JPS58220497A - Method of producing electronic circuit board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of manufacturing an electronic circuit board in which an electronic circuit is formed on an electrically insulating substrate.

In recent years, the demand for smaller and lighter electronic devices has been increasing, and the trend toward high-mix, low-volume production has also become stronger.
be. Therefore, in order to meet the above-mentioned demands, the electronic circuits that make these devices function require high-density packaging of component circuit elements. For example, when forming a conductor circuit, follow the pattern specified by the circuit design information.
The desired circuit is formed by etching the copper foil of the copper foil-clad laminate. On the other hand, regarding resistors, capacitors, etc.
A method is adopted in which so-called chip resistors and chip capacitors having a size of several m/lF1 are supplied using a depth mounter, and fixedly connected to a conductor circuit by soldering. Furthermore, when forming an electronic circuit similar to the above on a highly reliable ceramic substrate such as an alumina substrate, a conductive paste for high-temperature firing is screen printed, and this is fired at a high temperature to form a conductor circuit. A method has been adopted in which a glaze resistor paste is screen printed in between, and the same is fired at a high temperature to form a resistor.

In these conventional manufacturing methods, to give a typical example of forming a conductive circuit on the surface of a board, a mesh screen is used to print photoresist ink on copper foil, or a conductive paste is screen printed. It is indirectly formed through a screen having a predetermined pattern, such as a negative pattern. However, such a method requires a kind of pre-process of forming a negative pattern on a screen in advance. In addition, the above method is suitable for mass production of conductor circuits with the same pattern, but in order to change the pattern, it is necessary to change the negative pattern on the screen. Similar to the trend of electronic devices, it is difficult to respond quickly to the trend of producing a wide variety of electronic circuits in small quantities.

The present invention provides a novel method for manufacturing a Gamico circuit board that solves the above problems. The gist of the present invention is to directly draw a predetermined circuit pattern on a substrate on which an electronic circuit is to be formed, based on circuit design information, without using a negative pattern as in the conventional example.

Hereinafter, the method for manufacturing an electronic circuit board according to the present invention will be explained in detail based on the drawings.

FIG. 1 is a block diagram for explaining each process in an embodiment of the present invention. In Figure 1,
1 is a supply means, 2 is a drawing means, 3 is a processing means, 4 is a first
, 6 is a trimming means, 6 is a second inspection means, 7 is a traveling means, and 8 is a control means.

In the present invention, as an electrically insulating substrate for forming an electronic circuit, a substrate made of a ceramic material such as alumina, glass, or wax, or a resin material such as phenol, epoxy, polyester, or polyimide may be used. I can do it. However, in the following description, a ceramic substrate will be explained as a representative example.

In the method for manufacturing an electronic circuit board according to the present invention, the step of supplying the substrate is included as a first step. The supplying means 1 used in the above-mentioned supplying process consists of a mechanical system, such as an arm having a vacuum suction plate in its rough portion, for mounting a ceramic substrate on a traveling system such as a belt conveyor, which will be described later.

Next, the second step constituting the method for manufacturing an electronic circuit board according to the present invention will be explained. In this second step, the drawing means 2 is used to directly apply paint, which will become a circuit element, in a linear manner to the position given by the circuit design information on the resin material board by the processing means described below. , a predetermined circuit pattern is written on the board.

As the drawing means 2, for example, there is a means for spraying the paint in the form of droplets onto a desired position on the substrate.

Specifically, a so-called ink jet recording head, the cross section of which is shown in FIG. 2, can be used. In the figure, reference numeral 11 denotes a base container of the recording head, and a diaphragm 12 is formed on the upper surface of the base container. 13,14
, 15 and 16 are a piezoelectric element, a discharge port, a pipe, and a pressure chamber, respectively.The pressure chamber 16 is airtightly constituted by a base container 11 and a diaphragm 12, and is filled with a circuit pattern writing paint through the pipe 16. There is.

To explain the function of the ink jet recording head, when an electrical pulse is applied to the piezoelectric element 13 and the diaphragm 12 deforms convexly toward the pressure chamber 16, the internal volume of the pressure chamber 16 decreases, the pressure increases, and the Paint is ejected from the outlet 14 and directly adheres to the substrate, thereby writing a circuit pattern. Naturally, the drawing means 2 uses the ejection ports 1 of the recording head according to the circuit pattern information.
A drive system for relatively moving the positional relationship between 4 and the above board within a two-dimensional plane, silver paint for conductor lines as a paint for adhering circuit elements, ruthenium oxide paint for resistors,
It includes a supply system for glass paint for forming an insulating film, a selection system for each paint, a control system for spraying amount, etc. However, it is preferable that the drawing means 2 is configured to apply the paint that is to become each circuit element, including the conductor lines, onto the substrate 1 in a linear manner rather than in a dotted manner.1 The reason for this is as follows. It is as follows.

For example, if paint is deposited in dots using a drawing head equipped with a plurality of drawing elements each having a narrow tube-shaped discharge port, multiple breakage points will occur in the circuit element, resulting in This is because it often happens that the circuit element cannot be a predetermined circuit element. In the recording head illustrated in FIG. 2, the movement of the recording head and the amount of paint sprayed are controlled so that each droplet of paint sprayed onto a predetermined position on the substrate overlaps each other and forms a line. good.

In particular, superimposing the droplets described above not only suppresses the characteristic values of each circuit element within the range required by the circuit design information, but also connects the circuit patterns provided on the front and back sides of the board. This is an important construction technique when configuring a conductor line in a through hole that penetrates the front and back sides of a substrate. That is, in this case, it is desirable to spray droplets of the conductor line paint in a superimposed manner many times immediately through the through hole.

Other examples of the drawing means 2 are shown in FIGS. 3 and 4. These utilize a drawing pen, and in FIG. 3, 20 is a drawing pen, 21 is a pen made of zaphire, 22 is a pen holder, 23 is a paint conduit, and 24 is a pipe. Further, 30 indicates a substrate. Figure 4 shows the drawing pen 20
31 is a paint reservoir, 32 is a paint delivery pump, 33 is a paint delivery pressure regulator,
34 is a paint delivery amount regulator.

To explain the functions of the above drawing pen, the paint delivery pump 3
The paint is sent to the paint reservoir 31 through the paint reservoir 31, but compressed air acts on the paint surface of the paint reservoir 31, and the pressure is controlled by the regulator 33, so that the paint delivery pressure is maintained at a predetermined value. There is. With this pressure, paint is delivered to the drawing pen 20, and there is a delivery amount regulator 34 in the delivery path to control the amount of paint delivered to the drawing pen 20 according to circuit design information. The paint sent from the drawing pen 29PC passes through the paint conduit 23 and is applied directly to the board 30 by the pen 21, thereby writing a circuit pattern. In the other examples of the drawing means shown in FIGS. 3 and 41, it is necessary that the paint to be each circuit element, including the conductor lines, be applied linearly to the substrate.

Next, the third step of the present invention will be explained.

The ceramic substrate to which the circuit elements are attached is relatively moved to the position of the processing means 3 by the traveling means 7. This processing means 4 is a means for converting paint into circuit elements. As a specific example, if the paint consists of a conductor paint containing silver powder, glass frit powder, and a vehicle, or a ruthenium oxide paint for resistors containing ruthenium oxide powder, glass frit, and a vehicle, (1) Leveling (2) leave it in the air at room temperature for 6-16 minutes for drying; (2) leave it in the air at 100-150℃ for 10-10 minutes to dry
Step of leaving for 15 minutes, (3) 5-1 in air at 700-900℃ for firing
The heating treatment step includes holding the temperature for 0 minutes, and heating the temperature in cycles of 30 to 60 minutes/temperature, including temperature rise and fall before and after reaching the above temperature. Through the manufacturing steps as described above, the paint applied to the substrate is converted into a conductor line or a resistor as a circuit element. In the present invention, the above step is indispensable, and if this step is omitted, the characteristic value of the circuit element body often deviates greatly from a predetermined value, resulting in a significant decrease in yield.

Next, the fourth step of the present invention includes the first inspection means 4. In this step, the characteristic values of the circuit element body formed in the third manufacturing step are compared and recognized with predetermined circuit design values. The data obtained here is sent to a control means 8, which will be described later, and is used to control the drawing means 2 and the trimming means 6 used in the next step.

The inspection means 4 includes not only means for measuring the electrical characteristics of individual resistors and capacitors, but also insulation characteristics between conductor wires,
Alternatively, if the formed circuit has a filtering effect, it includes a measuring means for inspecting frequency characteristics, gain, etc., and performing various measurements according to commands required by the circuit design.

The sixth step of the invention includes trimming means 5. The specific configuration of this step is a means having a function of removing or cutting a part of the circuit element body, such as a laser beam, an electron beam, or a force/twist.

It consists of a cutting tool and a means for driving and controlling these tools.

The function of this process is to delete or cut a part of the circuit element body in order to correct or modify the characteristic value of the circuit element body based on the inspection results of the previous process. In the manufacturing method, since the inspection results of the previous process are always fed back to the drawing means 2, the corrections in this process are trivial.

As the final step in the method for manufacturing an electronic circuit board according to the present invention, a second inspection step is included, in which the electronic circuit on the electrically insulating substrate is formed by the inspection means 6 based on the circuit design information. The manufacturing method of the present invention includes the following two means in addition to the above-mentioned means.

The first is to follow the above processing order between each of the above means,
This traveling means 7, which is a traveling means 7 for moving the substrate, can be operated by a control means 8, which will be described later, based on circuit design information. Specifically, it is a belt conveyor for main movement of the substrate. and drawing means 2. It consists of a robot arm, etc. for setting the substrate on the processing means 3 etc. from the conveyor.0Of course, the above-mentioned movement is relative, and the substrate is fixed and each of the above means is sequentially moved to the substrate position. It may be configured so that it can run.

The second means is a control means 8 that controls each means used in the method of manufacturing an electronic circuit board according to the present invention. The role of the control process has already been described to some extent, but it is to control the operations of the processing means 3 and the traveling means 7, mainly the drawing means 2, based on circuit design information. The specific configuration of this control means 7 consists of a control means main body centered on a microcomputer, an interface and a pass line connecting each handheld device to be controlled, and a circuit design for a board flowing through each manufacturing process. It plays a major role in constructing a circuit pattern based on information by directly applying paint as a circuit element raw material. The flow is not limited to the above-mentioned flow, for example, it is also possible to repeatedly flow between the drawing means 2 and the processing means 3 multiple times. By doing this, it is possible to form circuits not only on the front side of the substrate but also on the back side, to form capacitors formed by stacking conductors and dielectrics in multiple layers, and even to make a part of the main surface of the board multilayer wiring. This makes it possible to create a wide variety of circuit configurations.

Ultimately, the essential requirements of the method for manufacturing an electronic circuit board according to the present invention can be summarized in the steps performed in the area surrounded by the broken line in FIG. Therefore, within the scope of the above-mentioned steps, the scope of the present invention also includes cases where other additional steps are included.

As is clear from the above description, the method for manufacturing an electronic circuit board according to the present invention can easily control circuit formation on a board even when there are various types of circuit design information1, and has great industrial value. It is something that you have.

[Brief explanation of the drawing]

FIG. 1 is a block diagram for explaining each process in an embodiment of the present invention, FIG. 2 is a sectional view of essential parts showing an example of an ink jet recording head used in the drawing process of the present invention, and FIG. 3 is the same. FIG. 4 is a sectional view of a main part showing an example of a drawing pen, and FIG. 4 is a configuration diagram of a main part showing an example of a paint delivery section of the drawing pen of FIG. 1... Supply means, 2... Drawing means, 3
...Processing means, 4...First inspection means, 6...Trimming means, 6...Second
inspection means, 7... traveling means, 8...
Control means, 11...Head, 12...
Diaphragm, 13...Piezoelectric element, 14...
...Discharge port, 15...Pipe, 16...
...Pressure chamber, 21...Pen, 2.2...
・Pen holder, 23...Paint conduit, 24...
... Pipe, 30 ... Board, 31 ...
...Paint reservoir, 32...Paint delivery pump, 33
...Paint delivery pressure regulator, 34...Paint delivery amount regulator. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 1
figure

Claims (1)

[Claims] A supply process for supplying an electrically insulating substrate that will serve as a base for forming circuit elements, and a step of applying paint as a material that will become a circuit element directly to the surface of the substrate in a line shape to a predetermined thickness. A drawing step in which a predetermined circuit pattern is written on the substrate, a processing step in which paint linearly adhered on the substrate is converted into circuit elements, and characteristic values of the circuit elements formed on the substrate are converted into predetermined values. In order to correct the characteristic value of the circuit element to the design value based on the first inspection step for comparison with the design value and the inspection result in the first inspection step, a part of the circuit element is corrected to the design value. It is characterized by forming an electronic circuit directly on the substrate, including a trimming step for erasing the circuit elements, and a second inspection step for comparing and recognizing the characteristic values of the circuit elements corrected in the trimming step again with predetermined design values. A method for manufacturing an electronic circuit board.