JPH1192540A - Resin composition and cured material obtained therefrom - Google Patents
Resin composition and cured material obtained therefromInfo
- Publication number
- JPH1192540A JPH1192540A JP27189597A JP27189597A JPH1192540A JP H1192540 A JPH1192540 A JP H1192540A JP 27189597 A JP27189597 A JP 27189597A JP 27189597 A JP27189597 A JP 27189597A JP H1192540 A JPH1192540 A JP H1192540A
- Authority
- JP
- Japan
- Prior art keywords
- meth
- acrylate
- resin composition
- compound
- copolymer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011342 resin composition Substances 0.000 title claims abstract description 24
- 239000000463 material Substances 0.000 title abstract 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims abstract description 32
- 150000001875 compounds Chemical class 0.000 claims abstract description 16
- 229920001577 copolymer Polymers 0.000 claims abstract description 16
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims abstract description 14
- 238000005530 etching Methods 0.000 claims abstract description 13
- 239000000178 monomer Substances 0.000 claims abstract description 13
- 239000003999 initiator Substances 0.000 claims abstract description 11
- KMOUUZVZFBCRAM-OLQVQODUSA-N (3as,7ar)-3a,4,7,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C=CC[C@@H]2C(=O)OC(=O)[C@@H]21 KMOUUZVZFBCRAM-OLQVQODUSA-N 0.000 claims abstract description 8
- FQPSGWSUVKBHSU-UHFFFAOYSA-N methacrylamide Chemical compound CC(=C)C(N)=O FQPSGWSUVKBHSU-UHFFFAOYSA-N 0.000 claims abstract description 8
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 claims abstract description 7
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 claims abstract description 6
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims abstract description 5
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 7
- 239000007795 chemical reaction product Substances 0.000 claims description 6
- 239000000047 product Substances 0.000 claims description 6
- 101100386054 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) CYS3 gene Proteins 0.000 claims 1
- 101150035983 str1 gene Proteins 0.000 claims 1
- 239000000203 mixture Substances 0.000 abstract description 12
- 238000006243 chemical reaction Methods 0.000 abstract description 5
- 239000003513 alkali Substances 0.000 abstract description 3
- 238000002156 mixing Methods 0.000 abstract description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 12
- 239000002253 acid Substances 0.000 description 12
- -1 hydroxyalkyl acrylate Chemical compound 0.000 description 10
- 230000015572 biosynthetic process Effects 0.000 description 9
- 238000003786 synthesis reaction Methods 0.000 description 9
- 239000000243 solution Substances 0.000 description 8
- 238000000576 coating method Methods 0.000 description 6
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 6
- 239000000654 additive Substances 0.000 description 4
- 239000012670 alkaline solution Substances 0.000 description 4
- 239000000454 talc Substances 0.000 description 4
- 229910052623 talc Inorganic materials 0.000 description 4
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- 230000005856 abnormality Effects 0.000 description 3
- 150000008064 anhydrides Chemical class 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 229960003280 cupric chloride Drugs 0.000 description 3
- 239000003112 inhibitor Substances 0.000 description 3
- NWVVVBRKAWDGAB-UHFFFAOYSA-N p-methoxyphenol Chemical compound COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 3
- 238000006116 polymerization reaction Methods 0.000 description 3
- FTALTLPZDVFJSS-UHFFFAOYSA-N 2-(2-ethoxyethoxy)ethyl prop-2-enoate Chemical compound CCOCCOCCOC(=O)C=C FTALTLPZDVFJSS-UHFFFAOYSA-N 0.000 description 2
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 2
- VHSHLMUCYSAUQU-UHFFFAOYSA-N 2-hydroxypropyl methacrylate Chemical compound CC(O)COC(=O)C(C)=C VHSHLMUCYSAUQU-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 125000002768 hydroxyalkyl group Chemical group 0.000 description 2
- 239000011256 inorganic filler Substances 0.000 description 2
- 229910003475 inorganic filler Inorganic materials 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 238000004898 kneading Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- RLUFBDIRFJGKLY-UHFFFAOYSA-N (2,3-dichlorophenyl)-phenylmethanone Chemical compound ClC1=CC=CC(C(=O)C=2C=CC=CC=2)=C1Cl RLUFBDIRFJGKLY-UHFFFAOYSA-N 0.000 description 1
- XKSUVRWJZCEYQQ-UHFFFAOYSA-N 1,1-dimethoxyethylbenzene Chemical compound COC(C)(OC)C1=CC=CC=C1 XKSUVRWJZCEYQQ-UHFFFAOYSA-N 0.000 description 1
- MSAHTMIQULFMRG-UHFFFAOYSA-N 1,2-diphenyl-2-propan-2-yloxyethanone Chemical compound C=1C=CC=CC=1C(OC(C)C)C(=O)C1=CC=CC=C1 MSAHTMIQULFMRG-UHFFFAOYSA-N 0.000 description 1
- DKEGCUDAFWNSSO-UHFFFAOYSA-N 1,8-dibromooctane Chemical compound BrCCCCCCCCBr DKEGCUDAFWNSSO-UHFFFAOYSA-N 0.000 description 1
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 1
- WJFKNYWRSNBZNX-UHFFFAOYSA-N 10H-phenothiazine Chemical compound C1=CC=C2NC3=CC=CC=C3SC2=C1 WJFKNYWRSNBZNX-UHFFFAOYSA-N 0.000 description 1
- GIMQKKFOOYOQGB-UHFFFAOYSA-N 2,2-diethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)(OCC)C(=O)C1=CC=CC=C1 GIMQKKFOOYOQGB-UHFFFAOYSA-N 0.000 description 1
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 1
- BTJPUDCSZVCXFQ-UHFFFAOYSA-N 2,4-diethylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(CC)=CC(CC)=C3SC2=C1 BTJPUDCSZVCXFQ-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- UMLWXYJZDNNBTD-UHFFFAOYSA-N 2-(dimethylamino)-1-phenylethanone Chemical compound CN(C)CC(=O)C1=CC=CC=C1 UMLWXYJZDNNBTD-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- DZZAHLOABNWIFA-UHFFFAOYSA-N 2-butoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCCCC)C(=O)C1=CC=CC=C1 DZZAHLOABNWIFA-UHFFFAOYSA-N 0.000 description 1
- ZCDADJXRUCOCJE-UHFFFAOYSA-N 2-chlorothioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(Cl)=CC=C3SC2=C1 ZCDADJXRUCOCJE-UHFFFAOYSA-N 0.000 description 1
- KMNCBSZOIQAUFX-UHFFFAOYSA-N 2-ethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)C(=O)C1=CC=CC=C1 KMNCBSZOIQAUFX-UHFFFAOYSA-N 0.000 description 1
- SJEBAWHUJDUKQK-UHFFFAOYSA-N 2-ethylanthraquinone Chemical compound C1=CC=C2C(=O)C3=CC(CC)=CC=C3C(=O)C2=C1 SJEBAWHUJDUKQK-UHFFFAOYSA-N 0.000 description 1
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 description 1
- BQZJOQXSCSZQPS-UHFFFAOYSA-N 2-methoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OC)C(=O)C1=CC=CC=C1 BQZJOQXSCSZQPS-UHFFFAOYSA-N 0.000 description 1
- LWRBVKNFOYUCNP-UHFFFAOYSA-N 2-methyl-1-(4-methylsulfanylphenyl)-2-morpholin-4-ylpropan-1-one Chemical compound C1=CC(SC)=CC=C1C(=O)C(C)(C)N1CCOCC1 LWRBVKNFOYUCNP-UHFFFAOYSA-N 0.000 description 1
- KTALPKYXQZGAEG-UHFFFAOYSA-N 2-propan-2-ylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(C(C)C)=CC=C3SC2=C1 KTALPKYXQZGAEG-UHFFFAOYSA-N 0.000 description 1
- 229920002126 Acrylic acid copolymer Polymers 0.000 description 1
- 229910002012 Aerosil® Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 229920005692 JONCRYL® Polymers 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- 244000028419 Styrax benzoin Species 0.000 description 1
- 235000000126 Styrax benzoin Nutrition 0.000 description 1
- 235000008411 Sumatra benzointree Nutrition 0.000 description 1
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 1
- 239000002318 adhesion promoter Substances 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 229960002130 benzoin Drugs 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 1
- QDVNNDYBCWZVTI-UHFFFAOYSA-N bis[4-(ethylamino)phenyl]methanone Chemical compound C1=CC(NCC)=CC=C1C(=O)C1=CC=C(NCC)C=C1 QDVNNDYBCWZVTI-UHFFFAOYSA-N 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 238000004581 coalescence Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 235000019382 gum benzoic Nutrition 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- VYKXQOYUCMREIS-UHFFFAOYSA-N methylhexahydrophthalic anhydride Chemical compound C1CCCC2C(=O)OC(=O)C21C VYKXQOYUCMREIS-UHFFFAOYSA-N 0.000 description 1
- FZUGPQWGEGAKET-UHFFFAOYSA-N parbenate Chemical compound CCOC(=O)C1=CC=C(N(C)C)C=C1 FZUGPQWGEGAKET-UHFFFAOYSA-N 0.000 description 1
- 229950000688 phenothiazine Drugs 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 150000007519 polyprotic acids Polymers 0.000 description 1
- 150000003377 silicon compounds Chemical class 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- ANRHNWWPFJCPAZ-UHFFFAOYSA-M thionine Chemical compound [Cl-].C1=CC(N)=CC2=[S+]C3=CC(N)=CC=C3N=C21 ANRHNWWPFJCPAZ-UHFFFAOYSA-M 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Landscapes
- Polymerisation Methods In General (AREA)
- Graft Or Block Polymers (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、紫外線で硬化する
樹脂組成物に関するものであり、プリント配線基板製造
のためのエッチングレジストインキとして好適な、新規
な樹脂組成物及びその硬化物に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin composition curable by ultraviolet rays, and more particularly to a novel resin composition suitable as an etching resist ink for manufacturing a printed wiring board and a cured product thereof. .
【0002】[0002]
【従来の技術】従来、紫外線硬化型のエッチングレジス
トインキについては、ポリエステルと、ヒドロキシアル
キルアクリレートと光重合性単量体と、2〜36個の炭
素原子を含むカルボン酸と光重合開始剤を含む組成物
(例えば特開昭51−2503号公報参照)や、ポリエ
ステルと多塩基酸(又はその無水物)のヒドロキシアル
キルアクリレート半エステル化合物と、エチレン性不飽
和結合を有するビニルモノマーと光重合開始剤とを含む
組成物(例えば特開昭57−13444)等が知られて
いる。2. Description of the Related Art Conventionally, an ultraviolet curable etching resist ink contains a polyester, a hydroxyalkyl acrylate, a photopolymerizable monomer, a carboxylic acid having 2 to 36 carbon atoms, and a photopolymerization initiator. Composition (see, for example, JP-A-51-2503), a hydroxyalkyl acrylate half-ester compound of a polyester and a polybasic acid (or an anhydride thereof), a vinyl monomer having an ethylenically unsaturated bond, and a photopolymerization initiator. (For example, JP-A-57-13444) and the like.
【0003】[0003]
【発明が解決しようとする課題】しかしながら、上記従
来技術による組成物は、レジスト皮膜の剥離に際し、水
性アルカリ液によるレジスト皮膜が完全溶解せず、膨潤
剥離した皮膜がフィルターや剥離用液噴出ノズルの閉塞
をきたすという問題を有している。However, in the composition according to the prior art, when the resist film is peeled off, the resist film is not completely dissolved by the aqueous alkali solution, and the swelled and peeled film is formed by a filter or a peeling liquid jet nozzle. It has the problem of causing blockage.
【0004】[0004]
【課題を解決するための手段】上記の問題を解決するた
め、本発明者らは、鋭意研究の結果、紫外線で硬化する
エッチングレジストインキに適し、得られた硬化部が水
性アルカリ液(例えば、5%NaOH水溶液等)に可溶
である樹脂組成物及びその硬化物を提供することに成功
した。すなわち、本発明は、(1)カルボキシル基含有
共重合体(A)、一般式(1)Means for Solving the Problems In order to solve the above-mentioned problems, the present inventors have conducted intensive studies and as a result, the present invention is suitable for an etching resist ink which is cured by ultraviolet rays, and the obtained cured portion is an aqueous alkaline solution (for example, 5% NaOH aqueous solution) and a cured product thereof. That is, the present invention provides (1) a carboxyl group-containing copolymer (A),
【0005】[0005]
【化2】 Embedded image
【0006】(式(1)中、R1 ,R2 及びR3 は、そ
れぞれH又はCH3 である。)で表される化合物
(B)、メタクリルアミド(C)、1官能(メタ)アク
リレートモノマー(D)及び光重合開始剤(E)を含有
することを特徴とする樹脂組成物、(2)カルボキシル
基含有共重合体(A)がスチレン又はα−メチルスチレ
ンと(メタ)アクリル酸の共重合体である(1)記載の
樹脂組成物、(3)一般式(1)で表される化合物
(B)がテトラヒドロ無水フタル酸と2−ヒドロキシエ
チル(メタ)アクリレートの反応物である(1)記載の
樹脂組成物、(4)紫外線硬化型エッチングレジストイ
ンキ用である(1)〜(3)記載の樹脂組成物、(5)
(1)〜(3)記載の樹脂組成物の硬化物、に関する。(Wherein, R 1 , R 2 and R 3 in the formula (1) are each H or CH 3 ), methacrylamide (C), monofunctional (meth) acrylate A resin composition containing a monomer (D) and a photopolymerization initiator (E); (2) a carboxyl group-containing copolymer (A) comprising styrene or α-methylstyrene and (meth) acrylic acid; The resin composition according to (1), which is a copolymer, and (3) the compound (B) represented by the general formula (1) is a reaction product of tetrahydrophthalic anhydride and 2-hydroxyethyl (meth) acrylate ( The resin composition according to 1), (4) the resin composition according to (1) to (3), which is used for an ultraviolet-curable etching resist ink, and (5).
(1) A cured product of the resin composition according to (3).
【0007】本発明の樹脂組成物は、紫外線の照射によ
り硬化し、かつ硬化部が水性アルカリ液に可溶である。
本発明の樹脂組成物は、硬化皮膜の耐酸性、水性アルカ
リ液可溶性という特性を利用して、硬化皮膜としての機
能を果たした後、皮膜を除去したいような分野、特に上
述したごとくプリント配線基板製造のためのエッチング
レジストインキとして好適に利用できる。[0007] The resin composition of the present invention is cured by irradiation with ultraviolet light, and the cured portion is soluble in an aqueous alkaline solution.
The resin composition of the present invention uses the properties of a cured film, such as acid resistance and aqueous alkali solution solubility, to perform its function as a cured film, and then to remove the film, particularly in the field of printed wiring boards as described above. It can be suitably used as an etching resist ink for production.
【0008】本発明の樹脂組成物は、カルボキシル基含
有共重合体(A)、上記一般式(1)で表される化合物
(B)、メタクリルアミド(C)、1官能(メタ)アク
リレートモノマー(D)及び光重合開始剤(E)を含有
することを特徴とするThe resin composition of the present invention comprises a carboxyl group-containing copolymer (A), a compound (B) represented by the above general formula (1), methacrylamide (C), and a monofunctional (meth) acrylate monomer ( D) and a photopolymerization initiator (E).
【0009】本発明で使用するカルボキシル基含有共重
合体(A)としては、例えば(メタ)アクリル酸と、メ
チル(メタ)アクリレート、エチル(メタ)アクリレー
ト、ブチル(メタ)アクリレート、ベンジル(メタ)ア
クリレート、フェニル(メタ)アクリレート、フェニル
オキシエチル(メタ)アクリレート、2−ヒドロキシエ
チル(メタ)アクリレート等のモノアクリレート系単量
体やスチレン、α−メチルスチレン等のスチレン系単量
体との共重合体等を挙げることができる。好ましい共重
合体(A)としては、(メタ)アクリル酸とスチレン又
はα−メチルスチレンの共重合体等を挙げることができ
る。又、その酸価(mgOH/g)は、100〜300
が好ましい。このような共重合体は市場より容易に入手
できる。例えば、ジョンソン(株)製、ジョンクリルJ
−67(重量平均分子量104 、酸価(mgKOH/
g)195、軟化点143℃)、ジョンクリルJ−67
8(重量平均分子量7000、酸価(mgKOH/g)
200、軟化点146℃)、ジョンクリルJ−682
(平均分子量1600、酸価(mgKOH/g)23
5、軟化点110℃)等である。The carboxyl group-containing copolymer (A) used in the present invention includes, for example, (meth) acrylic acid, methyl (meth) acrylate, ethyl (meth) acrylate, butyl (meth) acrylate, and benzyl (meth) acrylate. Co-polymer with monoacrylate monomers such as acrylate, phenyl (meth) acrylate, phenyloxyethyl (meth) acrylate, 2-hydroxyethyl (meth) acrylate and styrene monomers such as styrene and α-methylstyrene Coalescence and the like. Preferred copolymers (A) include copolymers of (meth) acrylic acid and styrene or α-methylstyrene. The acid value (mgOH / g) is 100-300.
Is preferred. Such copolymers are readily available on the market. For example, Johnson Krill J manufactured by Johnson Co., Ltd.
-67 (weight average molecular weight 10 4 , acid value (mgKOH /
g) 195, softening point 143 ° C), Joncryl J-67
8 (weight average molecular weight 7000, acid value (mgKOH / g)
200, softening point 146 ° C.), John Krill J-682
(Average molecular weight 1600, acid value (mgKOH / g) 23
5, softening point 110 ° C.).
【0010】本発明に用いる一般式(1)で表わされる
化合物(B)は、テトラヒドロ無水フタル酸又は2−メ
チル−テトラヒドロ無水フタル酸とヒドロキシアルキル
(メタ)アクリレートとの約等モル反応生成物として得
られる、ヒドロキシアルキル基を有する(メタ)アクリ
レートとしては、例えば2−ヒドロキシエチル(メタ)
アクリレート、2−ヒドロキシプロピル(メタ)アクリ
レート等の2−ヒドロキシ(C2〜C3)アルキル(メ
タ)アクリレートがあげられる。好ましい化合物(B)
としては、例えば、テトラヒドロ無水フタル酸と2−ヒ
ドロキシエチルアクリレートの反応物、テトラヒドロ無
水フタル酸と2−ヒドロキシエチルメタクリレートの反
応物あるいは、これら反応物の混合物等を挙げることが
できる。The compound (B) represented by the general formula (1) used in the present invention is obtained as an approximately equimolar reaction product of tetrahydrophthalic anhydride or 2-methyl-tetrahydrophthalic anhydride with hydroxyalkyl (meth) acrylate. As the obtained (meth) acrylate having a hydroxyalkyl group, for example, 2-hydroxyethyl (meth)
Examples thereof include 2-hydroxy (C2 to C3) alkyl (meth) acrylates such as acrylate and 2-hydroxypropyl (meth) acrylate. Preferred compound (B)
Examples thereof include a reaction product of tetrahydrophthalic anhydride and 2-hydroxyethyl acrylate, a reaction product of tetrahydrophthalic anhydride and 2-hydroxyethyl methacrylate, or a mixture of these reaction products.
【0011】本発明で使用する1官能(メタ)アクリレ
ートモノマー(D)は、アクリレート基を分子中に1つ
有するアクリレートモノマーで、例えばカルビトール
(メタ)アクリレート、テトラヒドロフルフリル(メ
タ)アクリレート、フェニルオキシエチル(メタ)アク
リレート、2−ヒドロキシエチル(メタ)アクリレー
ト、2−ヒドロキシプロピル(メタ)アクリレート等が
挙げられる。The monofunctional (meth) acrylate monomer (D) used in the present invention is an acrylate monomer having one acrylate group in a molecule, for example, carbitol (meth) acrylate, tetrahydrofurfuryl (meth) acrylate, phenyl Oxyethyl (meth) acrylate, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate and the like can be mentioned.
【0012】本発明で使用する光重合開始剤(E)とし
ては、例えばベンゾイン、ベンゾインメチルエーテル、
ベンゾインエチルエーテル、ベンゾインイソプロピルエ
ーテル、ベンゾイン−n−ブチルエーテル、ベンゾイン
イソブチルエーテル、アセトフェノン、ジメチルアミノ
アセトフェノン、2,2−ジメトキシ−2−フェニルア
セトフェノン、2,2−ジエトキシ−2−フェニルアセ
トフェノン、2−ヒドロキシ−2−メチル−1−フェニ
ルプロパン−1−オン、1−ヒドロキシシクロヘキシル
フェニルケトン、2−メチル−1−〔4−(メチルチ
オ)フェニル〕−2−モルホリノ−プロパン−1−オ
ン、ベンゾフェノン、4,4′−ジエチルアミノベンゾ
フェノン、ジクロロベンゾフェノン、2−エチルアント
ラキノン、2,4−ジエチルチオキサントン、2−イソ
プロピルチオキサントン、2−クロロチオキサントン、
ベンジルジメチルケタール、アセトフェノンジメチルケ
タール、p−ジメチルアミノ安息香酸エチルエステル等
が挙げられる。これらを単独又は組み合わせて用いるこ
とができる。The photopolymerization initiator (E) used in the present invention includes, for example, benzoin, benzoin methyl ether,
Benzoin ethyl ether, benzoin isopropyl ether, benzoin-n-butyl ether, benzoin isobutyl ether, acetophenone, dimethylaminoacetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2,2-diethoxy-2-phenylacetophenone, 2-hydroxy- 2-methyl-1-phenylpropan-1-one, 1-hydroxycyclohexylphenyl ketone, 2-methyl-1- [4- (methylthio) phenyl] -2-morpholino-propan-1-one, benzophenone, 4,4 '-Diethylaminobenzophenone, dichlorobenzophenone, 2-ethylanthraquinone, 2,4-diethylthioxanthone, 2-isopropylthioxanthone, 2-chlorothioxanthone,
Benzyl dimethyl ketal, acetophenone dimethyl ketal, p-dimethylaminobenzoic acid ethyl ester and the like can be mentioned. These can be used alone or in combination.
【0013】本発明の樹脂組成物を構成する(A)〜
(E)成分の使用割合は、(A)〜(E)成分の混合物
中、カルボキシル基含有重合体(A)が好ましくは0.
5〜20重量%、特に1〜10重量%が好ましい。又、
前記、一般式(1)で表される化合物(B)の使用割合
は、(A)〜(E)成分の混合物中、55〜85重量%
が好ましく、特に60〜80重量%が好ましい。メタク
リルアミド(C)の使用割合は、(A)〜(E)成分の
混合物中、5〜20重量%が好ましく、特に7〜15重
量%が好ましい。1官能(メタ)アクリレート(D)の
使用割合は、(A)〜(E)成分の混合物中、5〜20
重量%が好ましく、特に7〜15重量%が好ましい。光
重合開始剤(E)の使用割合は、(A)〜(E)成分の
混合物中、0.5〜15重量%が好ましく、特に3〜7
重量%が好ましい。(A) to Constituting the Resin Composition of the Present Invention
The proportion of the component (E) used in the mixture of the components (A) to (E) is preferably 0.1% for the carboxyl group-containing polymer (A).
5-20% by weight, especially 1-10% by weight is preferred. or,
The use ratio of the compound (B) represented by the general formula (1) is 55 to 85% by weight in the mixture of the components (A) to (E).
, And particularly preferably 60 to 80% by weight. The use ratio of methacrylamide (C) in the mixture of the components (A) to (E) is preferably 5 to 20% by weight, and particularly preferably 7 to 15% by weight. The usage ratio of the monofunctional (meth) acrylate (D) is 5 to 20 in the mixture of the components (A) to (E).
% By weight, and particularly preferably 7 to 15% by weight. The proportion of the photopolymerization initiator (E) used is preferably 0.5 to 15% by weight, more preferably 3 to 7% by weight in the mixture of the components (A) to (E).
% By weight is preferred.
【0014】本発明の樹脂組成物には、更に必要に応じ
て、着色剤、シリコン化合物やフッ素系界面活性剤等の
レベリング剤や消泡剤、シランカップリング剤等の密着
付与剤、アエロジル等のチクソトロピー剤、またハイド
ロキノン、ハイドロキノンモノメチルエーテル、フェノ
チアジン等の重合禁止剤、タルク、二酸化シリカ、硫酸
バリウム等の無機フィラー等を使用することもできる。
これらの添加剤等を使用する場合、その使用量は、例え
ば(A)〜(E)成分の総量100重量部に対し、着色
剤0.5〜3重量部、無機フィラー10〜60重量部、
その他の添加剤それぞれ0.5〜3重量部程度が一応の
目安であるが、使用目的に応じ適宜増減し得る。The resin composition of the present invention may further contain, if necessary, a coloring agent, a leveling agent such as a silicon compound or a fluorine-based surfactant, an antifoaming agent, an adhesion promoter such as a silane coupling agent, Aerosil, etc. And a polymerization inhibitor such as hydroquinone, hydroquinone monomethyl ether, and phenothiazine; and an inorganic filler such as talc, silica dioxide, and barium sulfate.
When these additives and the like are used, the amounts of the additives are, for example, 0.5 to 3 parts by weight of a coloring agent, 10 to 60 parts by weight of an inorganic filler, and 100 parts by weight of the total amount of the components (A) to (E).
About 0.5 to 3 parts by weight of each of the other additives is a rough guide, but may be appropriately increased or decreased according to the purpose of use.
【0015】本発明の樹脂組成物は、前記(A)〜
(E)成分及びその他添加剤、フィラー類等を混合、分
散、混練することにより調製することができる。このよ
うにして得られた樹脂組成物は、例えば紫外線硬化型エ
ッチングレジストインキとして、スクリーン印刷法によ
りプリント基板上に10〜50μmの厚さにパターンを
印刷後、紫外線を照射し硬化させることができる。[0015] The resin composition of the present invention comprises the above (A)
It can be prepared by mixing, dispersing and kneading the component (E), other additives, fillers and the like. The resin composition thus obtained can be cured by irradiating ultraviolet rays after printing a pattern to a thickness of 10 to 50 μm on a printed board by screen printing, for example, as an ultraviolet-curable etching resist ink. .
【0016】[0016]
【実施例】次に、本発明を実施例により具体的に説明す
る。 (一般式(1)で表される化合物(B)の合成例)Next, the present invention will be described in detail with reference to examples. (Synthesis example of compound (B) represented by general formula (1))
【0017】合成例1 テトラヒドロ無水フタル酸152g、2−ヒドロキシエ
チルアクリレート120.3g、重合禁止剤としてハイ
ドロキノンモノメチルエーテル0.1gを仕込み、徐々
に昇温しながら、90℃に保ち、反応を続ける。無水物
基が無くなるまで、約20時間反応を続け、酸価(mg
KOH/g)206の下記の構造式の化合物(B−1)
を得る。Synthesis Example 1 152 g of tetrahydrophthalic anhydride, 120.3 g of 2-hydroxyethyl acrylate, and 0.1 g of hydroquinone monomethyl ether as a polymerization inhibitor were charged, and the reaction was continued at 90 ° C. while gradually increasing the temperature. The reaction was continued for about 20 hours until the anhydride group disappeared, and the acid value (mg
KOH / g) 206, a compound of the following structural formula (B-1)
Get.
【0018】[0018]
【化3】 Embedded image
【0019】合成例2 テトラヒドロ無水フタル酸152g、2−ヒドロキシエ
チルメタクリレート134.8g、重合禁止剤としてハ
イドロキノンモノメチルエーテル0.1gを仕込み、徐
々に昇温しながら、90℃に保ち、反応を続ける。無水
物基が無くなるまで、約20時間反応を続け、酸価(m
gKOH/g)195.5の下記構造式の化合物(B−
2)を得る。Synthesis Example 2 152 g of tetrahydrophthalic anhydride, 134.8 g of 2-hydroxyethyl methacrylate, and 0.1 g of hydroquinone monomethyl ether as a polymerization inhibitor were charged, and the reaction was continued at 90 ° C. while gradually increasing the temperature. The reaction was continued for about 20 hours until the anhydride group disappeared, and the acid value (m
gKOH / g) 195.5 (B-
Obtain 2).
【0020】[0020]
【化4】 Embedded image
【0021】実施例1 ジョンクリル67(成分(A):ジョンソン(株)製、
スチレンとアクリル酸の共重合物、重量平均分子量10
4 、酸価(mgKOH/g)195、軟化点143℃)
4.00g,合成例1の化合物(B−1)23.60
g,合成例2の化合物(B−2)24.90g、メタク
リルアミド(C)6.60g、カルビトールアクリレー
ト(1官能(メタ)アクリレートモノマー(D))7.
10g及びベンジルジメチルケタール(光重合開始剤
(E))3.80gを混合、溶解した。次いでこの混合
物に更にシアニンブルー0.5g、モダフロー(モンサ
ント社製レベリング剤)0.9g、タルク(充填剤)2
8.5gを均一に混合した後、三本ロール((株)井上
製作所製)で十分に混練して本発明の樹脂組成物(紫外
線硬化型エッチングレジストインキ)を得た。Example 1 John Krill 67 (Component (A): manufactured by Johnson Co., Ltd.)
Styrene and acrylic acid copolymer, weight average molecular weight 10
4 , acid value (mgKOH / g) 195, softening point 143 ° C)
4.00 g, compound (B-1) of Synthesis Example 1 23.60
g, 24.90 g of compound (B-2) of Synthesis Example 2, 6.60 g of methacrylamide (C), and carbitol acrylate (monofunctional (meth) acrylate monomer (D)) 7.
10 g and 3.80 g of benzyldimethyl ketal (photopolymerization initiator (E)) were mixed and dissolved. Next, 0.5 g of cyanine blue, 0.9 g of Modaflow (a leveling agent manufactured by Monsanto), and talc (filler) 2 were further added to the mixture.
After 8.5 g was uniformly mixed, the mixture was sufficiently kneaded with a three-roll mill (manufactured by Inoue Seisakusho) to obtain a resin composition of the present invention (ultraviolet curable etching resist ink).
【0022】この本発明の樹脂組成物を、スクリーンに
0.1、0.15、0.2、0.3、0.8、1.0m
m幅を5本ずつもつパターンを用いて、スクリーン印刷
法により、プリント配線板の銅箔上に印刷し、紫外線で
硬化したところ、塗膜の硬さが鉛筆硬度で4Hの試料が
得られた。この試料を塩化第2銅エッチング液に50℃
で30分間処理したところ、0.1〜1.0mm幅すべ
ての塗膜の状態にまったく異常がなかった。塗膜を50
℃の5%水酸化ナトリウム水溶液で溶解したところ、1
3秒で溶解した。The resin composition of the present invention is applied to a screen by 0.1, 0.15, 0.2, 0.3, 0.8, 1.0 m
Using a pattern having five m-widths each, printed on a copper foil of a printed wiring board by a screen printing method and cured with ultraviolet light, a sample having a pencil hardness of 4H was obtained. . This sample was placed in a cupric chloride etching solution at 50 ° C.
For 30 minutes, there was no abnormality in the state of all the coating films of 0.1 to 1.0 mm width. 50 coatings
When dissolved in 5% aqueous sodium hydroxide solution at
Dissolved in 3 seconds.
【0023】実施例2 ジョンソンJ−678(成分(A):ジョンソン(株)
製、α−メチルスチレンとアクリル酸の共重合物、重量
平均分子量7000、酸価(mgKOH/g)200、
軟化点146℃)2.96g,合成例1の化合物(B−
1)39.53g、合成例2の化合物(B−2)10.
58g、メタクリルアミド(C)6.92g、2−ヒド
ロキシプロピルメタクリレート(1官能(メタ)アクリ
レートモノマー(D))4.94g、ベンジルジメチル
ケタール(光重合開始剤(E))3.95g,シャニン
ブルー0.5g、モダフロー0.99g及びタルク2
9.64gからなる組成物を均一に混合した後、実施例
1と同様に,混練、印刷、硬化し、塗膜の硬さが鉛筆硬
度で3Hの試料が得られた。Example 2 Johnson J-678 (Component (A): Johnson Co., Ltd.)
Copolymer of α-methylstyrene and acrylic acid, weight average molecular weight 7000, acid value (mgKOH / g) 200,
(Softening point 146 ° C) 2.96 g, compound of Synthesis Example 1 (B-
1) 39.53 g, compound (B-2) of Synthesis Example 2
58 g, 6.92 g of methacrylamide (C), 4.94 g of 2-hydroxypropyl methacrylate (monofunctional (meth) acrylate monomer (D)), 3.95 g of benzyldimethyl ketal (photopolymerization initiator (E)), Shanin Blue 0.5g, Modaflow 0.99g and Talc 2
After uniformly mixing 9.64 g of the composition, kneading, printing, and curing were performed in the same manner as in Example 1, and a sample having a pencil hardness of 3H was obtained.
【0024】この試料を塩化第2銅エッチング液に50
℃で30分間処理したところ、0.1〜1.0mm幅す
べての塗膜の状態にまったく異常がなかった。塗膜を5
0℃の5%水酸化ナトリウム水溶液で溶解したところ、
18秒で溶解した。This sample was placed in a cupric chloride etching solution for 50 days.
When treated at 30 ° C. for 30 minutes, there was no abnormality in the state of all the coating films having a width of 0.1 to 1.0 mm. 5 coatings
When dissolved in a 5% aqueous sodium hydroxide solution at 0 ° C.,
Dissolved in 18 seconds.
【0025】比較例1 プロピレングリコール80g(1.05モル)とイソフ
タル酸25g(0.15モル)と無水マレイン酸99g
(0.85モル)とを仕込み、N2 ガス雰囲気中50〜
200℃で18時間、反応させ得られた軟化点60.5
℃、酸価53のポリエステルを4.4g、合成例1の化
合物25.61g、合成例2の化合物24.88g、カ
ルビトールアクリレート7.32g、2−ヒドロキシプ
ロピルメタクリレート2.93g、ベンジルメチルケタ
ール3.90g、シャニンブルー0.5g,モダフロー
0.99g、タルク29.27gからなる組成物を均一
に混合した後、実施例1と同様に、混練、印刷、硬化
し、塗膜の硬さが鉛筆硬度で3Hの試料が得られた。Comparative Example 1 80 g (1.05 mol) of propylene glycol, 25 g (0.15 mol) of isophthalic acid and 99 g of maleic anhydride
(0.85 mol) in an N 2 gas atmosphere.
Softening point 60.5 obtained by reacting at 200 ° C. for 18 hours.
C., 4.4 g of polyester having an acid value of 53, 25.61 g of the compound of Synthesis Example 1, 24.88 g of the compound of Synthesis Example 2, 7.32 g of carbitol acrylate, 2.93 g of 2-hydroxypropyl methacrylate, and benzyl methyl ketal 3. .90 g, Shanin Blue 0.5 g, Modaflow 0.99 g, and talc 29.27 g were uniformly mixed, and then kneaded, printed, and cured in the same manner as in Example 1. A sample having a hardness of 3H was obtained.
【0026】この試料を塩化第2銅エッチング液に50
℃で30分間処理したところ、0.1〜1.0mm幅す
べての塗膜の状態にまったく異常がなかった。塗膜を5
0℃の5%水酸ナトリウム水溶液で溶解したところ、3
0秒で膨潤剥離した。This sample was placed in a cupric chloride etching solution for 50 hours.
When treated at 30 ° C. for 30 minutes, there was no abnormality in the state of all the coating films having a width of 0.1 to 1.0 mm. 5 coatings
When dissolved in a 5% aqueous sodium hydroxide solution at 0 ° C., 3
It swelled and peeled in 0 seconds.
【0027】以上の実施例及び比較例の結果から明らか
なように、本発明の樹脂組成物の硬化物は、水性アルカ
リ液に可溶で、耐酸性が良好である。As is clear from the results of the above Examples and Comparative Examples, the cured product of the resin composition of the present invention is soluble in an aqueous alkaline solution and has good acid resistance.
【0028】[0028]
【発明の効果】本発明の樹脂組成物は、安定性が良好
で、その硬化物が、水性アルカリ液に可溶で、耐酸性が
良好であり、紫外線硬化型エッチングレジストインキに
適する。The resin composition of the present invention has good stability, and its cured product is soluble in an aqueous alkaline solution and has good acid resistance, and is suitable for an ultraviolet-curable etching resist ink.
フロントページの続き (51)Int.Cl.6 識別記号 FI G03F 7/033 G03F 7/033 H05K 3/06 H05K 3/06 H Continued on the front page (51) Int.Cl. 6 Identification code FI G03F 7/033 G03F 7/033 H05K 3/06 H05K 3/06 H
Claims (5)
式(1) 【化1】 (式(1)中、R1 ,R2 及びR3 は、H又はCH3 で
ある。)で表される化合物(B)、メタクリルアミド
(C)、1官能(メタ)アクリレートモノマー(D)及
び光重合開始剤(E)を含有することを特徴とする樹脂
組成物。1. A carboxyl group-containing copolymer (A) having the general formula (1): ## STR1 ## (Wherein R 1 , R 2 and R 3 are H or CH 3 in the formula (1)), methacrylamide (C), monofunctional (meth) acrylate monomer (D) And a photopolymerization initiator (E).
レン又はα−メチルスチレンと(メタ)アクリル酸の共
重合体である請求項1記載の樹脂組成物。2. The resin composition according to claim 1, wherein the carboxyl group-containing copolymer (A) is a copolymer of styrene or α-methylstyrene and (meth) acrylic acid.
と2−ヒドロキシエチル(メタ)アクリレートの反応物
である請求項1記載の樹脂組成物。3. The resin composition according to claim 1, wherein the compound (B) is a reaction product of tetrahydrophthalic anhydride and 2-hydroxyethyl (meth) acrylate.
である請求項1ないし3のいずれか一項記載の樹脂組成
物。4. The resin composition according to claim 1, which is used for an ultraviolet-curable etching resist ink.
脂組成物の硬化物。5. A cured product of the resin composition according to any one of claims 1 to 3.
Priority Applications (1)
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---|---|---|---|
JP27189597A JPH1192540A (en) | 1997-09-19 | 1997-09-19 | Resin composition and cured material obtained therefrom |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP27189597A JPH1192540A (en) | 1997-09-19 | 1997-09-19 | Resin composition and cured material obtained therefrom |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH1192540A true JPH1192540A (en) | 1999-04-06 |
Family
ID=17506399
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP27189597A Pending JPH1192540A (en) | 1997-09-19 | 1997-09-19 | Resin composition and cured material obtained therefrom |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007091945A (en) * | 2005-09-29 | 2007-04-12 | Fujifilm Corp | Ink composition, inkjet recording method, lithographic printing plate production method, and lithographic printing plate |
JP2007091826A (en) * | 2005-09-27 | 2007-04-12 | Fujifilm Corp | Ink composition, inkjet recording method, lithographic printing plate production method, and lithographic printing plate |
JP2009067926A (en) * | 2007-09-14 | 2009-04-02 | Fujifilm Corp | Ink composition for ink jet recording and ink jet recording method |
JP2016102138A (en) * | 2014-11-27 | 2016-06-02 | 互応化学工業株式会社 | Ultraviolet-curable composition for inkjet etching resist |
-
1997
- 1997-09-19 JP JP27189597A patent/JPH1192540A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007091826A (en) * | 2005-09-27 | 2007-04-12 | Fujifilm Corp | Ink composition, inkjet recording method, lithographic printing plate production method, and lithographic printing plate |
JP2007091945A (en) * | 2005-09-29 | 2007-04-12 | Fujifilm Corp | Ink composition, inkjet recording method, lithographic printing plate production method, and lithographic printing plate |
JP2009067926A (en) * | 2007-09-14 | 2009-04-02 | Fujifilm Corp | Ink composition for ink jet recording and ink jet recording method |
JP2016102138A (en) * | 2014-11-27 | 2016-06-02 | 互応化学工業株式会社 | Ultraviolet-curable composition for inkjet etching resist |
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