JPS58209128A - Mounting method for package of semiconductor integrated circuit chip - Google Patents

Abstract

PURPOSE:To eliminate the need for the operation of plate extraction during the mounting process of the ceramic package, and to reduce man-hours by using a jig with a wide slit. CONSTITUTION:An Al plate is molded to a channel shape, and the jig 7, on an upper surface thereof a plurality of ceramic substrates 2 can be placed, is manufactured. A plurality of the slits 8 are formed in parallel to the upper surface 7a, a pitch L is made approximately the same as a distance P between the terminal of the substrate 2 and width b wider than that, and the terminals 9 are inserted loosely and the jig is formed to a shape that can be shared even to the substrate 2 of a different distance P. The height l of a side surface 7b is made higher than the extended length m of the terminal 9. According to the constitution, the ceramic substrate 2 can be solder-fusing and connected and flux- removed and washed as it is left as it is placed on the jig 7 under the state in which it suspends the terminals, re-transfer to the jig is unnecessitated, an IC chip 1 can be mounted to the substrate 2 in a continuous production line, and man-hours are reduced.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a semiconductor IC chip package mounting method in which the above steps are performed consistently between the steps of semiconductor IC chip ceramic package mounting without attaching or detaching the ceramic substrate from the jig.

The semiconductor IC chip is housed in a ceramic substrate, and the package mounting process is completed after passing through various processes such as solder melt connection, cleaning to remove 7x, and hermetic sealing with a ceramic cap. During this mounting process, the ceramic substrate beam is placed on a flow jig, but in the conventional Su70 jig, after the solder melting and connection process, the ceramic board is removed from the reflow jig, and a slack removal cleaning process is performed. υ again
70~ It is necessary to place it on a jig and carry out the next process, and there is a lot of setting and resetting handling between mounting processes, which not only lacks the uniqueness of the process, but also impairs the reliability of the semiconductor ICyC2. It had drawbacks.

That is, as shown in FIG. 1, a semiconductor IC chip 1 (hereinafter referred to as an IC't tube) is housed in a box-shaped ceramic substrate 2 whose upper side is open.

A plurality of terminals 9 are provided on both end surfaces of the ceramic substrate 2, and these terminals 9 extend from the bottom end of the ceramic substrate 2.

Conventionally, as the flow jig 6 for supporting the ceramic substrate 2, a channel-shaped one having a width slightly smaller than the distance P between the terminals 9 provided on both sides of the ceramic substrate 20 has been used. The bottom surface of the reflow jig 6 is placed on the upper surface side of the reflow jig 6, and the reflow jig 6 is supported so as to sandwich the width of the reflow jig 6 between the terminals 9. Therefore, the reflow jig 6 and the ceramic substrate 2 and its terminals 9 are closely engaged.

As shown in FIG. 2, there are solder balls 4 on the IC chip 1.
is formed, and a solder pedestal 3 is also formed on the ceramic substrate 2 side.

First, using a chip die Honda etc., the ceramic substrate 2 is
Solder hole 4 of IC chip 1 on solder pedestal 3 of
Attach temporarily. Next, the ceramic substrate 2 is placed on the reflow jig 6 described above, and solder melting connection is performed in a continuous solder reflow oven or the like.

Next, the flux generated by the solder melt connection is removed, but as described above, the ceramic substrate 2 and the jig 70-6 are in close contact with each other, so the flux cannot be removed as it is. Therefore.

The ceramic substrate 2 is removed from the reflow jig 6, and then cleaned to remove flux. Next, after drying the ceramic substrate, the ceramic substrate 2 is placed on the reflow jig 6 again.
/do.

Next, a ceramic cap (not shown) is placed on the hermetic sealing pattern part 5 on the open side of the ceramic substrate 2, and the cap is hermetically sealed with solder in a continuous reflow oven in the same way as the solder bath fusion splicing process in IC step 1. A stop process is performed to complete the ceramic shoe cage mounting process.

In the above package mounting process, as mentioned above, there are many links such as setting and resetting to Linroji $6, which improves the consistency of the process and causes problems in improving productivity and work efficiency. Not only does it occur, but also I
Opportunities for direct contact with C chips have increased, leading to problems such as poor characteristics of semiconductor ICs and deterioration of their reliability and life.

The present invention was devised to solve the above-mentioned problems, and its purpose is to eliminate the link operation between ceramic package mounting processes, improve the manufacturing yield of semiconductor IC packages, and reduce the manufacturing man-hours. Semiconductor IC that can improve reliability and lifespan
The purpose of the present invention is to provide a method for mounting a chip package.

In order to achieve the above-mentioned object, the present invention places a ceramic substrate on a jig in which wide slits are formed, and connects terminals formed on the ceramic substrate and extending from the ends thereof with six bislits. The semiconductor IC chip package mounting method is characterized in that the ceramic substrate is inserted between the terminals and the terminals are supported in a suspended state by the jig, and the package mounting process is carried out in one step. be.

Hereinafter, one embodiment of the present invention will be described based on the drawings.

First, an outline of this embodiment will be explained.

As shown in FIG. 3, there is a wide slit 8 on the top surface of the jig 7.
is formed, and the terminals 9 of the ceramic substrate 2 can be loosely inserted. The ceramic substrate 2 on which the IC chip 1 has been temporarily attached is placed on the upper 6-pin jig 7, the terminals 9 are inserted into the slits 8, and the terminals 9 of the ceramic substrate are suspended by the jig 7. I support it. In this state, the solder bath fusion splicing process is completed as shown in d above. Next, in the 7 lux removal cleaning process, since the slit 8 is formed in the jig 7, the 7 lux removal cleaning process is performed while the ceramic substrate 2 is placed on the jig 7. Then, the cap hermetic sealing step is performed in the same state as shown in FIG. 3, and the package mounting step is completed.

Next, this embodiment will be explained in more detail.

As shown in FIG. 3, the jig 7 is made of a metal having good thermal conductivity and excellent corrosion resistance, such as a plate member such as aluminum, which is formed into a channel shape.

The upper surface side I/'i11 is formed wide so that several ceramic substrates 2 can be placed thereon. Top plate 7 of jig 7
A plurality of slits 8 pass through the thickness of the upper surface plate 7a and are arranged in parallel. The pinot fL between the adjacent slits 8 is formed to have a dimension substantially equal to the distance P between the terminals 9 of the ceramic substrate 2 shown in FIG. Further, the width of the slit 8 is formed wide, so that the terminal 9 is not only inserted loosely, but also other ceramic substrates 2 with different distances P between the terminals 9 are inserted.
It is designed so that it can be shared with other people. Also, the height dimension of the side plate 7b that supports the top plate 7a of the jig 7! is formed higher than the extension length m of the terminal 9 from the end of the ceramic substrate 2 shown in FIG.

A plurality of ceramic substrates 2 to which IC chips 1 are temporarily soldered are supported on their bottom sides by the top plate 7a of the jig 7, with the above-mentioned extending terminals 9 inserted into the slits 8. Therefore, the ceramic substrate 2 is placed on the jig 7 with the terminals 9 suspended, and in this state, a solder bath fusion splicing process is performed in a continuous solder reflow oven or the like. Next, in the flux removal cleaning step, the flux removal cleaning liquid etc. enters through the slit 8, and since the slit 8 is wide, the ceramic substrate 2 can move freely within the slit 8. While still placed on the jig 7, 7 lux removal cleaning is performed.

Therefore, unlike the prior art, there is no need to change the set, and the I
After a drying process with the ceramic substrate 2 supported by JJ 7, where there is no chance of direct contact with the C chip 1 or the ceramic substrate 2, a cap hermetic sealing process is performed using a continuous reflow oven or the like as described above. is carried out, and the package mounting process of the rc"y tube is completed.

In the upper B example, the slits 8 of the jig 7 had a pitch L corresponding to the distance P between the terminals 9, but if the terminals 9 are only on one side of the ceramic substrate 2, the distance between the terminals 9 @
Depending on the case where p is not constant, the slit 8 may have an appropriate shape and size.

Furthermore, the jig 7 does not have to be a rectangular channel as shown in FIG. Further, the plurality of rows of slits 8 may not be arranged in parallel.

As is clear from the above explanation, according to the present invention, I
Since the non-driving operation of ceramic substrates, etc. is eliminated through the C chip package mounting process, semiconductor IC
The production yield of the package can be improved, the number of manufacturing steps can be reduced, and the reliability and life of the package can be improved.

[Brief explanation of drawings]

Fig. 1 is a perspective view showing a jig etc. used in conventional semiconductor IC package mounting, Fig. 2 is an explanatory view showing a state in which a semiconductor IC chip and a ceramic substrate are temporarily soldered;
FIG. 3 is a perspective view showing a jig used for package mounting according to an embodiment of the present invention. 1... Semiconductor IC chip, 2... Ceramic substrate,
7...Jig, 8...Slit, 9...Terminal. talent / I1%1

Claims (1)

[Claims] In a semiconductor IC chip package mounting method in which a semiconductor I (J-tube is housed in a ceramic substrate and processes such as solder melting connection, 7 lux removal cleaning and cap hermetic sealing are carried out, the ceramic substrate is placed and A jig is provided on the ceramic substrate to form a wide slit into which a terminal extending from an end of the ceramic substrate is loosely inserted, and the ceramic substrate is supported on the jig with the terminal suspended therein; Semiconductor I characterized in that the above steps are consistently performed while the above ceramic substrate is supported by a ±g pip jig.
C-chip package mounting method.