JPS58169917A - Monitor for automatic wire bonder - Google Patents

Abstract

PURPOSE:To permit the state of all wire bondings to be collectively visually observed in the form of a static picture by a monitor wherein a static picture for each wire bonding is projected on one of divided display areas of a monitor TV. CONSTITUTION:An image pick-up signal Sv from a TV camera 18 is once stored in a memory circuit 21. When stored in the circuit 21, the writing address of the circuit 21 is switched by a control circuit 22, thereby to vary the memory area for each wire bonding. The image pick-up signal stored in the circuit 21 is transmitted to a monitor TV23 as an image signal St. The TV23 has its entire display screen which has been previously divided into regions corresponding to a group of respective divided display areas. Each divided display area (a), (b), (c)... receives the signal St for every bonding and then projects the corresponding static picture. By so doing, the operator can collectively visually observe the state of all wire bondings in the form of a static picture within a time period before the next semiconductor chip will be supplied.

Description

DETAILED DESCRIPTION OF THE INVENTION (1) The present invention relates to a monitoring device that cooperates with an automatic wire bonder.

(2) Background of the technology - A huge variety and number of semiconductor integrated circuits are being produced. For this reason, automation of production lines is essential. Among this production line, the present invention mainly refers to wire bonding. This wire bonding is automatically carried out by the wire bonder, and the pads on the semiconductor chip and the corresponding leads are automatically connected by metal wires via the capillaries that form part of the wire bonding.

This is sequentially performed at high speed for each pad and each lead paired therewith.

The gold #14 edge is connected to the pad by eutectic phenomenon, and is connected to the lead by pressure bonding. In this case, mainly to eliminate slight variations in the connection between the pad and the metal wire, a monitoring device is required to observe the wire bonding state. .

(3) Prior Art and Problems In the conventional monitoring device, the pads and metal wires on the semiconductor chip are observed using a TV camera adjacent to the wire bonder or a wI microcaster. This is done by the watchman, but in recent years, the I# waiting time is no longer given. In such a state, it is no longer possible to perform highly accurate observation, and the emergence of a monitoring device that can solve this problem has been awaited.

□ (4) Purpose of the Invention' Therefore, the purpose of the present invention is to propose a monitoring device for an automatic wire bonder that can solve the above-mentioned problems.

A monitor television camera is installed, the image signal from the monitor television camera is temporarily stored for each wire bonding, and still images of each wire bonding are displayed on the divided display areas of the monitor television. It is characterized by the fact that all the wire bonding conditions are simultaneously displayed on the display screen of the TV screen, and the monitor can then monitor the time in the trench where the semiconductor chips are being supplied. The state of all wire bonding can be visually observed at once using a still image.

(6) Embodiments of the Invention Fig. 1 is a perspective view showing a part of an automatic wire bonder and a monitoring device according to the present invention. A number of pads 12 are provided on the top, and each of these pads 12 is wire-bonded to a corresponding board 13.
The leads 13 are integrated with external terminals 13' that protrude from the semiconductor package 14 to the outside. ζThe wire bonding mentioned above is performed by a metal wire 15 made of, for example, Au. However, for convenience of explanation, the above-mentioned components are shown sufficiently enlarged compared to the drawings. Furthermore, for the sake of simplicity, only nine pairs of pads and leads are shown.The wire bonding is performed by an automatic wire bonder 16, which itself is well known. Among these, the capillary 17 is particularly relevant to the present invention, and each pad 12 and each lead 13 are sequentially brought into contact with each other while supplying, for example, Au@, and the metal wire 15 is wired between them. Note that the automatic wire bonder uses capillary 1
7 can be freely moved three-dimensionally. Further, the semiconductor package 14 is carried on a carrier (not shown), for example, in the direction of arrow A in the figure. When all wire bonding is completed for one semiconductor package, the next semiconductor package is transported in front of the automatic wire bonder 16, and the process continues until all wire bonding is completed.
K is fixed.

Particularly noteworthy during the 1st v.
Hereinafter, it is also simply referred to as a TV camera) 18. Its feature is that the TV camera 918 is linked to the automatic wire bonder 16V' and can always take images directly below the capillary 17 by setting it in advance. 1
8Fi, the imaging is performed directly below it fT5°.Generally, immediately after wire bonding, the capillary 17 moves upward, so one pad that has just been bonded and one metal connected to it. A complete view of the line can be captured. . As mentioned above, in the past, the top surface of a semiconductor chip was observed using a set of nine fixed monitor television cameras installed separately adjacent to each other. If only one pair of lines can be observed, then it becomes K.

The present invention provides a television camera 18 having the above-mentioned 41111k.
The 6 images of imaging signals from the 6 images are further processed as follows. Figure 2 is the original W! FIG. 1 is a block diagram showing the basic configuration of a monitor device related to AK. The image signal S from the television camera 18 is sent to the memory circuit 2! It was once suspended. Imaging signal 8
Since each wire honting has 04 & Bird Island 1 lead C @ (1 full length Lt), the memory circuit 2
1, the memory area is changed for each wire bonding at the time of storage. The control circuit 22 performs write address switching.

The image signal stored in the memory circuit 21 is transmitted to the monitor television 23 as a video signal St. This monitor television 23 is a normal television, but the entire display surface is divided in advance into areas corresponding to groups of divided display areas (
(Division indicated by the dotted line in the figure). Each divided display area crow, b, c
... receives the video signal for each wire bonding, and displays a corresponding still image. This control is also performed by the control circuit 22.

(1), (b), and (C) of FIG. 3 are plan views showing examples of still images in arbitrary divided display areas a, b, and CK in the monitor television 23 of FIG. Each wire bonding state of the pair of metal wire 12 and metal wire 15 is shown. A portion 31 between the pad 12 and the metal wire 15 is a portion where the melted Au wire has solidified.
By observing this shape, it is possible to judge whether the wire bonding is good or bad. A portion 320 is a wiring level on the chip. In the case of (a), the part 31 is not large enough. In the case of (b), the spread of the part 310 is good, but the position of the metal wire 15 is eccentric, and the inside is dyed. It becomes defective. Embodiment (C) is ideal.

In any case, according to the above-mentioned monitor device, the object for each wire bonding is displayed as a still image on the monitor television 23 at the same time after the completion of all the wire bonding processes, so that the observer can The entire package can be carefully observed within the time it takes for the semiconductor package to be delivered.

FIG. 4 is a block diagram showing an example in which the principle configuration of FIG. 2 is further embodied.
The signal from the driver circuit 41 becomes an amplified imaging signal S. The image pickup signal 8vti7 is turned into digital data by an analog/digital (MU/D) converter 42 and stored in a memory circuit (frame memory) 21. However, the series of processing up to this store is not always performed, but is performed individually at each imaging time. This is done by the imaging timing instruction circuit 22.
-1. The circuit 22 communicates with a host combinator (CPU) 40 via an IFi interface. On the other hand, the host combination island-Yu 40 is an automatic wire bonder '16.
Since the series of movements shown in FIG. 1 are commanded, the imaging timing can be determined from this command. In other words, capillary 17 (
Immediately after the wire bonding, a command to pull the wire upward (FIG. 1) is outputted, which is the imaging timing.

When storing the digitized image signal S in the memory circuit 21, the memory area is changed for each wire bonding.
It is done in 2-2. The host combinator 40 provides the automatic wire bonder 16 with lc? Since pads that are to be subjected to T5 wire bonding are specified one after another, address switching can be performed for each instruction.

The data in the memory circuit 21 for each wire bonding is given to the monitor television 23 as a scissors signal @8t.
The position of each still image is determined by each of the divided display areas (a, b
, c...).

A display area designation circuit 22-3 is provided for the display area.

Differently, in the memory circuit 21, a frame memory 21- is used to temporarily record one frame of the image of the input bust.
1 and the image data of a predetermined area in the frame memory 21-1 are sequentially transferred to an area 21 corresponding to the division display area on the video 8M (random access memory) 21-2.
-3 can be used.

[Brief explanation of the drawing]

Fig. 1 is a perspective view showing a part of the company's automatic wire bonder and a monitor device according to the present invention, Fig. 2 is a block diagram showing the basic configuration of the monitor device according to the present invention, (a) of #13WJ
, (b) and (C) #2nd WJ (D model = fif Rev 23, Fig. 4)
The figure further embodies the principle configuration of FIG. 2. - is a block diagram illustrating an example; 11... Semiconductor chip, 12... Pad, 1
3...Lead, 15...Metal wire, 1
6...Automatic wire bonder, 17...Capillary, 1
8... Monitor TV camera, 21... Memory path, 23... Monitor TV, a, b, c... Divided display area. Patent originator Fujitsu Ltd. Patent application agent Akira Aoki Patent attorney Kazuyuki Nishidate Patent attorney Yuki Ell Male patent attorney Akiyuki Yamaguchi

Claims (1)

[Claims] 1. Connect the +*vI pad formed on the semiconductor chip and each lead corresponding to each skeleton pad through a capillary,
cooperate with automatic wire bonder to connect by metal 11;
In the monitor equipment for observing the state of the wire bonding between the pad and the metal wire, there is a monitor television camera that works in conjunction with the automatic wire bonder to always take pictures directly under the capillary, and a monitor that is connected to the capillary for 9 years. a memory circuit that stores an image signal from the monitor television camera that captures a panoramic view of each of the pads and the metal wires corresponding to the pads immediately after bonding, changing the meridian area for each wire bonding; a monitor television that uses the imaging signal stored in a memory circuit as a video signal and displays still images corresponding to display areas divided corresponding to each of the nine ear bondings, the display panel of the monitor television; An automatic wire monitor device that is designed to simultaneously observe the status of all wire bondings displayed while standing still.