JPS58187151U - 高密度パツケ−ジ - Google Patents

高密度パツケ−ジ

Info

Publication number
JPS58187151U
JPS58187151U JP1982084896U JP8489682U JPS58187151U JP S58187151 U JPS58187151 U JP S58187151U JP 1982084896 U JP1982084896 U JP 1982084896U JP 8489682 U JP8489682 U JP 8489682U JP S58187151 U JPS58187151 U JP S58187151U
Authority
JP
Japan
Prior art keywords
ceramic substrate
terminals
density package
recess
lsi chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1982084896U
Other languages
English (en)
Japanese (ja)
Other versions
JPS645893Y2 (enrdf_load_stackoverflow
Inventor
西原　幹雄
敏弘 草谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP1982084896U priority Critical patent/JPS58187151U/ja
Publication of JPS58187151U publication Critical patent/JPS58187151U/ja
Application granted granted Critical
Publication of JPS645893Y2 publication Critical patent/JPS645893Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]
JP1982084896U 1982-06-08 1982-06-08 高密度パツケ−ジ Granted JPS58187151U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982084896U JPS58187151U (ja) 1982-06-08 1982-06-08 高密度パツケ−ジ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982084896U JPS58187151U (ja) 1982-06-08 1982-06-08 高密度パツケ−ジ

Publications (2)

Publication Number Publication Date
JPS58187151U true JPS58187151U (ja) 1983-12-12
JPS645893Y2 JPS645893Y2 (enrdf_load_stackoverflow) 1989-02-14

Family

ID=30093815

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982084896U Granted JPS58187151U (ja) 1982-06-08 1982-06-08 高密度パツケ−ジ

Country Status (1)

Country Link
JP (1) JPS58187151U (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10107188A (ja) * 1996-09-27 1998-04-24 Kyocera Corp 半導体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10107188A (ja) * 1996-09-27 1998-04-24 Kyocera Corp 半導体装置

Also Published As

Publication number Publication date
JPS645893Y2 (enrdf_load_stackoverflow) 1989-02-14

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