JPS58173229U - Resin-sealed electronic components - Google Patents
Resin-sealed electronic componentsInfo
- Publication number
- JPS58173229U JPS58173229U JP6919682U JP6919682U JPS58173229U JP S58173229 U JPS58173229 U JP S58173229U JP 6919682 U JP6919682 U JP 6919682U JP 6919682 U JP6919682 U JP 6919682U JP S58173229 U JPS58173229 U JP S58173229U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- electronic components
- sealed electronic
- electronic component
- abstract
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
本図は本考案による電子部品の断面図を示す。
１・・・・・・電子部品素子、２・・・・・・電子部品
素子から導出したリード、３・・・・・・リード端子、
４・・・・・・リード端子突出部、５・・・・・・金属
ケース、６・・・・・・封口樹脂、７・・・・・・半田
層、訃・・・・・リード２とリード端子３の接続部。This figure shows a cross-sectional view of an electronic component according to the present invention. 1...Electronic component element, 2...Lead derived from the electronic component element, 3...Lead terminal,
4... Lead terminal protrusion, 5... Metal case, 6... Sealing resin, 7... Solder layer, End... Lead 2 and the connection part of lead terminal 3.
Claims (1)
ド端子のケース内に樹脂で埋設した部分に板状の突出部
を設けたことを特徴とする電子部品。An electronic component characterized in that a plate-shaped protrusion is provided in a resin-embedded part of an external lead terminal connected to a lead led out from an electronic component element in a case.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6919682U JPS58173229U (en) | 1982-05-12 | 1982-05-12 | Resin-sealed electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6919682U JPS58173229U (en) | 1982-05-12 | 1982-05-12 | Resin-sealed electronic components |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58173229U true JPS58173229U (en) | 1983-11-19 |
Family
ID=30078933
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6919682U Pending JPS58173229U (en) | 1982-05-12 | 1982-05-12 | Resin-sealed electronic components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58173229U (en) |
-
1982
- 1982-05-12 JP JP6919682U patent/JPS58173229U/en active Pending
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