JPS58182906U - Soldering structure for optical components - Google Patents
Soldering structure for optical componentsInfo
- Publication number
- JPS58182906U JPS58182906U JP7995582U JP7995582U JPS58182906U JP S58182906 U JPS58182906 U JP S58182906U JP 7995582 U JP7995582 U JP 7995582U JP 7995582 U JP7995582 U JP 7995582U JP S58182906 U JPS58182906 U JP S58182906U
- Authority
- JP
- Japan
- Prior art keywords
- optical components
- soldering structure
- optical component
- soldering
- flange
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Mounting Components In General For Electric Apparatus (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来の固定構造を説明するための断面図、第２
図は本考案の一実施例を示す断面図および第３図は本実
施例に使用する発熱基板を示す平面図である。
図において、１・・・・・・ケース、２・・・・・・リ
セプタクル、３・・・・・・光学部品、４・・・・・・
接着剤、５・・・・・・スリーブ、６・・・・・・止め
ねじ、７・・・・・・発熱基板、８・・・・・・はんだ
、９・・・・・・絶縁基板、１０・・・・・・抵抗体部
、１１・・・・・・導体部。Figure 1 is a sectional view for explaining the conventional fixing structure, Figure 2
The figure is a sectional view showing one embodiment of the present invention, and FIG. 3 is a plan view showing a heat generating board used in this embodiment. In the figure, 1... Case, 2... Receptacle, 3... Optical component, 4...
Adhesive, 5... Sleeve, 6... Set screw, 7... Heat generating board, 8... Solder, 9... Insulating board , 10... Resistor part, 11... Conductor part.
Claims (1)
とが印刷形成され前記ケース本体に固定された発熱基板
と、内部に光学部品を有し外周囲にフランジが形成され
たスリーブとを備え、前記発熱基板の導体部に予め塗布
されたはんだを前記発熱基板の抵抗体部への通電により
溶融させて前記フランジと前記導体部とをはんだ付固定
したことを特徴とする光学部品のはんだ行固定構造。The case body, the resistor part and the conductor part on the insulating board,
and a sleeve having an optical component inside and a flange formed around the outer periphery. 1. A solder line fixing structure for an optical component, characterized in that the flange and the conductor part are fixed by soldering by melting the resistor part of the heat generating board by applying electricity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7995582U JPS58182906U (en) | 1982-05-31 | 1982-05-31 | Soldering structure for optical components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7995582U JPS58182906U (en) | 1982-05-31 | 1982-05-31 | Soldering structure for optical components |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58182906U true JPS58182906U (en) | 1983-12-06 |
Family
ID=30089120
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7995582U Pending JPS58182906U (en) | 1982-05-31 | 1982-05-31 | Soldering structure for optical components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58182906U (en) |
-
1982
- 1982-05-31 JP JP7995582U patent/JPS58182906U/en active Pending
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