JPS58215802A - Package for mic - Google Patents

Abstract

PURPOSE:To improve the performance, by providing holes of waveguide construction through each of which an end of a microstrip line of a high frequency input/output terminal is projected and an airtight sealing cover for an entrance/ exit of a waveguide, for improving the heat dissipating effect. CONSTITUTION:A package main body 20 for airtight sealing forming a recess 201 at the center of which an MIC is mounted is provided with a DC bias terminal 4 for the MIC and a signal transmitting terminal 5. Further, a hole 203 of waveguide construction is formed at both ends of the main body 20 in lengthwise direction, an expanding slot 204 is formed on a partition wall between the hole 203 and the recess 201 and a notch 202 is formed at the end of the main body 20 in broadwise direction. A microstrip line 22 of a high frequency input/output terminal is formed at each expanding slot 204 between the hole 203 and the recess 201, the upper part of the main body 20 is covered with a metallic cover and the hole 204 of waveguide construction is sealed airtightly with a window of a quartz glass 23. Further, a part or all of the waveguide construction is filled in with a dielectric for improving the heat dissipating effect.

Description

[Detailed Description of the Invention] TECHNICAL FIELD OF THE INVENTION The present invention relates to an improvement of a MIC package, and in particular, to forming high frequency input/output terminals with microstrip lines,
The present invention relates to a MIC package in which a waveguide is hermetically sealed.

(b) Conventional technology and problems A conventional MIC package has multiple carriers mounted in one housing, which are cascaded and then hermetically sealed. Figure 1 shows a perspective view of the MIC package. .

In the figure, 1 is a sieve body made of metal such as copper (011) and has a recess 11 in the center, 2 is a carrier, and 3
4 is a terminal for high frequency input/output, 4 is a DC bias terminal, 5 is a terminal for signal transmission, and 6 is a lid made of metal such as copper (Cu).

A high-frequency input/output terminal 3 is provided in the housing l in which a recess 11 is formed. D
After the C-bias terminal 4 and the signal transmission terminal are each hermetically sealed, a dielectric substrate is mounted on the metal plate, and a plurality of carriers 2 carrying active elements such as semiconductor devices are mounted on the dielectric substrate. After making a cascade connection, the lid 6 was fitted onto the housing 1 and welded to form an airtight seal. However, if the frequency is high (for example, 1
20H2 or more), the method of connecting the carriers becomes a problem, and it becomes difficult to maintain good connection impedance matching.

((3) Purpose of the Invention In view of the above conventional problems, the present invention forms packages in which carriers are individually mounted, connects the packages with microstrip fins and waveguides, and connects the waveguides with air. The purpose is to provide a sealed MIC package.

(d) Structure of the Invention In order to achieve the above-mentioned object, the present invention has an M construction in the central part.
The MTC is placed in a hermetically sealed housing with a recess for mounting the
In the MIC package provided with terminals for DC bias, signal transmission, and high frequency input/output, the high frequency input/output terminals are formed by a microstrip line, and an end of the microstrip line protrudes from the housing. This can be achieved by drilling holes in the waveguide structure and using airtight sealing lids at the entrance and exit of the waveguide, or by filling and sealing the waveguide with a dielectric material.

(e) Embodiments of the Invention Hereinafter, embodiments of the MIC package according to the present invention will be described in detail with reference to the drawings.

Fig. 2 is a perspective view for explaining one embodiment of the present invention, (a) is a perspective view, (b) is a sectional view, and (C) is a perspective view of the back side, and the same parts as the previous one are designated by the same reference numerals. 20 is a package body made of metal such as copper (011), and the package body 20 has a recess 201 in the center for mounting the carrier 2 and notches 202 on both sides in the width direction. A waveguide structure hole 208 is formed at both ends in the longitudinal direction, a split groove 204 is formed in the partition wall between the waveguide structure hole 203 and the recess 201, and a plurality of mounting holes 205 are formed around the package body 20. It was drilled. 21 is a lid made of metal such as copper (On), 22 is a microstrip fin serving as a high frequency input/output terminal, and 28 is a waveguide 203.
This is a window made of an insulating material such as a quartz glass plate that hermetically seals the window.

A four part 201 for mounting the carrier 2 is formed in the center of the package body 20, and a notch 2o2 is formed on both sides of the recess 201 in the width direction, and a DC bias terminal 4 and a signal transmission terminal 5 are connected to the wall part of the notch 2o2. Seal each with a hermetic seal. Then, holes 203 having a waveguide structure are bored at both ends in the longitudinal direction of the package body 2o, and a split groove 204 is formed in the partition wall between the hole 203 and the recess 201. The strip fin 22 is attached so that a part thereof protrudes into the waveguide 203. In this state, the carrier 2 carrying passive and active elements (not shown) is mounted in the recess 201, and is adhesively connected to the respective terminals 3.4 and the microstrip fins 22, and then the lid 21 is attached by welding or the like. Furthermore, an insulating material such as a quartz glass plate 28 is adhered to the waveguide 203 to seal it hermetically.

Although not shown, instead of the quartz glass plate, part or all of the waveguide 208 may be filled with a dielectric and hermetically sealed. By filling this dielectric, the waveguide 2
08 can be formed small, it is possible to downsize the package itself.

FIG. 3 is a side view for explaining a mounting example of the MXC package according to the present invention, and 30 is a metal such as copper (Cu).
), etc., and the hole 2 of the waveguide structure of Module/I/81.
82 is a tightening screw for screwing the module 81 onto the metal bake 30, and 38 is a waveguide for high frequency input/output.

Through-holes 801 for connecting a plurality of modules/l/31 with waveguides alternately on the front and back sides of the metal bake 30 are drilled.
01 with the tightening screw 82 so that the hole 203 of the waveguide structure (not shown) of the module/L'81 corresponds to the hole 203 of the module/L'81. A waveguide 83 is inserted into each insertion hole 801 corresponding to the high frequency input/output end of the array-connected modules/L'81.
All you have to do is attach the .

In this implementation example, three modules /L'81 are connected, but the number of modules /L'81 is not limited to three, and it is possible to have more than one module depending on the purpose.
Although the explanation was given in which one carrier 2 is mounted on the carrier 2, the structure may be such that two or three carriers are mounted depending on the circuit content.

(f) Effects of the Invention As is clear from the above explanation, the MIC package according to the present invention can better maintain connection impedance during module attachment and detachment in a high frequency range compared to conventional packages, and It has a good heat dissipation effect, which greatly contributes to improving properties, and has the additional effect of facilitating repair.

[Brief explanation of the drawing]

FIG. 1 is a perspective view for explaining a conventional MIC package, and FIG. 2 is a perspective view for explaining an embodiment of the MIC package according to the present invention. , (C) is a perspective view of the back side, and FIG. 8 is a MIC according to the present invention.
FIG. In the figure, l is a housing, 2 is a carrier, 8 is a high frequency input/output terminal, 4 is a DC bias terminal, 5 is a signal transmission terminal, 6 and 21 are lids, 11 and 201 are recesses, 20 is a package body, 22 is a microstrip fin, 2
3 is a quartz glass plate, 30 is a metal base, 202 is a notch, 203 is a hole in the waveguide structure, 204 is a split groove, 205 is a mounting hole, 31 is a module, 32 is a tightening screw, 83 is a waveguide , 301 indicate through holes, respectively. Figure 1 Figure 2. 2 Evening 1 Figure 3 ゛/20 05

Claims (1)

[Claims] (1) A DC bias for the MIC is placed in a hermetically sealed casing with a recess formed in the center to mount the MIC. In a MIC package provided with terminals for signal transmission and high frequency input/output, the high frequency input/output terminals are formed with microstrip lines, and the housing includes:
2) A package for MTCIC, characterized in that a hole in the waveguide structure is bored through which the end of the microstrip line protrudes, and an airtight sealing lid is attached to the entrance and exit of the waveguide. The MIC package according to claim 1, wherein the wave tube is hermetically sealed by filling part or all of the wave tube with a dielectric material.