JPS58214225A - 樹脂被覆電気装置の製造法 - Google Patents

樹脂被覆電気装置の製造法

Info

Publication number
JPS58214225A
JPS58214225A JP9872482A JP9872482A JPS58214225A JP S58214225 A JPS58214225 A JP S58214225A JP 9872482 A JP9872482 A JP 9872482A JP 9872482 A JP9872482 A JP 9872482A JP S58214225 A JPS58214225 A JP S58214225A
Authority
JP
Japan
Prior art keywords
resin
epoxy resin
parts
curing
mold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9872482A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0221086B2 (enrdf_load_stackoverflow
Inventor
野上　文夫
土橋　勝
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP9872482A priority Critical patent/JPS58214225A/ja
Publication of JPS58214225A publication Critical patent/JPS58214225A/ja
Publication of JPH0221086B2 publication Critical patent/JPH0221086B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Processes Specially Adapted For Manufacturing Cables (AREA)
  • Insulating Bodies (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Epoxy Resins (AREA)
  • Organic Insulating Materials (AREA)
JP9872482A 1982-06-07 1982-06-07 樹脂被覆電気装置の製造法 Granted JPS58214225A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9872482A JPS58214225A (ja) 1982-06-07 1982-06-07 樹脂被覆電気装置の製造法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9872482A JPS58214225A (ja) 1982-06-07 1982-06-07 樹脂被覆電気装置の製造法

Publications (2)

Publication Number Publication Date
JPS58214225A true JPS58214225A (ja) 1983-12-13
JPH0221086B2 JPH0221086B2 (enrdf_load_stackoverflow) 1990-05-11

Family

ID=14227462

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9872482A Granted JPS58214225A (ja) 1982-06-07 1982-06-07 樹脂被覆電気装置の製造法

Country Status (1)

Country Link
JP (1) JPS58214225A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06136092A (ja) * 1992-10-27 1994-05-17 New Japan Chem Co Ltd エポキシ樹脂組成物
JP2018517018A (ja) * 2015-05-19 2018-06-28 ハンツマン・アドヴァンスト・マテリアルズ・ライセンシング・（スイッツランド）・ゲーエムベーハー 熱硬化性エポキシ樹脂のための硬化剤ならびに電気工学用の絶縁系の製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06136092A (ja) * 1992-10-27 1994-05-17 New Japan Chem Co Ltd エポキシ樹脂組成物
JP2018517018A (ja) * 2015-05-19 2018-06-28 ハンツマン・アドヴァンスト・マテリアルズ・ライセンシング・（スイッツランド）・ゲーエムベーハー 熱硬化性エポキシ樹脂のための硬化剤ならびに電気工学用の絶縁系の製造方法

Also Published As

Publication number Publication date
JPH0221086B2 (enrdf_load_stackoverflow) 1990-05-11

Similar Documents

Publication Publication Date Title
JPH02117914A (ja) エポキシ樹脂組成物
US5041474A (en) Epoxy resin compositions for sealing semiconductor devices
JPS58198525A (ja) エポキシ樹脂組成物
JPH02300230A (ja) 電気部品及び電子部品用の注型材料
JPS58214225A (ja) 樹脂被覆電気装置の製造法
JPS6218565B2 (enrdf_load_stackoverflow)
JPS6119620A (ja) 液状エポキシ樹脂組成物
JPS6249292B2 (enrdf_load_stackoverflow)
JP2001288334A (ja) モールドコイル及びその製造方法
JPH1171503A (ja) エポキシ樹脂組成物及びこれを用いた電気機器の絶縁処理法
JPS6222825A (ja) 封止用樹脂組成物
JP2000086744A (ja) エポキシ樹脂組成物、インダクタンス部品および半導体封止装置
JPH10114815A (ja) エポキシ樹脂組成物および半導体封止装置
KR20030056495A (ko) 몰드변압기용 에폭시 수지 조성물 및 그의 제조방법
JP3115693B2 (ja) エポキシ樹脂組成物および半導体封止装置
JPH0249329B2 (enrdf_load_stackoverflow)
JPS60161423A (ja) 封止用樹脂組成物
JPS6222822A (ja) 封止用樹脂組成物
JPS62106920A (ja) 半導体封止用樹脂組成物
JPH0925328A (ja) エポキシ樹脂組成物および半導体封止装置
JPH093169A (ja) 封止用樹脂組成物および電子部品封止装置
JPS60207353A (ja) 樹脂封止型半導体装置
JPS6333416A (ja) 封止用樹脂組成物
JPH10292095A (ja) エポキシ樹脂組成物および半導体封止装置
JPH0997729A (ja) フライバックトランスおよびその製造方法