JPS58171315U - 樹脂モ−ルド装置 - Google Patents
樹脂モ−ルド装置Info
- Publication number
- JPS58171315U JPS58171315U JP6884282U JP6884282U JPS58171315U JP S58171315 U JPS58171315 U JP S58171315U JP 6884282 U JP6884282 U JP 6884282U JP 6884282 U JP6884282 U JP 6884282U JP S58171315 U JPS58171315 U JP S58171315U
- Authority
- JP
- Japan
- Prior art keywords
- resin mold
- mold equipment
- mold
- equipment
- upper mold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 title claims description 4
- 229920005989 resin Polymers 0.000 title claims description 4
- 238000000034 method Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6884282U JPS58171315U (ja) | 1982-05-11 | 1982-05-11 | 樹脂モ−ルド装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6884282U JPS58171315U (ja) | 1982-05-11 | 1982-05-11 | 樹脂モ−ルド装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58171315U true JPS58171315U (ja) | 1983-11-16 |
| JPH036408Y2 JPH036408Y2 (enExample) | 1991-02-19 |
Family
ID=30078593
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6884282U Granted JPS58171315U (ja) | 1982-05-11 | 1982-05-11 | 樹脂モ−ルド装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58171315U (enExample) |
-
1982
- 1982-05-11 JP JP6884282U patent/JPS58171315U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH036408Y2 (enExample) | 1991-02-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS58171315U (ja) | 樹脂モ−ルド装置 | |
| JPS5874341U (ja) | 半導体装置の樹脂モ−ルド装置 | |
| JPS5975023U (ja) | 樹脂モ−ルド装置 | |
| JPS5943009U (ja) | 異方導電接着性構造体 | |
| JPS5823245U (ja) | 二つ割合せ模型 | |
| JPS599537U (ja) | 半導体装置の樹脂モ−ルド装置 | |
| JPS6142380U (ja) | 流体浮上装置 | |
| JPS5876715U (ja) | 樹脂モ−ルド装置 | |
| JPS6125122U (ja) | 樹脂モ−ルド装置 | |
| JPS5950708U (ja) | 発泡体成形用型 | |
| JPS6046216U (ja) | 樹脂モ−ルド装置 | |
| JPS6046642U (ja) | 封止バルブの成形装置 | |
| JPS59155130U (ja) | 成形型 | |
| JPS58128795U (ja) | 粉末成形用粉箱 | |
| JPS5958939U (ja) | 電子部品の樹脂モ−ルド装置 | |
| JPS6130255U (ja) | リ−ドフレ−ム | |
| JPS60179737U (ja) | 板材とゴム成型物で構成される床材 | |
| JPS5896919U (ja) | プレス | |
| JPS5899016U (ja) | 注型装置 | |
| JPS5872017U (ja) | 低圧成形用型 | |
| JPS58166034U (ja) | 半導体製造装置 | |
| JPS59117142U (ja) | タブレツト成形装置 | |
| JPS59190443U (ja) | 加熱冷却型 | |
| JPS5880696U (ja) | グリ−スポンプ用ノズル | |
| JPS5849719U (ja) | 包装装置 |