JPS58199171A - Preparation of discharge recording head - Google Patents

Preparation of discharge recording head

Info

Publication number
JPS58199171A
JPS58199171A JP8095082A JP8095082A JPS58199171A JP S58199171 A JPS58199171 A JP S58199171A JP 8095082 A JP8095082 A JP 8095082A JP 8095082 A JP8095082 A JP 8095082A JP S58199171 A JPS58199171 A JP S58199171A
Authority
JP
Japan
Prior art keywords
head
insulating material
pattern
base board
fine
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8095082A
Other languages
Japanese (ja)
Inventor
Isao Kagatani
勲 加々谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP8095082A priority Critical patent/JPS58199171A/en
Publication of JPS58199171A publication Critical patent/JPS58199171A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/385Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective supply of electric current or selective application of magnetism to a printing or impression-transfer material
    • B41J2/39Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective supply of electric current or selective application of magnetism to a printing or impression-transfer material using multi-stylus heads
    • B41J2/395Structure of multi-stylus heads
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0011Working of insulating substrates or insulating layers
    • H05K3/0017Etching of the substrate by chemical or physical means
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092Integral conductive tabs, i.e. conductive parts partly detached from the substrate

Landscapes

  • Electronic Switches (AREA)

Abstract

PURPOSE:To easily prepare a discharge recording head with high preciseness, by a method wherein a pattern comprising plural fine head parts and line parts formed on a print base board is coated with an insulating material and slightly protruded by removing the insulating material applied to the part other than the pattern part. CONSTITUTION:A pattern comprising plural fine head parts 2 having fine shape preciseness and line parts 3 connected thereto is formed on a print base board 1 and, after the whole of this base board is coated by an insulating material 4, the head leading end is cut to bring the base board 1, the head parts 2 and the insulating material 4 to a same plane. In the next step, the leading ends of the head parts 2 are immersed in a solvent 5 to dissolve and remove the base board 1 and the insulating material 4 and the pattern parts of the head parts are protruded several mum - several ten mum. By this method, because plural patterns can be formd on the base board in high preciseness at high density, printing quality can be enhanced to a large extent.

Description

【発明の詳細な説明】 本発明は媒体と記録紙を重ね合わせ、媒体の放電微小破
壊片を記録紙に衝突させ、付着することKよって、記録
転写を可能にした放電記録ヘッドの製造方法に関するも
のである。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of manufacturing an electric discharge recording head that enables recording transfer by overlapping a medium and a recording paper, and colliding and adhering discharge minute fragments of the medium to the recording paper. It is something.

放電転写記録は、先ず通電層、半導電層、導電層から成
る媒体と晋通記録紙とを重ね合わせる。
In discharge transfer recording, first, a medium consisting of a conductive layer, a semiconductive layer, and a conductive layer is superimposed on Shintsu recording paper.

次に媒体に陽極と隘極f:接触させ、両極間に一定電圧
を印加することにより、半導I11鳩と導電層の界面付
近に放電破壊が生じる。この時の放′畦破壊片が記録紙
に衝突し、同時に発生する熱によって定着されることに
よって牛永久的な記録が得られる。したがって、この放
電破壊を所望の状態に制御することにより、プリンタヘ
ッドとしての機能を果すことができる。プリンタヘッド
は一般的に約02〜0.3M直径の411数本の陽極金
属ロンドを平行に並べ、このFih極金属ロンドより離
れた位置に陽極をセントする。この場合、陰砺は陽極と
一緒にヘッドとして組み込んでも良いが、別々であって
も良い。従来のヘッドは金属ロンド数が数本であり、ピ
ッチ稍度を向上させる必要もないため、ヘッドとしての
製造および実装には殆んど問題がなかった。しかしなが
ら、最近の如く高密度化が要求され、ドツト密度が8〜
10本/11Mになると、金属ロンドの直径全0.1龍
以下、ピッチ寸法も0.1菖雪以下にしなければならず
、金属ロンド間の絶縁。
Next, by bringing the anode and the pole f into contact with the medium and applying a constant voltage between the two poles, discharge breakdown occurs near the interface between the semiconductor I11 and the conductive layer. At this time, the broken pieces of the ridge collide with the recording paper and are fixed by the heat generated at the same time, thereby creating a permanent record. Therefore, by controlling this discharge breakdown to a desired state, it can function as a printer head. The printer head generally has 411 anode metal ronds with a diameter of about 0.2 to 0.3M arranged in parallel, and the anode is placed at a position away from the Fih electrode metal rond. In this case, the anode may be incorporated as a head together with the anode, or may be separate. Since the conventional head has only a few metal ronds and there is no need to improve the pitch consistency, there were almost no problems in manufacturing and mounting the head. However, with the recent demand for higher density, the dot density has increased from 8 to
For 10 pieces/11M, the total diameter of the metal ronds must be less than 0.1 length, the pitch dimension must be less than 0.1 iris, and the insulation between the metal ronds.

ピッチ精度を類例に保つか、実装および接続を如(it
]Kするか等の間趙がある。ま九、金城ロンドを必要以
上に突出させると媒体を破損させるおそれがあるため、
金属ロンドの押付は圧力を小さくする必要がある。しか
し金属ロンドの押し付は圧力が小さいと印字ミスを生じ
、確実で高品質な印字特性を実現することは難しい。他
の方法としてプリント基板に微細ヘッドパターンをエツ
チングによって形成し、この微細ヘッド端面に同一面加
工を施して、媒体に押し付ける方法もある。すなわちエ
ツチングによる微細ノくターン形成であれはドツトの高
密度化に十分対処できるし、実装も極めて容易である。
Keep pitch accuracy similar or improve implementation and connections (it
] There is a Zhao between K and Etc. Nine, if you make Kinjo Rondo protrude more than necessary, there is a risk of damaging the medium.
When pressing the metal iron, it is necessary to reduce the pressure. However, if the pressure of the metal iron is too low, printing errors may occur, making it difficult to achieve reliable, high-quality printing characteristics. Another method is to form a fine head pattern on a printed circuit board by etching, process the end face of this fine head flush, and press it against the medium. In other words, forming fine dots by etching can sufficiently cope with the increase in dot density and is extremely easy to implement.

しかしながら、ノくター/端部と基板端面が同一面であ
るため、押付は圧力を極めて大きく(数置〜数士縁)シ
なければ記録転写を実現することはできない。しかし押
付は圧力を大きくすることは装置、ヘッド、媒体、記録
紙等に必要以上の負担が加わり、それぞれの破損の原因
となる。
However, since the nozzle/end portion and the end surface of the substrate are on the same surface, recording and transfer cannot be achieved unless the pressing pressure is extremely large (several to several degrees). However, increasing the pressing pressure places an unnecessary burden on the device, head, medium, recording paper, etc., and causes damage to each of them.

本発明の目的はかかる欠点を除去した放電記録ヘッドの
製造方法を提供することにおる。本発明によればプリン
ト基板に微細ヘッド部およびM節部から成るエツチング
パターンを形成し、絶縁材を被機後、微細ヘッド部端t
hIを仕上加工し、ヘッド先端の絶縁材およびプリント
基板を溶剤によって溶解除去することによシ、パターン
部を僅か突出した放電記録ヘッドの製造方法が得られる
An object of the present invention is to provide a method for manufacturing a discharge recording head that eliminates such drawbacks. According to the present invention, an etching pattern consisting of a fine head portion and an M node portion is formed on a printed circuit board, and after coating an insulating material, the end t of the fine head portion is etched.
By finishing hI and dissolving and removing the insulating material and the printed circuit board at the tip of the head using a solvent, a method for manufacturing a discharge recording head with a slightly protruding pattern portion can be obtained.

以下図によって説明する。This will be explained below using figures.

第1図は微細ヘッド部および線路部を形成したプリント
基板のt+視図、第2図、第3図、第4図は本発明の一
実施例を示すヘッド製造方法の微細ヘッド部拡大断面図
、第5図はヘッド0.媒体および記録紙との接触状II
lを示す断面図である。第1図においてI#iプリント
基板であり、微細ヘッド部2およびそれと連結される線
路部3のパターンがエツチングによって形成されている
。第2図において4は絶縁材であ如、第1図におけるプ
リント基板l全体がこの絶縁材4によって秒われている
。AAは切断箇所を示しており、第3図の如くヘッド先
端を切断し、プリント基板1、微細ヘッド部2パターン
部および絶縁材4を同一面にする。
FIG. 1 is a t+ view of a printed circuit board on which a fine head portion and a line portion are formed, and FIGS. 2, 3, and 4 are enlarged sectional views of a fine head portion of a head manufacturing method showing an embodiment of the present invention. , FIG. 5 shows head 0. Contact form II with media and recording paper
FIG. In FIG. 1, it is an I#i printed board, and a pattern of a fine head portion 2 and a line portion 3 connected thereto is formed by etching. In FIG. 2, 4 is an insulating material, and the entire printed circuit board l in FIG. 1 is separated by this insulating material 4. AA indicates a cutting point, and as shown in FIG. 3, the tip of the head is cut, and the printed circuit board 1, the pattern part of the fine head part 2, and the insulating material 4 are made on the same surface.

第4図においてs#i溶剤であシ、ヘッド先端の絶縁材
4およびプリント基板lを僅か溶解除去する。
In FIG. 4, the insulating material 4 and printed circuit board 1 at the tip of the head are slightly dissolved and removed using s#i solvent.

プリント基板lおよび絶縁材4#i一般的にエポキシ系
が用いられており、溶剤として例えばジメチルホルムア
ミドが有効である。したがって、プリント基板lおよび
絶縁材4が除去されることKよって微細ヘッド部2パタ
ーン部が僅か数μm〜数lθμ凰突出する。この場合、
ヘッド部2パターン部が突出され、他の部分が溶解され
るのでめればエポキシ系掬脂とジメチルホルムアミドの
組み合わせである必要は全くない。第5図において6#
i媒体であシ、−面に記録紙7が他面には微細ヘッド部
2のパターンおよび陰極8がそれぞれ接触している。す
なわち、記録転写0状11t−示したtのでIhn、媒
体6と記録紙7が重ね合わせられ、紙送りが可能である
様にセットされている。次に微細ヘッド2のパターン部
を軽く押し付け(aグラム−数十グラム)、陽極である
ヘッド2と陰極8間に一定電圧を印加する。し九がって
、この時の電流によって媒体6に放電微小破壊を生じ、
この微小破壊片が記録紙7に衝突し定着される。この微
小破Jli!Iをマイコン等で制御することによって、
プリンタとしての機能を発揮させることができる。
The printed circuit board 1 and the insulating material 4#i are generally made of epoxy, and dimethylformamide, for example, is effective as a solvent. Therefore, by removing the printed circuit board 1 and the insulating material 4, the pattern portion of the fine head portion 2 protrudes by only several μm to several lθμ. in this case,
Since the two pattern parts of the head part are protruded and the other parts are dissolved, there is no need for a combination of epoxy resin and dimethylformamide. In Figure 5, 6#
In the i-medium, the recording paper 7 is in contact with the - side, and the pattern of the fine head section 2 and the cathode 8 are in contact with the other side. That is, since the recording transfer state 11t--t is shown, the medium 6 and the recording paper 7 are set so that they are superimposed and can be fed. Next, the pattern portion of the fine head 2 is lightly pressed (a gram - several tens of grams), and a constant voltage is applied between the head 2, which is an anode, and the cathode 8. Therefore, the current at this time causes discharge micro-destruction in the medium 6,
These minute broken pieces collide with the recording paper 7 and are fixed. This minute break Jli! By controlling I with a microcomputer etc.
It can function as a printer.

以上の様に本発明によれば、エツチングによってプリン
ト基板上に高1n1度の微細ヘッドを極めて容易に形成
することができるため、金属ロンド方式に比して大幅な
コストダウンが可能である。また、エツチングによれば
数多くのパターンを高精度に且つ高@fK形成すること
ができるため、印字品質を大幅に向上させることになる
。各パターン間#i確実に絶縁が保持され、且つ端末処
理および接続が簡単である丸め、実装が極めて容易であ
る。また、9mヘッドパターンが僅か突出しているため
、従来のプリント基板端面接触に比して、極めて軽い接
触圧力で印字を可能にすることができた。接触圧力を小
さくシ九紹釆、媒体を破損させることがなくな)、媒体
や記録紙の取り替え、保守、汚れ等を無くすることがで
きる。またプリンタの機械構造t−簡単に且つ小型にす
ることが可能であ)%消費電力も少なくて済ひ。さらに
は微小圧力にした結果、媒体の消耗を少くしたために1
従来よシ数倍の使用に耐える様になった。接触圧力が高
い場合はヘッド先端にゴミ、金属片、媒体の微小片等が
累積し易く、このためパターン間および金属ロンド間が
電気的に短絡することもあったが、微小圧力なのでこの
様な事故の発生も抑えることができる。もしゴミ等が発
生しても本ヘッドは絶縁材によって完全に榎われている
ため、これKよってもゴミ混入を防ぐことができる。本
ヘッドは以上の如き数多くの利点を備えており、実装上
、精度、接続、コスト、密度等の面で極めて有利である
As described above, according to the present invention, it is possible to extremely easily form a fine head with a height of 1n1 degree on a printed circuit board by etching, thereby making it possible to significantly reduce costs compared to the metal rond method. Furthermore, etching allows formation of a large number of patterns with high precision and high @fK, resulting in a significant improvement in printing quality. Insulation is reliably maintained between each pattern #i, and terminal processing and connection are simple, rounding and mounting are extremely easy. In addition, since the 9m head pattern protrudes slightly, it was possible to print with extremely light contact pressure compared to conventional printed circuit board edge contact. The contact pressure is reduced (without damaging the medium), and the need for replacing, maintaining, and staining the medium and recording paper can be eliminated. Furthermore, the mechanical structure of the printer can be easily and compactly constructed, and the power consumption can be reduced. Furthermore, as a result of the micro pressure, the consumption of the medium was reduced, resulting in 1.
It can withstand many times more use than conventional products. When the contact pressure is high, dust, metal pieces, minute pieces of media, etc. tend to accumulate on the tip of the head, which can lead to electrical short circuits between patterns and between metal ronds. The occurrence of accidents can also be suppressed. Even if dust or the like occurs, the present head is completely covered by the insulating material, so it is possible to prevent dust from entering. This head has many advantages as described above, and is extremely advantageous in terms of mounting accuracy, connection, cost, density, etc.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は微細ヘッド部および線路部を形成したプリント
基板の斜視図、第2図、第3図、第4図は本発明のヘッ
ド製造方法の一実施例を説明するための微細ヘッド部を
拡大した断面図でtりシ、第2図は第1図の基板f/P
3縁材で被覆し丸状節を示す微細ヘッド部の拡大断面図
、第3図はその端部を切断した断面図、第4図はその端
部を溶剤によって溶解除去し、ヘッドパターン部を≠出
させた断面図、第5図は微細ヘッドと媒体および記録紙
との接触を示す断面図である。 図において、lけプリント基板、2#i微細ヘッド部、
3は線路部、4は絶縁材、5は溶剤、6Fi媒体、7は
記録紙、8#i陰極である AAFi微細ヘッドの切断
位置を示す。 第1図 第2図 第4図 第5図
FIG. 1 is a perspective view of a printed circuit board on which a fine head part and a line part are formed, and FIGS. 2, 3, and 4 show a fine head part for explaining an embodiment of the head manufacturing method of the present invention. An enlarged cross-sectional view of the board f/P shown in Figure 1 is shown in Figure 2.
3. An enlarged cross-sectional view of a fine head portion covered with edge material and showing round nodes. FIG. 3 is a cross-sectional view of the end portion cut away. FIG. FIG. 5 is a cross-sectional view showing the contact between the fine head, the medium, and the recording paper. In the figure, a printed circuit board, a 2 #i fine head section,
3 is a line part, 4 is an insulating material, 5 is a solvent, 6 is a Fi medium, 7 is a recording paper, and 8 is a cathode.The cutting position of the AAFi fine head is shown. Figure 1 Figure 2 Figure 4 Figure 5

Claims (1)

【特許請求の範囲】[Claims] 1本以上の極めて微細な形状精度を有する微細ヘッド部
およびそれらと連結される巌路部の各パターンをプリン
ト基板上に形成し、このプリント基板を絶縁材によって
被横後、前記微細ヘッド部端面を仕上加工し、前記微細
ヘッド部近傍を溶剤に浸種し、前記パターン部以外を溶
層除去することによって前記パターン部を僅か突出した
こと管特徴とする放電記録ヘッドの製造方法。
Each pattern of one or more fine head portions having extremely fine shape accuracy and the groove portions connected thereto is formed on a printed circuit board, and after this printed circuit board is covered with an insulating material, the end surface of the fine head portion is formed. A method for manufacturing an electric discharge recording head, characterized in that the pattern portion is slightly protruded by finishing the fine head portion, immersing the vicinity of the fine head portion in a solvent, and removing the molten layer from areas other than the pattern portion.
JP8095082A 1982-05-14 1982-05-14 Preparation of discharge recording head Pending JPS58199171A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8095082A JPS58199171A (en) 1982-05-14 1982-05-14 Preparation of discharge recording head

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8095082A JPS58199171A (en) 1982-05-14 1982-05-14 Preparation of discharge recording head

Publications (1)

Publication Number Publication Date
JPS58199171A true JPS58199171A (en) 1983-11-19

Family

ID=13732774

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8095082A Pending JPS58199171A (en) 1982-05-14 1982-05-14 Preparation of discharge recording head

Country Status (1)

Country Link
JP (1) JPS58199171A (en)

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