that the quality of the plated product deteriorates and the yield of evaporated metal decreases due to uneven deposition. In particular, when the shutter opening was large, it was nearly uniform, but when the shutter opening was small, there was a large variation in the film thickness distribution.

[Object of the Invention]

In view of such a problem, the present invention aims to provide a continuous vacuum vapor deposition apparatus capable of constantly controlling the film thickness distribution to improve the quality of a plated product and improving the yield of vapor deposited metal to reduce the cost. Is.

[Means for solving problems]

In order to solve the above problems, the present invention has a vacuum vapor deposition apparatus configured to equip a flow straightening plate made of a perforated plate in the surface of a shutter to make the flow of metal vapor uniform and to make the vapor deposition film thickness distribution uniform. It is a thing.

That is, the present invention is a continuous system comprising a bath for evaporating molten metal under vacuum conditions, a duct for guiding the metal vapor to a vapor deposition substrate, and a shutter for freely controlling the opening area of the outlet of the bath. In the vacuum vapor deposition apparatus, a straightening-type rectifying plate made of a perforated plate is attached within the surface of the shutter, which is a continuous vacuum vapor deposition apparatus.

[Action]

By providing a straightening vane that is a perforated plate in the surface of the shutter, the flow of metal vapor in the duct is made uniform, and as a result,
The vapor deposition film thickness distribution on the vapor deposition substrate can be made uniform.

〔Example〕

 Hereinafter, the present invention will be specifically described with reference to the drawings.

FIG. 1 is a schematic configuration diagram of a vapor deposition chamber and an evaporation tank of a continuous vacuum vapor deposition apparatus according to an embodiment of the present invention, and FIG. 2 is A- in FIG.
The front view of the straightening vane by A arrow is shown. In the figure, the same members as those of the conventional apparatus (FIG. 5) are designated by the same reference numerals, and the overlapping detailed description of the configuration will be omitted.

In FIG. 1, the device of the present invention is one or more (one in the case of the example) in the surface of the shutter in the conventional device (FIG. 5).
In order to make the vapor deposition film thickness distribution uniform by attaching a flow straightening plate 20 made of a perforated plate as shown in FIG. 2 which will be described later and uniformly straightening the flow of the metal vapor 6 in the duct 8. It is what

Here, regarding the arrangement and the number of holes of the rectifying plate 20,
The present inventors have determined the results of various experiments, and here, the case of one sheet will be described. The straightening plate 20
Among them, the bottom side of the duct 8 has many holes as shown in FIG.
21 are pierced at an almost equal pitch, while holes on the ceiling surface side of the duct 8
The array and pitch of 21 are not opened every other row, and the opening ratio on the ceiling side is smaller than that on the bottom side. By forming the holes in this way, the distribution of the vapor deposition film thickness is shown in FIG. As shown by the solid lines b ₁ and b ₂ in Fig. 4, the distribution curve of the conventional device
It was proved in the actual machine that good uniformity was obtained compared to a ₁ and a ₂ . Fig. 3 shows the target deposition thickness of 30μ,
The figure shows the measured value of the film thickness distribution in the plate width direction for 50μ.

Although the case where one rectifying plate 20 is used has been described above, two or more rectifying plates described above may be used, and similarly, one rectifying plate may have a thickness of two. Good.

Further, in the above description, the case where the holes of the straightening vane are formed nonuniformly has been described, but the case where the holes are uniformly formed over the entire straightening vane exhibits substantially the same effect.

〔The invention's effect〕

As described in detail above, in the device of the present invention, the metal vapor (Zn, etc.) 6 is a porous plate having uniform or non-uniform aperture pitches in the shutter surface for guiding the vapor to the vapor deposition surface of the vapor deposition substrate (band steel, etc.). By attaching at least one straightening plate 20 to uniformly rectify the turbulence of the flow of the metal vapor 6 in the duct 8, it becomes possible to make the vapor deposition film thickness uniform, improve the quality of the metal product, and vapor metal. It was possible to improve the yield of (Zn, etc.) 5 and reduce the cost.

[Brief description of drawings]

1 is a schematic configuration diagram of a continuous vacuum vapor deposition apparatus according to an embodiment of the present invention, FIG. 2 is a front view of a current plate taken along the line AA in FIG. 1, FIG. FIG. 4 is a table showing measurement data of a vapor deposition film thickness distribution curve in the plate width direction in an actual machine, and FIG. 5 is a schematic configuration diagram of a conventional continuous vacuum vapor deposition apparatus.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Toshio Taguchi 4-6-22 Kannon Shinmachi, Nishi-ku, Hiroshima City, Hiroshima Prefecture Mitsubishi Heavy Industries, Ltd. Hiroshima Research Laboratory (72) Inventor Hiratsue Etsuro 4-chome, Kannon Shinmachi, Nishi-ku, Hiroshima City, Hiroshima Prefecture 6-22 No. 22 Hiroshima Research Institute, Mitsubishi Heavy Industries Ltd. (72) Inventor Takuya Aiko 5 Ishizushi Nishimachi, Sakai City, Osaka Prefecture Nisshin Steel Co., Ltd. Hanshin Works (72) Norio Tsukiji 5 Ishizu Nishimachi, Sakai City, Osaka Prefecture Hanshin Works, Ltd. (56) References JP-A-63-192859 (JP, A)

Claims (1)

[Claims] 1. A continuous system comprising a bath for evaporating molten metal under vacuum conditions, a duct for guiding the vapor of the metal to a vapor deposition substrate, and a shutter for freely controlling the opening area of the outlet of the bath. In the vacuum vapor deposition apparatus, a straightening-type vacuum vapor deposition apparatus, wherein a straightening plate made of a perforated plate is attached within the surface of the shutter.