JPS58221841A - Photosetting resin composition - Google Patents

Photosetting resin composition

Info

Publication number
JPS58221841A
JPS58221841A JP57103977A JP10397782A JPS58221841A JP S58221841 A JPS58221841 A JP S58221841A JP 57103977 A JP57103977 A JP 57103977A JP 10397782 A JP10397782 A JP 10397782A JP S58221841 A JPS58221841 A JP S58221841A
Authority
JP
Japan
Prior art keywords
weight
methacrylate
acrylate
synthesis example
acid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57103977A
Other languages
Japanese (ja)
Other versions
JPH0336211B2 (en
Inventor
Minoru Yokoshima
実 横島
Kazumitsu Nawata
縄田 一允
Tetsuo Okubo
大久保 哲男
Hideaki Takahashi
秀明 高橋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Kayaku Co Ltd
Original Assignee
Nippon Kayaku Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Kayaku Co Ltd filed Critical Nippon Kayaku Co Ltd
Priority to JP57103977A priority Critical patent/JPS58221841A/en
Publication of JPS58221841A publication Critical patent/JPS58221841A/en
Publication of JPH0336211B2 publication Critical patent/JPH0336211B2/ja
Granted legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Polymerisation Methods In General (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Macromonomer-Based Addition Polymer (AREA)

Abstract

PURPOSE:To obtain a composition suitable especially for use as ink for an etching resist, by blending a specified polymer having ethylenic unsatd. groups with a hydroxyalkyl acrylic hemiester of a polybasic acid, a vinyl monomer and a photopolymn. initiator. CONSTITUTION:A specified polymer represented by formula I (where R1 is CH3 or H; R2 is CH3, C2H5 or H; l is 0, 1 or 2; m is 1-3; and n is 6-8) is obtd. by reacting a compound represented by formula II (where R1 and R2 are said R1 and R2) with a styrene-maleic acid copolymer having 10-50mol% maleic acid content in general. The compound represented by formula II is obtd. by the addition reaction of hydroxyalkyl acrylate r methacrylate with epsilon-caprolactone.

Description

【発明の詳細な説明】 本発明は光、特に紫外線硬化型樹脂組成物に関するもの
で、プリント配線基板製造のためのエツチングレジスト
用インキとして特に好適な紫外線硬化型樹脂組成物に関
するものである。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a light, particularly an ultraviolet curable resin composition, and relates to an ultraviolet curable resin composition which is particularly suitable as an etching resist ink for manufacturing printed wiring boards.

従来、紫外線硬化型のエツチングレジスト用インキにつ
いて特開昭51−2503、特開昭57−13444等
に示されている。すなわち耐酸性と塗膜硬度の付与のた
めにポリエステル、アルカリにより膜の除去性の付与の
ためにヒドロキシアルキルアクリレート(又はメタクリ
レート)や、2〜36個の炭素原子を含むカルボン酸あ
るいは多塩基酸のヒドロキシアルキルアクリレート(又
はメタクリレート〕半エステル化物なングレジスト用イ
ンキは、高速硬化、無公害、無加熱、高信頼性といった
優れた性能を持っている事から、その使用量が増加して
いる。
Conventionally, ultraviolet curing inks for etching resists have been disclosed in Japanese Patent Laid-Open Nos. 51-2503 and 1982-13444. In other words, polyester is used to impart acid resistance and coating hardness, hydroxyalkyl acrylate (or methacrylate) is used to impart removability to the film using an alkali, and carboxylic acid or polybasic acid containing 2 to 36 carbon atoms is used. Resist inks made of hydroxyalkyl acrylate (or methacrylate) semi-esters have excellent properties such as fast curing, no pollution, no heating, and high reliability, so their usage is increasing.

ここ数年来、電気機器、電子機器の小型化、高性能化が
急速に進展し、プリント配線基板の配線の細線化、かつ
より高い信頼性が要請されており、エツチングレジスト
用インキに対してもより細い配線パターンのエツチング
加工の可能なもの、かつより高い信頼性が望まれている
Over the past few years, electrical and electronic devices have rapidly become smaller and more sophisticated, and there is a demand for thinner and higher reliability wiring on printed wiring boards. There is a need for a device that can be etched into thinner wiring patterns and has higher reliability.

従来の紫外線硬化型エツチングレジスト用インキは、エ
ツチングレジストとして優れたアルカリ剥離性を有し、
しかも塗膜硬度が鉛筆硬度でHB以上のものが得られて
いるが、プリント配線基板の配線が0.21以下の細線
のエツチング加工を行うと、塗膜がはがれたり、塗膜と
プリント配線基板との間に、エツチング液、たとえば、
塩化第2鉄水溶液、塩化第2銅水溶液、過硫酸アンモニ
ウム水溶液、硝酸水溶液等の液が入りこみ、プリント配
線板回路の断線不良を発生し、配線の細線化、かつより
高い信頼性の要求に応じ難い実情にある。
Conventional ultraviolet curable etching resist inks have excellent alkaline removability as etching resists,
Moreover, the paint film has a pencil hardness of HB or higher, but if the wiring of the printed wiring board is etched with fine wires of 0.21 or less, the paint film may peel off, or the paint film and the printed wiring board An etching solution, for example,
Liquids such as ferric chloride aqueous solution, cupric chloride aqueous solution, ammonium persulfate aqueous solution, nitric acid aqueous solution, etc. can enter, causing disconnection defects in printed wiring board circuits, making it difficult to meet demands for thinner wiring and higher reliability. That's the reality.

本発明者等は、かかる要求を満たすべく鋭意研究を行っ
た結果、従来の紫外線硬化型エツチングレジスト用イン
キとほぼ同等の塗膜の希アルカリによる剥離性および塗
膜硬度が鉛筆硬度でH以上を有し、しかもプリント配線
基板が0.1%ノ細線パターンのエツチング加工に十分
に耐えられる新規な光硬化型樹脂組成物を見い出した。
The inventors of the present invention have conducted intensive research to meet such requirements, and have found that the releasability of the paint film with dilute alkali and the hardness of the paint film are approximately the same as those of conventional ultraviolet curable etching resist inks, and the hardness of the paint film is H or higher on a pencil hardness scale. We have discovered a new photocurable resin composition which has the same characteristics as the above, and which also allows the printed wiring board to sufficiently withstand etching of a 0.1% fine line pattern.

本発明におけるエチレン性不飽和基を有する重合体は一
般式(1)でしめされる化合物とスチレンと無水マレイ
ン酸との共重合体(通常無水マレイン酸含有量が10〜
50モル%)を反応させて得られる一般式叩の重合体で
あc1 □ (但し、式叩中の各記号は、前記式〔I〕と    1
同様である。m:1〜3の数、n:6〜8の数)前記一
般式CIIでしめされる化合物は、ヒドロキシアルキル
アクリレート(又はメタクリレ−))又ハ、ヒドロキシ
アルキルアクリレート(又はメタクリレート)とニブシ
ロンカプロラクトンの付加反応によって得られる。ヒド
ロキシアルキルアクリレート(又はメタクリレート)と
しては、2−ヒドロキシエチルアクリレート、2−ヒド
ロキシプロピルアクリレート、2−ヒドロキシブチルア
クリレート並びに、これらに対応するメタクリレートな
どが用いられる。なお、前記一般式III)とスチレン
と無水マレイン酸との共重合体との反応生成物の合成例
を次に示す。
The polymer having an ethylenically unsaturated group in the present invention is a copolymer of the compound represented by the general formula (1), styrene, and maleic anhydride (usually the maleic anhydride content is 10 to 10%).
It is a polymer obtained by reacting the general formula c1 □ (however, each symbol in the formula is the same as the above formula [I] and 1
The same is true. (m: number from 1 to 3, n: number from 6 to 8) The compound represented by the general formula CII is hydroxyalkyl acrylate (or methacrylate) or c) hydroxyalkyl acrylate (or methacrylate) and nibsilone caprolactone. obtained by the addition reaction of As the hydroxyalkyl acrylate (or methacrylate), 2-hydroxyethyl acrylate, 2-hydroxypropyl acrylate, 2-hydroxybutyl acrylate, and the corresponding methacrylates are used. An example of the synthesis of a reaction product of the general formula III) and a copolymer of styrene and maleic anhydride is shown below.

エチレン性不飽和基を有する重合体の合成例:合成例1
゜ 三ツロフラスコに攪拌機、温度計、還流冷却器を備えた
、1!反応器に下記構造の物質ダイセル化学工業社製) (商品名: PJacceJ FMI 244.1?とスチレン/無水マレイン酸共重合体(米
国ARCO/chemical company製、商
品名 SMAレジン、SMA−1000)202.0P
C,酸価480)とハイドロキノンモノメチルエーテル
0.223g−を仕込み90〜100Cで4時間反応さ
せ酸価合成例2 合成例1で用いた同一反応器に2−ヒドロキシエチルア
クリレート116.17とスチレン/無水マレイン酸共
重合体(米国A几CO/ chemical comp
−any製、商品名S M A vジン、SMA−10
00)202.05’(酸価480)とハイドロキノン
モノメチルエーテル0.159g−を仕込み90〜10
0Cで15時間反応させ、酸価174.0の下記構造u
’(;M2uj’12−u−−t、、−t−n=t−n
2本発明に用いられる第2坂分である多塩基酸(又は、
その無水物)のヒドロキシアルキルアクリレート(又は
メタクリレート)半エステル化物とは多塩基酸(又はそ
の無水物)とヒドロキシアルキルアクリレート(又はメ
タクリレート)との等モル反応生成物として得られる。
Synthesis example of a polymer having an ethylenically unsaturated group: Synthesis example 1
゜Mitsuro flask equipped with a stirrer, thermometer, and reflux condenser, 1! In the reactor, use materials with the following structure (manufactured by Daicel Chemical Industries, Ltd.) (product name: PJacceJ FMI 244.1?) and styrene/maleic anhydride copolymer (manufactured by ARCO/chemical company in the United States, product name SMA resin, SMA-1000) 202 .0P
C, acid value 480) and 0.223 g of hydroquinone monomethyl ether were charged and reacted at 90 to 100 C for 4 hours. Acid value Synthesis Example 2 In the same reactor used in Synthesis Example 1, 2-hydroxyethyl acrylate 116.17 and styrene Maleic anhydride copolymer (USA CO/chemical comp
-manufactured by any, product name: SM Av Gin, SMA-10
00) Prepare 202.05' (acid value 480) and 0.159 g of hydroquinone monomethyl ether, 90-10
React at 0C for 15 hours to form the following structure u with an acid value of 174.0.
'(;M2uj'12-u--t, -t-n=t-n
2 The polybasic acid (or
A hydroxyalkyl acrylate (or methacrylate) half-ester of a polybasic acid (or its anhydride) is obtained as an equimolar reaction product of a polybasic acid (or its anhydride) and a hydroxyalkyl acrylate (or methacrylate).

多塩基酸(又はその無水物)としては、アジピン酸、セ
パチン酸、アゼライン酸、ドデカンジカルボン酸、ダイ
マー酸、無水コハク酸、ドデセニル無水コハク酸、無水
マレイン酸、フマル酸、イタコン酸、テレフタル酸、シ
トラコン酸、無水フタル酸、イソフタル酸、テレフタル
酸、テトラヒドロ無水フタル酸、ヘキサヒドロ無水フタ
ル酸、メチルテトラヒドロ無水フタル酸、ヘキサクロル
無水フタル酸、無水トリメリット酸、無水ピロメリット
酸、メチル・エンドメチレンΦテトラヒドロ無水フタル
酸、エンド・メチレン・テトラヒドロ無水フタル酸など
が用いられ、又ヒドロキシアルキル基を有するアクリレ
ートまたはメタクリレートとしては、ヒドロキシメチル
アクリレート、2−ヒドロキシエチルアクリか一ト、2
−ヒドロキシプロピルアクリレート、3−ヒドロキシプ
ロピルアクリレート、2−ヒドロキシブチルアクリレー
ト、ジエチレングリコールモノアクリレート、グリセリ
ンジアクリレート、ペンタエリスリトールトリアクリレ
ート並びにこれら対応するメタクリレートなどが用いら
れる。次に多塩基酸のヒドロキシアルキルアクリレート
(又はメタクリレート)半エステル化物の合成例を示す
。−多塩基酸のヒドロキシアルキルアクリレート(又は
メタクリレート)半エステル化物の合成例二合成例3゜ 合成例1で用いた同一反応器に2−ヒドロキシエチルメ
タクリレート130.0g−と無水フタル酸148、I
jil−とハイドロキノンモノメチルエーテル0.13
9.5’を仕込み90〜Ioocで17時間反応させ酸
価205.1の半エステル化物を得た。
Examples of polybasic acids (or anhydrides thereof) include adipic acid, sepatic acid, azelaic acid, dodecane dicarboxylic acid, dimer acid, succinic anhydride, dodecenyl succinic anhydride, maleic anhydride, fumaric acid, itaconic acid, terephthalic acid, Citraconic acid, phthalic anhydride, isophthalic acid, terephthalic acid, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, hexachlorophthalic anhydride, trimellitic anhydride, pyromellitic anhydride, methyl endomethylene Φ tetrahydro Phthalic anhydride, endo-methylene-tetrahydrophthalic anhydride, etc. are used, and as acrylates or methacrylates having a hydroxyalkyl group, hydroxymethyl acrylate, 2-hydroxyethyl acrylate, 2-hydroxyethyl acrylate,
-Hydroxypropyl acrylate, 3-hydroxypropyl acrylate, 2-hydroxybutyl acrylate, diethylene glycol monoacrylate, glycerin diacrylate, pentaerythritol triacrylate, and their corresponding methacrylates are used. Next, a synthesis example of a hydroxyalkyl acrylate (or methacrylate) half-ester of a polybasic acid will be shown. - Synthesis example 2 of hydroxyalkyl acrylate (or methacrylate) half-ester of polybasic acid Synthesis example 3゜ In the same reactor used in synthesis example 1, 130.0 g of 2-hydroxyethyl methacrylate and 148 g of phthalic anhydride, I
jil- and hydroquinone monomethyl ether 0.13
9.5' was charged and reacted for 17 hours at 90 to Iooc to obtain a half-esterified product with an acid value of 205.1.

エチルア、クリレート116.1Li−と無水フタル酸
148.1f!−とハイドロキノンモノメチルエーテル
0.132Pを仕込み90〜]OOt;’で19時間反
応させ酸価2]6.7の半エステル化物を得た。
Ethyl urea, acrylate 116.1Li- and phthalic anhydride 148.1f! - and hydroquinone monomethyl ether 0.132P were charged and reacted at 90~]OOt;' for 19 hours to obtain a half-esterified product with an acid value of 2]6.7.

合成例5゜ 合成例1で用いた同一反応器に2−ヒドロキシエチルア
クリレート116.19−とヘキサヒドロ無水フタル酸
1541とハイドロキノンモノメチルエーテルO,]3
5Pを仕込み90〜100Cで17時間反応させ酸価2
11.9の半エステル化物を得た。
Synthesis Example 5゜In the same reactor used in Synthesis Example 1, 2-hydroxyethyl acrylate 116.19-, hexahydrophthalic anhydride 1541, and hydroquinone monomethyl ether O,]3
5P was prepared and reacted at 90 to 100C for 17 hours to reach an acid value of 2.
A half-esterified product of 11.9 was obtained.

合成例6゜ 合成例1で用いた同一反応器に2−ヒドロキシエチルア
クリレート116.15’とメチルエンドメチレンテト
ラヒドロ無水フタル酸178.29−とハイドロキノン
モノメチルエーテル0.I47.gLを仕込み9o−1
oocで29時間反応させ酸価194.5の半エステル
化物を得た。
Synthesis Example 6 Into the same reactor used in Synthesis Example 1, 116.15' of 2-hydroxyethyl acrylate, 178.29' of methylendomethylenetetrahydrophthalic anhydride, and 0.0% of hydroquinone monomethyl ether were added. I47. Prepare gL 9o-1
A half-esterified product having an acid value of 194.5 was obtained by reacting with OOC for 29 hours.

本発明におけるエチレン性不飽和二重結合を有するビニ
ルモノマーとしては、各種のアクリル酸エステル類(又
は、メタクリル酸エステル類)があり、例えば、メトキ
シエチルアクリレート(又はメタクリレート)、エトキ
シエチルアクリレート(又はメタクリレート)、テトラ
ヒドロフルフリルアクリレート(又はメタクリレート)
、ステアリルアクリレート(又はメタクリレート)、フ
ェノキシエチルアクリレート(又はメタクリレート)、
2−ヒドロキシエチルアクリレート(又はメタクリレー
ト)、2−ヒドロキシエチルアクリレートのニブシロン
カプロラクトン変成物(又はメタクリレートのニブシロ
ンカプロラクトン変成物)、2−ヒドロキシプロピルア
クリレート(又はメタクリレート)、2−ヒドロキシプ
ロピルアクリレートのニブシロンカプロラクトン変成物
(又はメタクリレートのニブシロンカプロラクトン変成
物)、ノニルフェノキシエチルアクリレート(又はメタ
クリレート)、ポリエチレングリコールジアクリレート
(又はメタクリレート)、ポリプロピレングリコールジ
アクリレート(又はメタクリレート)、1.6−ヘキサ
ンジオールジアクリレート(又はメタクリレート)、ト
リメチロールプロパントリアクリレート(又はメタクリ
レート)、ヒドロキシピバリン酸ネオペンチルグリコー
ルジアクリレート(又はメタクリレート)、ジペンタエ
リスリトールへキサアクリレートなどがある。
The vinyl monomer having an ethylenically unsaturated double bond in the present invention includes various acrylic esters (or methacrylic esters), such as methoxyethyl acrylate (or methacrylate), ethoxyethyl acrylate (or methacrylate) ), tetrahydrofurfuryl acrylate (or methacrylate)
, stearyl acrylate (or methacrylate), phenoxyethyl acrylate (or methacrylate),
2-hydroxyethyl acrylate (or methacrylate), nibsilone caprolactone modified product of 2-hydroxyethyl acrylate (or nibsilone caprolactone modified product of methacrylate), 2-hydroxypropyl acrylate (or methacrylate), nibsilone of 2-hydroxypropyl acrylate caprolactone modified product (or nibsilone caprolactone modified product of methacrylate), nonylphenoxyethyl acrylate (or methacrylate), polyethylene glycol diacrylate (or methacrylate), polypropylene glycol diacrylate (or methacrylate), 1,6-hexanediol diacrylate ( or methacrylate), trimethylolpropane triacrylate (or methacrylate), hydroxypivalate neopentyl glycol diacrylate (or methacrylate), dipentaerythritol hexaacrylate, and the like.

次に、本発明で用いる光重合開始剤は、たとえばジアセ
チル、ベンゾイン、アシロインエーテル類および芳香族
ケトンおよびアルデヒド類を包含する、公知の光重合開
始剤の何れかとすることができる。適当な光開始剤は、
たとえば、チバガイギー社から人手することができるベ
ンジルジメチルケタール(商品名、イルガキュアー65
1)である。本発明の紫外線硬化型樹脂組成物には、本
発明の組成物の外に、必要に応じて重合禁止剤、増粘剤
、レベリング剤、流動性改良剤、つや消し剤、可塑剤、
充填剤、顔料ないしは染料等の着色剤並びにその他の助
剤類を併用することができる。
Next, the photoinitiator used in the present invention can be any of the known photoinitiators including, for example, diacetyl, benzoin, acyloin ethers, and aromatic ketones and aldehydes. A suitable photoinitiator is
For example, benzyl dimethyl ketal (trade name, Irgacure 65), which can be obtained manually from Ciba-Geigy,
1). In addition to the composition of the present invention, the ultraviolet curable resin composition of the present invention may optionally contain a polymerization inhibitor, a thickener, a leveling agent, a fluidity improver, a matting agent, a plasticizer,
Fillers, coloring agents such as pigments or dyes, and other auxiliary agents can be used in combination.

次に上記内容を具体的に参考例と実施例を掲げて説明す
る。
Next, the above content will be specifically explained by citing reference examples and working examples.

参考例1゜ 三ツロフラスコに攪拌機、温度計、コンデンサー付水分
離器を備えた1!反応器にプロピレングリコール80g
−(1,05モル)とイソフタル酸25P(0,15モ
ル)と無水マレイン酸99p(0,85モル)とを仕込
み、N2ガス雰囲気中50〜200Cで18時間、反応
させて得られた軟化点60.5C,酸価53のポリエス
テルを12.0重量%、合成例30半エステル化物を3
’ 5.1重量%、2−ヒドロキシエチルアクリレート
10.0重量%、トリメチロールプロパントリアクリレ
ート(エチレン性不飽和結合を有するビニルモノマー)
を2.0重量%、硫酸バリウム(充填剤)33.4重量
%、ベンジルジメチルケタール(光重合開始剤)5.0
重ft%、モダフロー(モンサンド社製のレベリング剤
) 2.0重量%、シアニングリーン(有機顔料)0.
5重量%とからなる組成物を70〜80Cで均一に混合
した後、三本ロール(■弁上製作所製)で十分に混練し
たものを、シルクスクリーンに0.1.0.15.0.
2.0.3.0.8. 1.0 mm巾を5本ずつもつ
パターンを用いて、スクリーン印刷法によりプリント配
線板の銅箔上に印刷し、紫外線で硬化した所、塗膜の硬
さが鉛筆硬度で2Hの試料が得られた。この試料を塩化
第2銅エツチング液に50Cで30分間処理した所、0
.1と0.15朋巾の細線部に塗膜のはがれを生じた。
Reference example 1゜A Mitsuro flask equipped with a stirrer, a thermometer, and a water separator with a condenser! 80g of propylene glycol in the reactor
- (1.05 mol), isophthalic acid 25P (0.15 mol), and maleic anhydride 99p (0.85 mol) and reacted for 18 hours at 50 to 200 C in a N2 gas atmosphere. 12.0% by weight of polyester with a point of 60.5C and an acid value of 53, and 3% of the half-esterified product of Synthesis Example 30.
' 5.1% by weight, 2-hydroxyethyl acrylate 10.0% by weight, trimethylolpropane triacrylate (vinyl monomer with ethylenically unsaturated bond)
2.0% by weight, barium sulfate (filler) 33.4% by weight, benzyl dimethyl ketal (photopolymerization initiator) 5.0%
ft% by weight, Modaflow (leveling agent manufactured by Monsando) 2.0% by weight, cyanine green (organic pigment) 0.
After uniformly mixing a composition consisting of 5% by weight at 70 to 80C, the mixture was sufficiently kneaded with a three-roll roll (manufactured by Bengami Seisakusho) and was coated on a silk screen with 0.1.0.15.0.
2.0.3.0.8. Using a pattern with 5 lines each having a width of 1.0 mm, it was printed on a copper foil of a printed wiring board using the screen printing method, and when cured with ultraviolet light, a sample with a hardness of the paint film of 2H on a pencil hardness scale was obtained. It was done. When this sample was treated with cupric chloride etching solution at 50C for 30 minutes, 0.
.. The coating film peeled off at the thin line portions of 1 and 0.15 mm.

塗膜を55tZ’の3%水酸化ナトリウム水溶液で剥離
した所、9秒で剥離した。
The coating film was peeled off in 9 seconds with a 3% aqueous sodium hydroxide solution of 55tZ'.

参考例2゜ 参考例1と同じポリエステルを12.0重量%、2−ヒ
ドロキシエチルアクリレートを2.6重i%、1.6−
ヘキサンシオールジアクリレー)10.5重量%、合成
例4の半エステル化物30.1重量%、ベンジルジメチ
ルケタール50重量%、硫酸バリウム28.0重量%、
モダフロー1.2重量%、メチルバイオレット1.0重
量%とからなる組成物を70〜80Cで攪拌し均一に混
合した後三本ロール(■弁上製作所製)で十分に混練均
一化した。
Reference Example 2゜ 12.0% by weight of the same polyester as Reference Example 1, 2.6% by weight of 2-hydroxyethyl acrylate, 1.6-
hexanethiol diacrylate) 10.5% by weight, half-esterified product of Synthesis Example 4 30.1% by weight, benzyl dimethyl ketal 50% by weight, barium sulfate 28.0% by weight,
A composition consisting of 1.2% by weight of Modaflow and 1.0% by weight of methyl violet was stirred at 70 to 80C to mix uniformly, and then thoroughly kneaded and homogenized using three rolls (manufactured by Bengami Seisakusho).

以下参考例1と同様にスクリーン印刷法によりプリント
配線板の銅箔上に印刷し、紫外線で硬化した所、塗膜の
硬さが鉛筆硬度で2Hの試料が得られた。この試料を塩
化第2鉄エツチング液に5゜Cで30分間処理した所、
O,lと0.15 mm巾の細線部に塗膜のはがれを生
じた。塗膜を55Cの3%水酸化ナトリウム水溶液で剥
離した所11秒で剥離した。
The following sample was printed on a copper foil of a printed wiring board by the screen printing method in the same manner as in Reference Example 1, and cured with ultraviolet rays, resulting in a sample having a pencil hardness of 2H. When this sample was treated with ferric chloride etching solution at 5°C for 30 minutes,
Peeling of the coating occurred at O, L and thin line parts with a width of 0.15 mm. The coating film was peeled off in 11 seconds using a 3% aqueous solution of 55C sodium hydroxide.

実施例1゜ 合成例10重合体20.0重量%、合成例6の半エステ
ル化物393重量%、トリメチロールプロパントリアク
リレート40重量%、ノニルフェノキシエチルアクリレ
ート8.5重量%、ベンジルジメチルケタール(光重合
開始剤)50重量%、硫酸バリウム(充填剤)18.5
重量%、モダフロー(モンサント社製レベリング剤)1
.5重量%、シアニングリーン(有機顔料)1.0重量
%からなる組成物を70〜80Uで均一に混合した後、
三本ロール(■弁上製作所製〕で十分に混練したものを
、シルクスクリーンに0.1 、0.15.0.2.o
、3゜0.8.1.0 mm巾を5本ずつもつパターン
を用いてスクリーン印刷法により、プリント配線板の銅
箔上に印刷し、紫外線で硬化した所、塗膜の硬さが鉛筆
硬度で3Hの試料が得られた。この試料を塩化第2銅エ
ツチング液に500で30分間処理した所、0.1〜1
.0朋巾すべての塗膜の状態にまったく異常がなかった
。塗膜を55Cの3%水酸化ナトリウム水溶液で剥離し
た所7秒で剥離した。
Example 1゜Synthesis Example 10 20.0% by weight of the polymer, 393% by weight of the half-esterified product of Synthesis Example 6, 40% by weight of trimethylolpropane triacrylate, 8.5% by weight of nonylphenoxyethyl acrylate, benzyl dimethyl ketal (light Polymerization initiator) 50% by weight, barium sulfate (filler) 18.5
Weight %, Modaflow (Leveling agent manufactured by Monsanto) 1
.. After uniformly mixing 70 to 80 U of a composition consisting of 5% by weight and 1.0% by weight of cyanine green (organic pigment),
Thoroughly knead with three rolls (manufactured by Bengami Seisakusho) and apply 0.1, 0.15, 0.2.o to the silk screen.
, 3゜0.8.1.0 mm wide pattern with 5 lines each was printed on the copper foil of a printed wiring board by screen printing method, and when cured with ultraviolet rays, the hardness of the coating film was that of a pencil. A sample with a hardness of 3H was obtained. When this sample was treated with cupric chloride etching solution at 500 for 30 minutes, the results were 0.1 to 1.
.. There was no abnormality in the condition of all coating films. The coating film was peeled off with a 3% sodium hydroxide aqueous solution of 55C, and the film was peeled off in 7 seconds.

実施例2゜ 合成例10重合体12.2重量%、合成例30半エステ
ル化物43.4重量%、2−ヒドロキシエチルメタクリ
レート3.4重量%、ノニルフェノキシエチルアクリレ
−)10.3重量%、ベンジルジメチルケタール5.0
重量%、硫酸バリウム282重量%、モダフロー1.5
重量%、シャニングリーン1.0重量%からなる組成物
を実施例1と同様に混線、印刷、硬化した所、塗膜の硬
さが鉛筆硬度で8Hの試料が得られた。この試料を塩化
第2銅エツチング液に50Cで30分間処理した所、0
.1〜1.0mm巾すべての塗膜の状態にまったく異常
がなかった。塗膜を55Cの3%水酸化す) IJウム
水溶液で剥離した所2秒で剥離した。
Example 2゜Synthesis Example 10 Polymer 12.2% by weight, Synthesis Example 30 half-esterified product 43.4% by weight, 2-hydroxyethyl methacrylate 3.4%, nonylphenoxyethyl acrylate) 10.3% by weight , benzyl dimethyl ketal 5.0
% by weight, barium sulfate 282% by weight, Modaflow 1.5
When a composition consisting of 1.0% by weight of Shanin Green was mixed, printed, and cured in the same manner as in Example 1, a sample with a coating film hardness of 8H on a pencil hardness was obtained. When this sample was treated with cupric chloride etching solution at 50C for 30 minutes, 0.
.. There was no abnormality in the condition of the coating film over a width of 1 to 1.0 mm. When the coating film was removed with a 3% 55C hydroxide solution, it was removed in 2 seconds.

実施例3゜ 合成例20重合体22.0重量%、合成例50半エステ
ル化物を40.0重量%、トリメチロールプロパントリ
アクリレ−)9.0重量の、ノニルフェノキシエチルア
クリレート11.0重量%、ベンジルジメチルケタール
5重量%、硫酸バリウム1o、5重量%、モダフロー1
.5mi%、シャユングリーフ10重量%からなる組成
物を実施例1と同様に混練、印刷、硬化した所塗膜の硬
さが鉛筆硬度で5Hの試料が得られた。
Example 3 22.0% by weight of Synthesis Example 20 polymer, 40.0% by weight of half-esterified product of Synthesis Example 50, 9.0% by weight of trimethylolpropane triacrylate, 11.0% by weight of nonylphenoxyethyl acrylate %, benzyl dimethyl ketal 5% by weight, barium sulfate 1o, 5% by weight, Modaflow 1
.. A composition consisting of 5 mi% and 10% by weight of Shayungleaf was kneaded, printed and cured in the same manner as in Example 1, yielding a sample with a pencil hardness of 5H.

この試料を塩化第2銅エツチング液に50Cで30分間
処理した所、0.1〜l、 Q mm巾すべての塗膜の
状態に1つたく異常がなかった。塗膜を55Cの3%水
酸化ナトリウム水溶液で剥離した所、5秒で剥離した。
When this sample was treated with a cupric chloride etching solution at 50C for 30 minutes, there was no abnormality in the condition of all coatings with widths of 0.1 to 1, Q mm. When the coating film was peeled off with a 3% aqueous solution of 55C sodium hydroxide, it was peeled off in 5 seconds.

実施例4 合成例20重合体16.0重量%、合成例60半エステ
ル化物51.5 重i%、2−ヒドロキシエチ    
・ルメタクリレート5.Oii%、ノニルフェノキシエ
チルアクリレート15.0重量%、ベンジルジメチルケ
タール5.0重量%、硫酸バリウム5.0重量%、モダ
フロー1.5重量%、シャユングリーフ10重量%から
なる組成物を実施例1と同様に、混練、印刷、硬化した
ところ、塗膜の硬さが鉛筆硬度で4 Hの試料が得られ
た。この試料を塩化第2鉄エツチング液に50Cで30
分間処理した所0、1〜l、Qtnm巾すべての塗膜の
状態にまったく異常がなかった。塗膜を55Cの3%水
酸化ナトリウム水溶液で剥離した所5秒で剥離した。
Example 4 Synthesis Example 20 Polymer 16.0% by weight, Synthesis Example 60 Half-esterified product 51.5% by weight, 2-hydroxyethyl
・Lumethacrylate 5. Example 2: A composition consisting of Oii%, nonylphenoxyethyl acrylate 15.0% by weight, benzyl dimethyl ketal 5.0% by weight, barium sulfate 5.0% by weight, Modaflow 1.5% by weight, and Shayungleaf 10% by weight. After kneading, printing, and curing in the same manner as in Example 1, a sample with a coating film hardness of 4 H on the pencil hardness scale was obtained. This sample was added to a ferric chloride etching solution at 50C for 30 minutes.
When treated for 1 minute, there was no abnormality in the condition of the coating film in all widths of 0, 1 to 1, and Qtnm. The coating film was peeled off in 5 seconds with a 3% aqueous solution of 55C sodium hydroxide.

実施例5゜ 合成例2の重合体21.0重量%、合成例3の半エステ
ル(l+ 36.4 ffli%、2−ヒドロキシエチ
ルメタクリレート3.3重量%、ノニルフェノキシエチ
ルアクリレート10.0重量%、ベンジルメチルケター
ル5.0重量%、硫酸バリウム21.8重量%、モダフ
ロー1.5重量%、ンヤニングリーン1.0重量%、か
らなる組成物を実施例1と同様に混練、印刷、硬化した
ところ、塗膜の硬さが鉛筆硬度で8Hの試料が得られた
。この試料を塩化第2鉄エツチング液に50Cで30分
間処理した所0.1〜1.0朋巾すべての塗膜の状態に
異常はなかった。塗膜を55Cの3%水酸化ナトリウム
水溶液で剥離した所3秒で剥離した。
Example 5゜21.0% by weight of the polymer of Synthesis Example 2, half ester of Synthesis Example 3 (l+ 36.4 ffli%, 3.3% by weight of 2-hydroxyethyl methacrylate, 10.0% by weight of nonylphenoxyethyl acrylate) , 5.0% by weight of benzyl methyl ketal, 21.8% by weight of barium sulfate, 1.5% by weight of Modaflow, and 1.0% by weight of Nyanin Green were kneaded, printed, and cured in the same manner as in Example 1. As a result, a sample with a paint film hardness of 8H on a pencil hardness scale was obtained.When this sample was treated with a ferric chloride etching solution at 50C for 30 minutes, all paint films with a width of 0.1 to 1.0 mm were removed. There was no abnormality in the condition.The coating film was peeled off in 3 seconds with a 55C 3% sodium hydroxide aqueous solution.

実施例6゜ 合成例2の重合体22重量%、合成例50半エスモ (ダイセル化学工業■社製、品名、プラクセルFM−1
)、ベンジルジメチルケタール5.0重量%、硫酸バリ
ウム10.5重量%、モダフロー1.5重量の、シャユ
ングリーフ1.0重量%からなる組成物を実施例1と同
様に混線、印刷、硬化したところ塗膜の硬さが鉛筆硬度
で4Hの試料かえられた。
Example 6゜22% by weight of the polymer of Synthesis Example 2, Synthesis Example 50 half-Esmo (manufactured by Daicel Chemical Industries, product name: Plaxel FM-1)
), 5.0% by weight of benzyl dimethyl ketal, 10.5% by weight of barium sulfate, 1.5% by weight of Modaflow, and 1.0% by weight of Shayungleaf were mixed, printed, and cured in the same manner as in Example 1. As a result, the paint film had a pencil hardness of 4H.

この試料を塩化第2銅エツチング液に50Cで30゛分
間処理した所、0.1〜1. Q mm巾すべての塗膜
の状態に異常はなかった。塗膜を55tL’の3%水酸
化す) IJウム水溶液で剥離した所、7秒で剥離した
When this sample was treated with cupric chloride etching solution at 50C for 30 minutes, the results were 0.1-1. There was no abnormality in the condition of the coating film across the entire width of Qmm. When the coating film was removed with 55 tL' of 3% hydroxide solution, it was removed in 7 seconds.

特許出願人 日本化薬株式会社Patent applicant: Nippon Kayaku Co., Ltd.

Claims (1)

【特許請求の範囲】[Claims] 1 エチレン性不飽和基を有する下記一般式(ここでR
,はCH3又はH;R2はCH3,C2H5又はH;1
は0又は1〜2の整数;mは1〜3の数;nは6〜8の
数を示す〕で示される重合体と、多塩基酸(又は、その
無水物)のヒドロキシアルキルアクリレート(又はメタ
クリレート〕半エステル化物と、エチレン性不飽和結合
を有するビニルモノマーと、光重合開始剤とを含む光硬
化型樹脂組成物。
1 The following general formula having an ethylenically unsaturated group (where R
, is CH3 or H; R2 is CH3, C2H5 or H; 1
is an integer of 0 or 1 to 2; m is a number of 1 to 3; n is a number of 6 to 8]; and a hydroxyalkyl acrylate (or methacrylate] A photocurable resin composition containing a semi-esterified product, a vinyl monomer having an ethylenically unsaturated bond, and a photopolymerization initiator.
JP57103977A 1982-06-18 1982-06-18 Photosetting resin composition Granted JPS58221841A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57103977A JPS58221841A (en) 1982-06-18 1982-06-18 Photosetting resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57103977A JPS58221841A (en) 1982-06-18 1982-06-18 Photosetting resin composition

Publications (2)

Publication Number Publication Date
JPS58221841A true JPS58221841A (en) 1983-12-23
JPH0336211B2 JPH0336211B2 (en) 1991-05-30

Family

ID=14368379

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57103977A Granted JPS58221841A (en) 1982-06-18 1982-06-18 Photosetting resin composition

Country Status (1)

Country Link
JP (1) JPS58221841A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59128536A (en) * 1983-01-14 1984-07-24 Nippon Shokubai Kagaku Kogyo Co Ltd Ultraviolet hardenable composition
JPS6193450A (en) * 1984-10-12 1986-05-12 Mitsubishi Chem Ind Ltd Photopolymerizable composition
JPS6311930A (en) * 1986-07-03 1988-01-19 Mitsui Toatsu Chem Inc Photosensitive resin composition
JPS6372710A (en) * 1986-09-12 1988-04-02 Ube Ind Ltd Photocurable composition
JPS6463953A (en) * 1987-09-04 1989-03-09 Nippon Catalytic Chem Ind Photosensitive composition
JPH01219736A (en) * 1988-02-26 1989-09-01 Ueno Kagaku Kogyo Kk Photosensitive resin composition
WO2022018510A1 (en) * 2020-07-23 2022-01-27 Arkema France (meth)acrylate functional dispersant

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59128536A (en) * 1983-01-14 1984-07-24 Nippon Shokubai Kagaku Kogyo Co Ltd Ultraviolet hardenable composition
JPS6193450A (en) * 1984-10-12 1986-05-12 Mitsubishi Chem Ind Ltd Photopolymerizable composition
JPS6311930A (en) * 1986-07-03 1988-01-19 Mitsui Toatsu Chem Inc Photosensitive resin composition
JPS6372710A (en) * 1986-09-12 1988-04-02 Ube Ind Ltd Photocurable composition
JPS6463953A (en) * 1987-09-04 1989-03-09 Nippon Catalytic Chem Ind Photosensitive composition
JPH01219736A (en) * 1988-02-26 1989-09-01 Ueno Kagaku Kogyo Kk Photosensitive resin composition
WO2022018510A1 (en) * 2020-07-23 2022-01-27 Arkema France (meth)acrylate functional dispersant

Also Published As

Publication number Publication date
JPH0336211B2 (en) 1991-05-30

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