JPS58175667A - Laminated ink jet head - Google Patents
Laminated ink jet headInfo
- Publication number
- JPS58175667A JPS58175667A JP5932682A JP5932682A JPS58175667A JP S58175667 A JPS58175667 A JP S58175667A JP 5932682 A JP5932682 A JP 5932682A JP 5932682 A JP5932682 A JP 5932682A JP S58175667 A JPS58175667 A JP S58175667A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- head
- diaphragm
- head substrate
- thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims abstract description 48
- 230000003014 reinforcing effect Effects 0.000 claims abstract description 21
- 239000000463 material Substances 0.000 claims abstract description 9
- 238000001746 injection moulding Methods 0.000 abstract description 5
- 229910000831 Steel Inorganic materials 0.000 abstract description 4
- 239000010959 steel Substances 0.000 abstract description 4
- 239000000853 adhesive Substances 0.000 abstract description 2
- 230000001070 adhesive effect Effects 0.000 abstract description 2
- 239000003822 epoxy resin Substances 0.000 abstract description 2
- 229920000647 polyepoxide Polymers 0.000 abstract description 2
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 239000000976 ink Substances 0.000 description 11
- 239000004033 plastic Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000004568 cement Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 239000006089 photosensitive glass Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 241001385733 Aesculus indica Species 0.000 description 1
- 101100451794 Escherichia coli (strain K12) htrL gene Proteins 0.000 description 1
- 206010024796 Logorrhoea Diseases 0.000 description 1
- 206010067482 No adverse event Diseases 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000004332 deodorization Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 239000002574 poison Substances 0.000 description 1
- 231100000614 poison Toxicity 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1637—Manufacturing processes molding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1607—Production of print heads with piezoelectric elements
- B41J2/161—Production of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1623—Manufacturing processes bonding and adhesion
Abstract
Description
【発明の詳細な説明】
本発明はインクオンデマンド型インクジェットに係わり
、特に量産コストの安いインクジェットヘッドに関する
。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an ink-on-demand type inkjet, and particularly to an inkjet head with low mass production cost.
インクオンデマンド型インクジェットヘッドは第1図に
示すごとくヘッド基板1.振動板2.圧電素子3からな
り構成は非常に簡単である。しかしノズル4の径が細い
ため実際にヘッドを量産するのはかなり難しい。現在感
光性ガラスのフォトエツチングによるヘッドが実用化さ
れているが量産性が悪く高価であった。The ink-on-demand type inkjet head has a head substrate 1, as shown in FIG. Vibration plate 2. It consists of a piezoelectric element 3 and has a very simple configuration. However, because the diameter of the nozzle 4 is small, it is quite difficult to actually mass-produce the head. At present, heads based on photoetching of photosensitive glass are in practical use, but they are difficult to mass produce and are expensive.
本発明者等はインクジェットヘッドを低価格で量産する
ため射出成形によるプラスチックヘッドの開発を進めて
きたが、プラスチックの弾性率が低いためヘッド基板の
厚さを厚くする必要があることがわかってきた。すなわ
ち圧電素子と振動板の積層板にくらベヘッド基板の厚さ
が薄いと圧力がヘッド基板に逃げてしまい、圧電素子に
加えた電気エネルギが充分インクの射出に用いられない
したがって本発明の目的は安価に製造できるヘッド厚さ
の薄いインクジェットヘッドを提供することにある。The inventors of the present invention have been developing plastic heads using injection molding in order to mass produce inkjet heads at low cost, but it has become clear that the thickness of the head substrate needs to be increased due to the low elastic modulus of plastic. . In other words, if the thickness of the head substrate is thin compared to the laminated plate of the piezoelectric element and the diaphragm, pressure will escape to the head substrate, and the electrical energy applied to the piezoelectric element will not be used sufficiently for ink ejection. To provide an inkjet head with a thin head thickness that can be manufactured at low cost.
本発明の主旨はヘッド基板にくらべ高弾性率の補強部材
をヘッド基板に接着することでヘッドの厚さの増大をお
さえようとするものである。The gist of the present invention is to suppress an increase in the thickness of the head by bonding a reinforcing member having a higher elastic modulus than the head substrate to the head substrate.
本発明の実施例の概略断面図を第2図に示す。A schematic cross-sectional view of an embodiment of the invention is shown in FIG.
ABS樹脂のヘッド基板1の表面には、ノズル4、加圧
室5.供給路6等のインク流路が溝として形成されてい
る。ヘッド基板1に同材質の振動板2がドープセメント
により接着され、加圧室5に対応する位置に圧電素子3
が接着される。ヘッド基板1はプレスにより所定の形状
に打抜かれた鋼製の補強板7にエポキシ樹脂により接着
される。A nozzle 4, a pressurizing chamber 5. Ink flow paths such as the supply path 6 are formed as grooves. A diaphragm 2 made of the same material is bonded to the head substrate 1 with doped cement, and a piezoelectric element 3 is placed at a position corresponding to the pressurizing chamber 5.
is glued. The head substrate 1 is bonded with epoxy resin to a reinforcing plate 7 made of steel that has been punched into a predetermined shape using a press.
同時に補強板7の反対面には圧電素子3′と振動板2′
に積層されたヘッド基板1′が接着される。ここでヘッ
ド基板1と振動板2′ 、ヘット基板1′と振動板2と
は同じ部品であり、圧電素子3.3′の接着した側が振
動板として機能する。At the same time, a piezoelectric element 3' and a diaphragm 2' are mounted on the opposite side of the reinforcing plate 7.
The head substrate 1' laminated on is bonded. Here, the head substrate 1 and the diaphragm 2', and the head substrate 1' and the diaphragm 2 are the same parts, and the side to which the piezoelectric elements 3 and 3' are bonded functions as the diaphragm.
以上の構成において、圧電素子3,6′の駆動エネルギ
が相対するヘッド基板のたわみによって逃げないために
は、ヘッド基板1,1′の厚さ、補強板7の厚さが充分
厚い必要がある。定量的には振動板側とヘッド基板側の
同一圧力に対する体! 変化量すなわちコンプライアン
スによってエネルギの逃げを推定できる。In the above configuration, in order to prevent the driving energy of the piezoelectric elements 3 and 6' from escaping due to the deflection of the opposing head substrates, the thicknesses of the head substrates 1 and 1' and the thickness of the reinforcing plate 7 must be sufficiently thick. . Quantitatively, the body for the same pressure on the diaphragm side and the head board side! Energy escape can be estimated based on the amount of change, that is, compliance.
加圧室5.圧電素子3の形状を円として計算すると、振
動板2と圧電素子3との積層板のコンプライアンス0、
は次のように表わせる。ここで添字Pは圧電素子、添字
Vは振動板を表わすものとする。Pressurized chamber 5. If the shape of the piezoelectric element 3 is calculated as a circle, the compliance of the laminated plate of the diaphragm 2 and the piezoelectric element 3 is 0,
can be expressed as follows. Here, the subscript P represents a piezoelectric element, and the subscript V represents a diaphragm.
h、=hυ+に11IhP I・・・・
・■ただしα:圧電素子半径、’H,p、Ev:縦弾性
係数、シP、シV:ボアソン比、hP t h v :
厚さ、hl :積層板等価厚さ、kl !圧電素子厚さ
を振動板厚さに変換する等価係数。h, = hυ+ to 11IhP I...
・■ However, α: radius of piezoelectric element, 'H, p, Ev: modulus of longitudinal elasticity, P, V: Boisson's ratio, hP t h v:
Thickness, hl: Equivalent thickness of laminate, kl! Equivalent coefficient to convert piezoelectric element thickness to diaphragm thickness.
同様に、ヘッド基板1,1′と補強板7との積層板のコ
ンプライアンス0.は次のように表わせる。ここで添字
濯は補強板、添字すはヘッド基板を表わし、E、シ、h
等は前述した定数とする。Similarly, the compliance of the laminate of the head substrates 1, 1' and the reinforcing plate 7 is 0. can be expressed as follows. Here, the suffix R represents the reinforcing plate, and the suffix represents the head board, E, C, h.
etc. are the constants mentioned above.
h 、 =2hh+に2h9rL ・
・・・・・■ただしり、:積層板等価厚さ、k2 :補
強板厚さをヘッド基板厚さに変換する等価係数。h, = 2hh+ to 2h9rL ・
・・・・・・■ Note: Equivalent thickness of the laminate, k2: Equivalent coefficient for converting the thickness of the reinforcing plate into the thickness of the head substrate.
ヘッド基板側への圧力の逃げは、同一圧力による基板側
と振動板側の容積変化の比で考えられるから、圧力の逃
げを所定の割合に以下にするには0、≦KO1・・・・
・・■
が成立すれば良い。振動板とヘッド基板が同一材質であ
るから、Eυ=Eh、シυ=シhとなり、式0〜式■を
まとめると、
となる。Since the pressure escape to the head substrate side can be considered as the ratio of the volume change on the substrate side and the diaphragm side due to the same pressure, in order to reduce the pressure escape to a predetermined ratio or less, 0, ≦KO1...
・・・■ It is sufficient if it holds true. Since the diaphragm and the head substrate are made of the same material, Eυ=Eh, υ=Shh, and when formulas 0 to 2 are summarized, the following is obtained.
具体的に、Ep=5.9×10”°N/常2.νP=0
、3. h p = 0.15 閣、 M v = E
b = 2. I X 10’N/9rL” 、vv
=vb=0.57 、hv=hh=0.3簡、冗情=
2. I X 1011N/lyL” 、ν毒==
0.5 、 K=0,1を式■に代入すれば、h、≧[
L23mとなる。これを補強板を用いずヘッド基板の厚
さを厚くすることで満足しようとするとに1倍の厚さが
必要でh ffl≧1rrrmとなる。従ってヘッド基
板部の厚さを、h m + 2 h bとして、1.6
++on必要であったヘッド基板部の厚さが、補強板と
して鋼板を挿入することで0.83mmで同じ効果が得
られる。Specifically, Ep=5.9×10”°N/normal 2.νP=0
, 3. h p = 0.15, M v = E
b = 2. I X 10'N/9rL", vv
=vb=0.57, hv=hh=0.3, verbosity=
2. I X 1011N/lyL”, ν poison ==
0.5, by substituting K=0,1 into the formula ■, we get h, ≧[
The length will be 23m. If this is to be satisfied by increasing the thickness of the head substrate without using a reinforcing plate, it will be necessary to increase the thickness by one time, which means hffl≧1rrrm. Therefore, assuming the thickness of the head substrate part as h m + 2 h b, it is 1.6
By inserting a steel plate as a reinforcing plate, the thickness of the head substrate part that was required for ++on can be reduced to 0.83 mm, and the same effect can be obtained.
以上述べたように式■を満足する厚さの補強板を中間基
板として用いることで、圧力損失が少なく、両面の振動
もれによる悪影響のないインクジェットヘッドが得られ
、ヘッドの厚さを薄くできる。As described above, by using a reinforcing plate with a thickness that satisfies formula (■) as an intermediate substrate, an inkjet head with low pressure loss and no adverse effects due to vibration leakage on both sides can be obtained, and the thickness of the head can be reduced. .
なお式■、■、■、■は円周支持とした場合であり、振
動板2とヘッド基板1との接合の状態が円周固定とみな
せる場合は
を式■に代入して求めた方が良い。具体的に前に用いた
定数と同じ定数で計算すると、htrL≧0.13鵬と
なる。Note that formulas ■, ■, ■, and ■ are for the case where the diaphragm 2 and the head substrate 1 are supported circumferentially, and if the state of the connection between the diaphragm 2 and the head substrate 1 can be considered to be fixed circumferentially, it is better to calculate by substituting them into the formula ■. good. Specifically, when calculated using the same constants as those used previously, htrL≧0.13peng.
また加圧室5と、圧電素子3が長方形である場合には、
周辺支持とみなせる時は、
を式■に代入すれば良い。具体的に前と同じ定数で計算
すると、h=≧0.22 tanとなる。Further, when the pressurizing chamber 5 and the piezoelectric element 3 are rectangular,
When it can be considered as peripheral support, it is sufficient to substitute into formula ■. Specifically, when calculated using the same constant as before, h=≧0.22 tan.
また周辺固定とみなせる時は、
を式■に代入すれば良い。この時前と同様に計算すると
、hfi≧0.13閣となる。Also, when it can be considered that the periphery is fixed, it is sufficient to substitute into formula ■. If we calculate as before, hfi≧0.13.
以上の各計算例ではK = o、 1としているが、裏
面への振動もれによる射出不安定性をさらにおさえるた
め5%以下の圧力損失とし、[=Q、Q5とすれば、式
■により、円形で周辺支持とみなせる場合は、ktrL
≧0,32 rtun 、周辺固定とみなせる場合は、
kfn≧0.2 tan e長方形で周辺固定の場合は
に=≧0.19mmに補助板の厚さを選べば良い。In each of the above calculation examples, K = o, 1, but in order to further suppress injection instability due to vibration leakage to the back side, the pressure loss is set to 5% or less, and if [=Q, Q5, then according to formula (■), If it is circular and can be considered as peripheral support, ktrL
≧0,32 rtun , if it can be considered as peripheral fixed,
kfn≧0.2 tan eIf the periphery is fixed in a rectangular shape, the thickness of the auxiliary plate should be selected to be ≧0.19 mm.
第2図の実施例では補強板の両側にヘッド基板を接着し
た両面ヘッドを示しているが、補強板の片面のみにヘッ
ド基板を接着する場合は、式■において2hbをhhと
おけば良い。The embodiment shown in FIG. 2 shows a double-sided head in which the head substrate is bonded to both sides of the reinforcing plate, but if the head substrate is bonded to only one side of the reinforcing plate, 2hb may be replaced with hh in equation (2).
Kの値としては各種の値をとれるが、ヘッドの薄さを優
先させる時はに=0.1.電圧上昇や不安定性の増加の
防止を優先させる時はK = 0.05程度に選べば良
い。The value of K can take various values, but when priority is given to the thinness of the head, it should be set to 0.1. When prioritizing prevention of voltage rise and increase in instability, K = approximately 0.05 may be selected.
また補強板としてはセラミックや各種金属が用いられる
が、特に弾性率の高い鋼板、ステンレス鋼板等が適して
いる。Ceramics and various metals can be used as the reinforcing plate, but steel plates, stainless steel plates, etc. having a high modulus of elasticity are particularly suitable.
またヘッド基板としてはABSの他に、A8tl脂、ア
クリル樹脂、ポリサル7オン等がヘッド組立接着性、透
明性等の点で適している。In addition to ABS, materials such as A8TL resin, acrylic resin, and polysal 7on are suitable for the head substrate in terms of head assembly adhesion and transparency.
第2図の実施例でわかるように本発明によればヘッド基
板より弾性率の高い補強板をヘッド基板に接着すること
で圧力の損失が少なく、厚さの薄いインクジェットヘッ
ドが得られる。 。As can be seen from the embodiment shown in FIG. 2, according to the present invention, by bonding a reinforcing plate having a higher elastic modulus than the head substrate to the head substrate, an inkjet head with less pressure loss and a thinner thickness can be obtained. .
特に射出成形により作られたプラスチックのヘッド基板
と振動板の溶着により低価格のヘッドの量産が可能とな
る。さらに振動板、ヘッド基板の厚さは薄くて良いため
射出成形時のヒケが少なく平面度が出るため、接着時に
塗布する溶剤セメントの量が少なくてすみ、従ってノズ
ルの溶剤セメントによる封止もおこりにくぐなる。また
振動板、ヘッド基板の厚さが薄いため組立消臭の加圧力
も弱くて良く、ノズルのつぶれがおこりにくくなる。In particular, mass production of low-cost heads is possible by welding the diaphragm to the plastic head substrate made by injection molding. Furthermore, since the thickness of the diaphragm and head substrate can be thin, there are fewer sink marks during injection molding and flatness is achieved, so the amount of solvent cement applied during bonding can be reduced, and the nozzle can therefore be sealed with solvent cement. Nikugu naru. In addition, since the diaphragm and head substrate are thin, the pressing force required for assembly and deodorization can be weak, and the nozzle is less likely to collapse.
またプラスチックだけのヘッドにくらべ金属板で加圧室
部分等をおおっているためインクのプラスチックを通し
ての蒸発、あるいは空気の侵入もおこりにくくなる。Also, compared to a head made only of plastic, since the pressurizing chamber is covered with a metal plate, it is less likely that ink will evaporate through the plastic or that air will enter.
さらに、感光性ガラス、金属だけで作られたヘッドにく
らベヘッドの重量が軽くでき、ヘッド移動のためのエネ
ルギ、駆動モータなども有利となる。Furthermore, the weight of the head can be reduced compared to a head made only of photosensitive glass or metal, and the energy and drive motor for moving the head are also advantageous.
またヘッド基板を簿くできるためノズル前面の巾Wが小
さくなりインクのたまりが少なくなってインク射出の安
定性が増加する。特に補強板として金属板のようにイン
クのぬれ性の良い材料を使えば、プラスチックのノズル
前面のインクは補強板に引張られてたまることが少なく
なる。特に第2図の実施例のように、ノズル前面9から
下げた位置に補強板7を設ければノズル前面夕、のイ′
ンク10はインク8のように補強板7に引張られ、さら
に効果が大きい。たとえば第2図の実施例で左右両面の
インクの色が赤と黒である場合も赤と黒のインクの混色
が少な・くなる。Furthermore, since the head substrate can be made smaller, the width W of the front surface of the nozzle is reduced, the amount of ink accumulated is reduced, and the stability of ink ejection is increased. In particular, if a material with good ink wettability, such as a metal plate, is used as the reinforcing plate, the ink on the front surface of the plastic nozzle will be less likely to be pulled by the reinforcing plate and accumulate. In particular, if the reinforcing plate 7 is provided at a position lowered from the nozzle front surface 9 as in the embodiment shown in FIG.
The ink 10 is pulled by the reinforcing plate 7 like the ink 8, and is even more effective. For example, in the embodiment shown in FIG. 2, when the ink colors on both the left and right sides are red and black, the amount of color mixing between the red and black inks is reduced.
さらに第2図の実施例では、右と左のヘッド部品を共通
化し、圧電素子の接着面を変えているだけであるから、
射出型9組立治具等が1種類ですみ量産上のメリットが
ある。Furthermore, in the embodiment shown in FIG. 2, the right and left head parts are made common, and the only difference is the adhesive surface of the piezoelectric element.
There is an advantage in mass production that only one type of injection mold 9 assembly jig is required.
以上述べたように本発明は圧力損失の少ない薄型ヘッド
を提供できるだけでなく多くの効果を有しシリアルプリ
ンタ、ラインプリンタ、プロッタ、コピア、ファクシミ
リ等広く応用でキル。As described above, the present invention not only provides a thin head with low pressure loss, but also has many effects and can be widely applied to serial printers, line printers, plotters, copiers, facsimile machines, etc.
第1図は従来のインクジェットヘッドの断面図第2図は
本発明の実施例の断面図である。
1.1′・・・・・・ヘッド基板
2.2′・・・・・・振動板
3.3′・・・・・・圧電素子
4・・・・・・・・・・・・・・・ノズル5・・・・・
・・・・・・・・・・加圧室7・・・・・・・・・・・
・・・・補強板以 上
出願人 信州精器株式会社
株式会社趣訪精工舎
代理人 弁理士 最上 務FIG. 1 is a sectional view of a conventional inkjet head, and FIG. 2 is a sectional view of an embodiment of the present invention. 1.1'... Head board 2.2'... Vibration plate 3.3'... Piezoelectric element 4... ...Nozzle 5...
・・・・・・・・・Pressurization chamber 7・・・・・・・・・・・・
...Reinforcement plate and above Applicant Shinshu Seiki Co., Ltd. Shuwa Seikosha Co., Ltd. Agent Patent attorney Tsutomu Mogami
Claims (1)
弾性率の低い第1の基板(1)と、前記一方の面に積層
される第1の基板(1)と同材質の振動板(2)と、振
動板(2)上に更に積層され前記圧力室の対向位置に配
された圧電素子(3)と、第1の基板(1)と同材質の
第2の基板(1′)と、第2の基板(1′)と積層され
一方の面にインク供給路、圧力室、ノズル等を形成した
第2の基板(1′)と同材質の振動板(2′)と、振動
板(2′)の他方の面に積層され圧力室の対向位置に配
された圧電素子(3′)と、第1の基板(1)と第2の
基板(1′)の間に密着されノズル端面(9)より内方
に端面を有する高弾性率の材質から成る補強板(7)か
ら構成されることを特徴とする積層インクジェットヘッ
ド。A first substrate (1) with a low elastic modulus on which ink supply channels, pressure chambers, nozzles, etc. are formed on one surface, and a diaphragm made of the same material as the first substrate (1) laminated on the one surface. (2), a piezoelectric element (3) further laminated on the diaphragm (2) and placed opposite the pressure chamber, and a second substrate (1') made of the same material as the first substrate (1). ), a diaphragm (2') made of the same material as the second substrate (1'), which is laminated with the second substrate (1') and has an ink supply path, a pressure chamber, a nozzle, etc. formed on one surface thereof; A piezoelectric element (3') laminated on the other side of the diaphragm (2') and placed opposite the pressure chamber is tightly attached between the first substrate (1) and the second substrate (1'). A laminated inkjet head comprising a reinforcing plate (7) made of a material with a high elastic modulus and having an end face inward from a nozzle end face (9).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5932682A JPS58175667A (en) | 1982-04-09 | 1982-04-09 | Laminated ink jet head |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5932682A JPS58175667A (en) | 1982-04-09 | 1982-04-09 | Laminated ink jet head |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS58175667A true JPS58175667A (en) | 1983-10-14 |
JPH0372464B2 JPH0372464B2 (en) | 1991-11-18 |
Family
ID=13110111
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5932682A Granted JPS58175667A (en) | 1982-04-09 | 1982-04-09 | Laminated ink jet head |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58175667A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6122956A (en) * | 1984-07-10 | 1986-01-31 | Fujitsu Ltd | Ink jet head |
JPH0577416A (en) * | 1991-09-20 | 1993-03-30 | Seikosha Co Ltd | Ink jet head |
EP1164015A1 (en) * | 2000-06-12 | 2001-12-19 | Seiko Epson Corporation | Ink jet type recording head |
-
1982
- 1982-04-09 JP JP5932682A patent/JPS58175667A/en active Granted
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6122956A (en) * | 1984-07-10 | 1986-01-31 | Fujitsu Ltd | Ink jet head |
JPH0341073B2 (en) * | 1984-07-10 | 1991-06-20 | ||
JPH0577416A (en) * | 1991-09-20 | 1993-03-30 | Seikosha Co Ltd | Ink jet head |
EP1164015A1 (en) * | 2000-06-12 | 2001-12-19 | Seiko Epson Corporation | Ink jet type recording head |
US6547373B2 (en) | 2000-06-12 | 2003-04-15 | Seiko Epson Corporation | Ink jet type recording head |
US7153459B2 (en) | 2000-06-12 | 2006-12-26 | Seiko Epson Corporation | Method of manufacturing an ink jet type recording head |
Also Published As
Publication number | Publication date |
---|---|
JPH0372464B2 (en) | 1991-11-18 |
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