JPS5821148A - Inspecting device for working state - Google Patents

Abstract

PURPOSE:To inspect working states with high accuracy and efficiency by detecting the passage of an object to be inspected in a photosensor part, forming the image of the shadow in the leading end part of the material to be inspected on a photoelectric converting part, and comparing the result of operation of the pattern information thereof with a reference pattern. CONSTITUTION:When plural materials 1 to be inspected arrive at an optical sensor part 13 during passage through an inspection port 8, the light from a light source 9 is interrupted, and the output of a photodiode 12 changes. Said change is detected with an inspecting part 14, and the signal is applied to a lamp power source 16 and a scanning part 15. A lamp 17 emits light instantaneously and irradiates the leading end part of the materials 1. The shadow of the leading end part is imaged via a lens 19 on a photoelectric converting part 20. Said image is scanned by the part 20, and the digital signal thereof is converted to a series signal with a parallel to series converting part 21. The series signal is stored via a receiving part 23 in a storage part 24. The pattern information is processed in an arithmetic part, by which the working size is calculated and is compared with the reference pattern in an ROM26. The question whether the pattern is defective or nondefective is displayed 29. Thus the patterns are inspected with high accuracy and efficiency.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a machining state inspection device that automatically inspects the quality of the machined tip in a type of work that processes the tip of a linear object such as a brush flock or a comb blade. .

In order to prevent the tips of hair brushes from damaging the scalp, the tips of hairbrushes are generally heat-treated to make them spherical.

Conventionally, this type of inspection of the processed tip has been carried out by visual inspection through a magnifying lens or mechanical inspection by sequentially passing through a plurality of gauges. These methods require a large number of man-hours, the inspection speed is slow, and the inspection accuracy may not always be uniform, resulting in variations in the product. In addition, the inspection device has drawbacks such as the fact that the tip must be aligned to allow inflow.

The present invention aims to improve this point, and aims to provide a processing state detection device with high inspection accuracy and inspection efficiency.

The present invention includes an optical means arranged at a position where the inspected material passes and irradiates the inspected material, and a seven-tricks-shaped optical means arranged in a planar shape arranged on a surface where the shadow of the inspected material is imaged. A photoelectric conversion means consisting of an element, a signal output means for electrically scanning the pattern information of the shadow formed on the plane of the photoelectric conversion section and outputting it as an electric signal, and a signal output means for temporarily storing the output signal of this means. storage means, and information processing for comparing the pattern information of the shading stored in the storage means with preset reference pattern information and calculating and determining whether or not they match within an allowable dimensional accuracy. It is characterized by comprising means.

Further, it is preferable that the apparatus is provided with means for optically inspecting whether the inspected material has reached a predetermined imaging position, and the signal output means is configured to operate in synchronization with the output of this means.

Further, it is preferable to include means for continuously and automatically supplying the material to be inspected.

An embodiment of the present invention will be described based on the drawings.

FIG. 1 is a structural diagram of main parts showing the appearance of an embodiment of the present invention. FIG. 1 shows a material to be inspected 1, a detection device 2 that generates pattern information each time the material to be inspected 1 passes, and a detection device 2 that receives the pattern information generated by the detection device 2 via a signal line 3 and uses it as a reference. It is comprised of a control section 5 which compares the pattern with the pattern, determines whether it is within the allowable range, and outputs the result.

FIG. 2 is a detailed diagram of the detection device 2 and the control section 5. The detection device 2 is formed with an inspection opening 8 which is an opening in a ledger through which the inspected material 1 passes.

Approximately in the center of this inspection opening 8, there is a light source 9 provided below the opening, a light projecting lens 10 that projects the emitted light of this light source 9 into the inspection opening 8, and A light-receiving lens 11 provided above the light-receiving aperture, and a photodiode 1 optically coupled to the light-receiving lens 11.
An optical sensor section 13 consisting of 2 and 2 is provided.

The electrical output of the photodiode 12 in this optical sensor section 13 is led to a detection section 14. The output of this detection section 14 is led to a scanning section 15 and a lamp power supply 16, respectively.

A lamp 17 is connected to this lamp power source 16.

The light beam emitted by this lamp 17 is optically coupled to a projection lens 18. The light passing through the inspection port 8 is optically coupled to the light receiving lens 19 by the light projecting lens 18 . An optical system consisting of this lamp 17, a light projecting lens 18, and a light receiving lens 19 is arranged so that the tip of the object to be inspected 1 that blocks the light emitted from the optical sensor section 13 is located at a position where the light emitted from the lamp 17 is irradiated. Each has its own set of fish. At the imaging point of this light receiving lens 19, there is a photoelectric conversion section 20 consisting of a planar matrix photoelectric conversion element.
is located. The output of the scanning section 15 is led to the scanning input of the photoelectric/electronic converter 20. The electrical output of this photoelectric converter 20 is led to a parallel-to-serial converter circuit 21. This parallel-to-serial conversion circuit 21 includes the photoelectric 5-voltage conversion section 2.
0 is integrally formed. The output of this parallel-to-serial conversion circuit 21 is led to an amplifier section 22.

The output of this amplifying section 22 is led to a receiving section 23 in the control section 5 via a signal line 3. The output of this control section 23 is led to a storage section 24. This storage unit 24 has an arithmetic unit 2
5 is connected. This calculation unit 25 has a ROM (Rea) in which a reference pattern and a control program are stored.
d0nlyMemory) 26 is connected.

The output of this calculation section 25 is led to signal lines 28 to 30 via an interface section I7.

FIG. 3 is an enlarged view showing an example of the shadow of the tip of the object to be inspected 1 imaged on the photoelectric converter 2o. In FIG. 3, A indicates the maximum diameter of the tip, and B indicates the wire diameter at a point having a length of C from the tip.

The characteristic operation of the present invention having such a circuit configuration will be explained. The material to be inspected 1 is placed on a line with a predetermined interval (not shown).
will be placed in As this line moves, a plurality of materials 1 to be inspected are automatically and successively supplied to the inspection port 8 of the detection device 2 as shown in FIG. 1, and their tips are automatically and continuously inspected. It will be done.

Now, while the inspected material 1 is passing through the inspection port 8, the optical sensor section 1
When the position 3 is reached, the emitted light that is constantly projected into the inspection port 8 from the light source 9 is blocked by the inspected material 1. As a result, the output of the photodiode 12 changes. The detection section 14 detects this change and provides detection outputs to the lamp power supply and the scanning section 15, respectively.

As a result, the lamp 17 momentarily emits light and irradiates the tip of the inspected material 1 that has reached the optical sensor section 13. This irradiation light forms a shadow as shown in FIG. 3 on the photoelectric/air converter 20 through the light receiving lens 19. This image formation is synchronized with the scanning of the photoelectric converter 20, and the shaded areas shown in FIG. 3 are converted into black level signals, and the white areas in FIG. 5 are converted into white level signals. The digital signal converter information is converted into a serial signal by a parallel-to-serial converter 21, converted to a TTL level by a receiver 23, and then stored at a predetermined address in a storage 24.

This pattern information is read out by the calculation unit 25, and the data of the maximum diameter of the tip shown in FIG. 3A and the wire diameter shown in FIG. Calculated. This processing dimension d iJ ROM
25, and if it is within the allowable range, a "good" display is displayed on the signal line 28 via the interface section n, and if it is outside the allowable range, a "fail" display is displayed on the signal line 29. Ru. As a result, the inspected material 1 marked as "fail" is removed from the line either manually by the supervisor or automatically by another control device.

Here, the data to be recognized from the pattern information is the maximum diameter A of the tip, and the wire diameter B of a portion having a length C from the tip. Therefore, when an image is formed on the photoelectric converter 20, if the image forming position is within the image forming plane of the photoelectric converter 20, the image forming position will match, but even if it is not, it can be inspected. No adverse effects will occur. Therefore, the tips of the inspection object 1 do not need to be completely aligned when passing through the inspection port 80. During inspection, if the position of the tip of the material to be inspected 1 is greatly shifted and the image formation state is largely shifted on the photoelectric converter 20 and it is difficult to recognize A and B from the pattern information, a message to that effect is displayed on the signal line 30. will be done.

In addition, although the above embodiment shows a case where the machining dimensions are inspected based on the difference between the maximum diameter of the tip and the wire diameter at a predetermined position, it is also possible to detect distortion of the spherical shape of the tip from pattern information. , it is also possible to perform a highly accurate inspection by comparing this with a reference pattern in the ROM. Furthermore, it is not limited to the inspection of the tip of a linear material (by exchanging the contents of the ROM and changing the reference pattern, many types of inspections can be performed in the same way). A similar inspection can be performed on any material that can be clearly imaged onto the photoelectric conversion section by the irradiated light.

As explained above, according to the present invention, the passage of the material to be inspected is detected by the optical sensor section, and at the time of this detection, the shadow of the tip of the material to be inspected is imaged on the photoelectric conversion section to generate pattern information. Then, the calculation result of this pattern information is compared with the reference pattern to determine whether the machining dimensions are within the allowable range.

Therefore, the inspection of the inspected material can be carried out automatically and continuously.
It can also be done faster. Furthermore, since the inspection is performed using the calculation results of the pattern information, the inspection accuracy can also be arbitrarily selected. Furthermore, no gauges or the like are required, and the number of inspection steps can be reduced. In addition, the inspection accuracy is uniform, and the quality of gulped products can also be improved.

[Brief explanation of the drawing]

FIG. 1 is a diagram showing the appearance of an embodiment of the present invention. FIG. 2 is a detailed view of the embodiment. FIG. 3 is a diagram showing the imaging state of the embodiment. 1... Material to be inspected, 2... Inspection device, 3.27-29
...Signal line, 5.Control unit, 8.Inspection port, 9.
...Light source, 10.18...Lens for projection, 11.19
...Lens for light reception, 12...Photodiode, 1
3... Optical sensor section, 14... Detection section, 15...
Scanning unit, 16... Lamp power supply, 17... Lamp, 2
0... Photoelectric conversion section, 21... Amplification section, 23...
Memory section, 24... Performance 31 section, 25... ROM,
26...Interface section. Patent applicant: Kao Soap Co., Ltd. Representative Patent attorney: Naotaka Ide

Claims (3)

[Claims] (1) An optical means arranged at a position where the inspected material passes, and an optical means for irradiating the inspected material, and a matrix-like element arranged in a plane on the surface where the shadow of the inspected material is imaged. a photoelectric conversion means that outputs an electric signal from the photoelectric conversion means; a signal output means that electrically scans the pattern information of the shadow formed on the plane of the photoelectric conversion means and outputs it as an electric signal; and a signal output means that temporarily stores the output signal of this means. and an information processing means for comparing the pattern information of the shading stored in the storage means with preset reference pattern information to determine whether or not they match within an allowable dimensional accuracy. A machining condition inspection device equipped with (2) Claim No. 1 comprising means for optically detecting that the inspected material has reached a predetermined imaging position, and the signal output means is configured to operate in synchronization with the output of this means. Processing condition inspection device described in (1). (3) A processing state inspection device according to claim (2), which is provided with means for continuously and automatically supplying the material to be inspected.