JPH08222475A - Manufacture of thick film-type electronic component - Google Patents

Abstract

PURPOSE: To enable a single device to form thick films various in shape and size in a manufacturing process wherein an electronic component as a laminated chip capacitor where a thick film such as an electrode or the like is formed on the surface of an insulating board is manufactured. CONSTITUTION: Thick film ink such as conductive ink 3 or the like is applied onto the pattern of an inner electrode or the like formed on a material sheet B by spraying through an ink jet device, and after processes, where the material sheet B is bonded by pressure, cut off, and burned, and side electrodes are formed, are carried out.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to the production of thick film electronic parts such as multilayer chip capacitors and chip resistors, which are formed by forming thick films such as electrodes and resistance films on the surface of an insulating substrate made of ceramic or the like. It is about the method.

[0002]

2. Description of the Related Art As shown in FIGS. 9 (d) and 9 (e), a multilayer chip capacitor A as an example of a thick film type electronic component has an insulating cover A1 and a large number of insulating substrates (dielectric substrates) A.
2 are laminated and pressure-bonded to each other, and the internal electrodes A3 are formed on the surface of each insulating substrate A2 so as to be exposed alternately on the left and right side surfaces. The structure is A4.

A large number of laminated chip capacitors are manufactured at once through the following steps.
That is ,. A large number of unfired ceramic sheets (green sheets) B in a state where a large number of insulating substrates A2 are vertically and horizontally aligned and connected to each other are manufactured by the number of layers of the insulating substrate A2, and each insulating substrate A2 on the surface of each ceramic sheet B is formed. A conductive ink (paste) is applied to the corresponding portion according to the pattern of the internal electrode A3, and then the ink is dried. ． By laminating each ceramic sheet B and the ceramic cover sheet C and pressing them while heating them with a pressing device, a laminated plate D having a large area is formed. ． By cutting the laminated plate D along the vertical and horizontal cutting lines E and F, a large number of capacitor semi-finished products are cut. ． A large number of capacitors are placed in a firing furnace and fired at a high temperature. ． After the side surface of each fired semi-finished capacitor is polished, the side surface electrode A4 is formed by applying a conductive paste on the side surface and drying the side surface electrode A4, thereby forming a finished capacitor A. Are manufactured in the steps described above (it goes without saying that there are other various steps such as plating, inspection, printing of marks, etc. in addition to these steps).

To apply the pattern of the internal electrodes A3 to each ceramic sheet B, conventionally, screen printing using a screen mask 21 is used as shown in FIGS. That is, a screen mask 21 having a pattern corresponding to the pattern of the internal electrodes A3 is prepared, and the ceramic sheet B is placed on the table 22.
, The screen mask 21 is superposed on the upper surface thereof, the ink (paste) G is applied onto the screen mask 21, and then the squeegee 23 is applied to the upper surface of the screen mask 21 to move the screen mask 21. The ink G is applied to the representation of the ceramic sheet B according to the pattern.

[0005]

By the way, there are various types of multilayer chip capacitors A having different outer dimensions, shapes, electrostatic capacities and the like. Therefore, if the types of the multilayer chip capacitors A are different, the ceramic chip B is coated with different types. The patterns of the internal electrodes A3 to be deposited are also different (the patterns of the internal electrodes A3 in the ceramic sheets B adjacent to each other in the upper and lower phases are alternately deviated, so that two types of screen masks 21 are required even for the same type).

However, in the conventional method of coating the pattern of the internal electrodes A3 on the ceramic sheet B by screen printing, only one pattern can be printed by one screen mask 21, so that various kinds of multilayer chip capacitors A can be used. In order to manufacture the screen mask 21, it is necessary to prepare the type of the screen mask 21 which is twice as many as the type of the multilayer chip capacitor, and it is necessary to replace the screen mask 21 frequently.
There was a problem that management of 3 would take a lot of effort.

Further, there is a problem that the screen printing method has a limitation in printing accuracy and it is difficult to print a fine pattern or a sharp contour. On the other hand, the chip resistor is also made of a ceramic sheet having a large area in which a large number of insulating substrates are vertically and horizontally connected, and a pattern of a resistance film is applied by screen printing on the ceramic sheet, followed by firing. Since the process is performed by cutting each resistor, the same problem as in the multilayer chip capacitor occurs.

The present invention has been made in view of the problems of the thick film forming technique for such electronic parts, and provides a method capable of manufacturing a large number of kinds of electronic parts with one kind of manufacturing apparatus. The purpose is to do.

[0009]

In order to achieve this object, the present invention provides an "ink-jet printing on a surface of a material sheet such as a ceramic sheet forming a dielectric substrate or an insulating substrate in an electronic component such as a chip capacitor or a chip resistor. By ejecting with a device, a thick film forming ink such as a conductive ink or a resistance film ink is applied to a pattern of a thick film such as an electrode or a resistance film, and then the ink is dried or baked to form an electrode or A thick film such as a resistance film is formed ".

In this case, the ink may be applied to one material sheet by one ink jet device, or the ink may be applied simultaneously to one material sheet by a group of ink jet devices. good. Needless to say, the present invention also includes a method of manufacturing an electronic component in which thick films are formed on both surfaces of an insulating substrate.

[0011]

According to this structure, the ink for the electrode and the resistance film is ejected from the ink jet device toward the material substrate while the ink jet device and the material sheet are moved relatively to each other, Ink can be applied to the sheet according to the pattern of the electrodes, the resistance film or the like.

In this case, by controlling the movement direction and movement amount of the ink jet device, the ejection direction of ink, the movement of the material substrate, etc., the ink application location, area, or shape of the ink on the material sheet can be freely set. Because you can
Inks can be applied in arbitrary patterns to material sheets of various sizes by a stand or a group of inkjet devices.

As described above, according to the present invention, it is not necessary to prepare many kinds of ink jet devices according to the kind of electronic parts, and one sheet or a group of ink jet apparatuses can form thick films of various patterns as material sheets. Since it can be formed by coating, it has the effect of reducing the labor required for managing the manufacturing apparatus. In addition, the inkjet device does not contact the material sheet and does not require frequent replacement of members as in screen printing, which also has an effect of reducing maintenance work.

Further, according to the ink jet method, a thick film pattern such as an internal electrode can be formed with high dimensional accuracy, so that the quality of electronic parts can be improved. In addition, since the areas of the patterns such as the internal electrodes and the resistance film can be finely changed, it is possible to freely set the capacitance and the resistance value.

[0015]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, an embodiment in which the present invention is applied to a method of manufacturing a multilayer chip capacitor A will be described with reference to the drawings. First,
As shown in FIG. 1, a large number of ceramic sheets B (green sheets) 1 are manufactured in the same manner as in the conventional case, each ceramic sheet B is placed on the table 1, and the table 1 is intermittently moved in the X direction. The pattern of the internal electrode A3 as shown in FIG. 2 is printed by reciprocating the inkjet device 2 in the Y direction and ejecting fine particles of the conductive ink 3. It should be noted that the ink 3 contains an infinite number of minute conductor powders having a particle size of 1 μm or less, and by joining these fine powders, conductivity is imparted as a whole.

As the ink jet device 2, various types used in, for example, an ink jet printer can be used. As an example thereof, a Kaiser type inkjet device 2 is shown in FIGS. 3 and 4, and this Kaiser type inkjet device 2 includes an ink tank 4 and a large number of nozzles 5 as shown in FIGS. ing.

A vibrating plate 6 is stretched on the inner surface of each nozzle 5, and the vibrating plate 6 is vibrated by a piezoelectric element 7 to change the volume of the ink chamber 4 in the nozzle 5. The fine particles of the ink 3 are jetted onto the surface of the ceramic sheet B by the pressure difference. A drive circuit controlled by the control circuit is connected to the piezoelectric element 7. In this case, a pulling-out method in which fine particles of the ink 3 are ejected when the diaphragm 6 is pushed into the ink chamber 8 and then returned, and the ink 3 is ejected when the diaphragm 6 is pushed out of the ink chamber 8.
Although there is a push-pushing method in which the particles are jetted, a pull-pushing method is preferable from the viewpoint of accuracy.

The plurality of nozzles 5 are arranged in an inclined shape along a direction inclined with respect to the moving direction (Y direction) of the ink jet device 2, and the table 1 of the table 1 is intermittently moved while being moved in the X direction. Inkjet device 2 in the stopped state
By reciprocating in the Y direction and ejecting the particles of the ink 3 from each nozzle 5, the ink 3 can be applied to the surface of the ceramic sheet B in the pattern of the internal electrode A3. In this case, by controlling the movement of the table 1, the movement of the inkjet device 2, and the ejection of the ink 3 from each nozzle 5, the pattern of the internal electrode A3 can be set to an arbitrary shape and size.

After the pattern of the internal electrodes A3 has been formed on the surface of the ceramic sheet B in this manner, the ink is dried and then laminated by the conventional steps such as pressure bonding and cutting as shown in FIG. 8 (c). The chip capacitor A is manufactured. However, since the pattern of the internal electrode A3 can be variously formed by one type of the inkjet device 2, the labor for managing the manufacturing device is significantly reduced as compared with the conventional manufacturing method in which a large number of types of screen masks must be prepared. You can do it. Further, since the inkjet device 2 is a non-contact type, it has high durability, and therefore the time and effort for replacement can be reduced.

Further, according to the ink jet method, the pattern of the internal electrode 3 can be formed in a fine shape and a sharp contour, in other words, the internal electrode A3 can be formed with high dimensional accuracy.
Since the pattern can be formed, the quality of the multilayer chip capacitor A can be improved, and the capacitance can be freely set by minutely changing the area.

In the above embodiment, the table 1 is moved in the X direction to move the ink jet device 2 in the Y direction. However, as shown in FIG. 5A, the table 1 is moved in the X direction. The inkjet device 2 may be fixed by moving the inkjet device 2 in the X direction and the Y direction, as shown in FIG. 5B. May be.

The ink jet device 2 that can be used in the present invention is not limited to the Kaiser type as described above, and various other types can be used. For example, a Verdun type as shown in FIG. 6 may be used. This Figure 6
Shows only the nozzle 5 of the inkjet device,
A filter 9 is mounted inside the tapered nozzle 5, and the piezoelectric element 7 is arranged at a portion of the nozzle 5 closer to the tip than the filter 9. The piezoelectric element 7 is driven by the drive circuit 10.

Further, as shown in FIG. 7, a beam jet type ink jet device 2 utilizing an air flow may be used. In FIG. 7, reference numeral 11 is an ink tank, reference numeral 12 is an ink chamber, reference numeral 13 is an air pump, and a plurality of ink ejection ports 14 are formed in the front surface of the ink chamber 12,
An air chamber 16 is formed by providing a case 15 so as to surround these ink ejection ports 14.

Further, the case 15 has each ink ejection port 1
4, the air discharge port 17 is opened, and the bias electrode 18 is arranged on the surface of the case 15.
The ink chamber 12 is connected to the ink tank 11, and compressed air is sent to the ink tank 11 and the ink chamber 12 by an air pump 13. A control electrode 19 is provided at each ink ejection port 14 in the ink chamber 12.

In FIG. 7, the ink 3 in the ink chamber 12 is ejected from the ink ejection port 14 by air pressure and electrostatic force.
Further, the air flows from the air discharge port 17 and is ejected in a liquid columnar state to adhere to the surface of the ceramic sheet B. In addition,
By inclining the arrangement direction of the nozzles 5 with respect to the reciprocating direction of the inkjet device 2, it is possible to apply the ink at a high density.

The present invention is not limited to the ink jet device 2 as described above. For example, a charge control type in which ink is ejected from a nozzle, the charge electrode charges the ink, and then the deflection electrode controls the flight direction of the ink. Various other forms can be used. Further, as the ink, one that is solid at room temperature and liquefies when heated may be used, and a nozzle and a tank may be provided with heaters to eject the ink in a molten state. This has the advantage that the ink can be dried quickly.

Further, a plurality of ink jet devices 2 may be arranged on one table, which has an advantage that efficiency can be improved. In this case, as shown in FIG.
A large number of inkjet devices 2 may be arranged so as to extend in an inclined shape in a plan view, and the inkjet devices 2 may be reciprocally moved all at once. In this way, even if the ink jet device 2 has a large width, There is an advantage that the internal electrode A3 having the pattern can be formed with high efficiency.

The present invention can be applied not only to the multilayer chip capacitor A but also to the general manufacture of electronic parts such as a chip resistor and a hybrid IC in which a thick film such as an electrode or a resistance film is formed on the surface of an insulating substrate. It is a thing.

[Brief description of drawings]

FIG. 1 is a perspective view showing an outline of an embodiment of the present invention.

FIG. 2A is a perspective view of a ceramic sheet B coated with a pattern of internal electrodes by the method of FIG. 1, and FIG. 2B is an enlarged view showing a coated state of ink fine particles.

FIG. 3 is a partial cross-sectional view showing the principle of a Kaiser type inkjet device.

FIG. 4 is a bottom view taken along the line IV-IV in FIG.

FIG. 5 is another example diagram showing the movement relationship between the inkjet device and the ceramic sheet mounting table.

FIG. 6 is a cross-sectional view showing the principle of another inkjet device.

FIG. 7 is a cross-sectional view showing the principle of still another inkjet device.

FIG. 8 is a diagram showing another example of the arrangement state of the inkjet devices.

9A to 9D are diagrams showing an outline of a manufacturing process of a multilayer chip capacitor, and FIG. 9E is a sectional view taken along line ee of FIG. 9D.

FIG. 10 is a perspective view of a device used for a screen printing method which is a conventional example.

FIG. 11 is a partial cross-sectional view showing a state in which a pattern of internal electrodes is printed on a ceramic sheet by screen printing.

[Explanation of symbols]

 A Multilayer chip capacitor A2 Insulating substrate A3 Internal electrode 1 Table 2 Inkjet device 3 Ink 4 Ink tank 5 Nozzle 7 Piezoelectric element

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification code Office reference number FI technical display location H01G 4/33 7924-5E H01G 4/06 101

Claims (2)

[Claims] 1. A conductive ink or an ink for a resistance film by jetting with an ink jet device onto the surface of a material sheet such as a ceramic substrate which constitutes a dielectric substrate or an insulating substrate in electronic parts such as a chip capacitor and a chip resistor. A thick film such as an electrode or a resistance film is applied to a pattern of a thick film such as an electrode or a resistance film, and then the ink is dried or baked to form a thick film such as an electrode or a resistance film. Method for manufacturing film type electronic component. 2. The thick film type electronic component according to claim 1, wherein the thick film electronic component is a multilayer chip capacitor formed by stacking a plurality of insulating substrates having internal electrodes formed on their surfaces and press-bonding the insulating substrates. A large number of unsintered ceramic sheets aligned and connected to each other were manufactured, and conductive ink was applied to the pattern of the internal electrodes by an inkjet device on the surface of each ceramic sheet corresponding to each insulating substrate. Then, the multilayer chip capacitor as a thick film type electronic component is characterized by performing the following steps such as a step of cutting the multilayer body into a single chip capacitor, a pressure bonding and firing of the plurality of ceramic sheets, and a formation of side electrodes. Manufacturing method.